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ST72F325J4TCE

STMicroelectronics

ST72F325J4TCE by STMicroelectronics

ST72F325J4TCE by STMicroelectronics is an 8-bit microcontroller with a clock frequency of 16MHz, suitable for automotive applications. It features 32 I/O lines, PWM channels, and ADC channels, operating in a temperature range from -40 to 125 °C. The package style is flatpack with low profile design and Gull Wing terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,647 parts In-Stock

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Digiode

USA . 1,414 parts In-Stock

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Anansix

USA . 687 parts In-Stock

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687

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Distributors (Availability)

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Microchip USA

USA . 344 parts In-Stock

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$7.688

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344

$7.688

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AZTECH Wire

Italy . 803 parts In-Stock

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$17.920

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803

$17.920

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IDEA Electronic Components Group

UK . 963 parts In-Stock

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$27.146

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$24.432

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963

$27.146

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$24.432

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MKK Technologies

India . 2,324 parts In-Stock

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$51.047

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2,324

$51.047

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DigiPath Technology Company

USA . 2,324 parts In-Stock

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$51.047

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2,324

$51.047

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QUARKTWIN TECHNOLOGY LTD

USA . 20,081 parts In-Stock

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Vigor

Singapore . 4,403 parts In-Stock

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Corphita

USA . 1,317 parts In-Stock

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Parana Technologies

USA . 188 parts In-Stock

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$32.458

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$32.458

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Overview

Unlock endless possibilities with the ST72F325J4TCE microcontroller from STMicroelectronics. As a leader in the industry, STMicroelectronics ensures top-notch quality and reliability in all their products. Ideal for various applications, this microcontroller offers unmatched value with its high performance and efficiency. Designed for automotive use, this microcontroller boasts advanced features such as PWM channels, ADC channels, and ROM programmability. Experience seamless integration and superior functionality with the ST72F325J4TCE microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good durability and reliability for long-term use.

Surface Mount: YES

Surface mount technology allows for easy PCB assembly and compact design.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, increasing compatibility with various systems.

Package Shape: SQUARE

Square package shape helps optimize space on the PCB layout.

Bit Size: 8

8-bit processing capability is suitable for a wide range of applications.

No. of Terminals: 44

Provides ample I/O options for interfacing with external devices.

Package Style: FLATPACK, LOW PROFILE

Low profile package style helps in achieving a compact overall design.

Minimum Supply Voltage: 4.5 V

Low minimum supply voltage requirement helps in power efficiency.

Maximum Operating Temperature: 125 °C

High operating temperature range makes it suitable for extreme environments.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for use in cold environments.

ADC Channels: YES

Analog-to-digital converter channels enable interfacing with analog sensors.

Terminal Position: QUAD

Quad terminal position allows for easier soldering and PCB assembly.

Maximum Seated Height: 1.6 mm

Low seated height helps in achieving a slim profile design.

Width: 10 mm

Compact width dimension helps in space-constrained designs.

Maximum Clock Frequency: 16 MHz

High clock frequency enables fast processing speed.

Length: 10 mm

Compact length dimension helps in space optimization on the PCB.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature range ensures reliability in automotive applications.

Peripheral IC Type: MICROCONTROLLER

Microcontroller architecture provides versatility for various embedded applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and rework.

Nominal Supply Voltage: 5 V

Standard 5V supply voltage simplifies interfacing with other components.

PWM Channels: YES

Pulse-width modulation channels allow for precise control of output signals.

ROM Programmability: FLASH

Flash ROM programmability enables easy firmware updates and reprogramming.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for high-density PCB layout and miniaturization.

Speed: 8 rpm

Operates at a speed of 8 revolutions per minute.

No. of I/O Lines: 32

Offers a sufficient number of input/output lines for versatile connectivity.

Technical Specifications

Microcontrollers ST72F325J4TCE attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G44

Length:

10 mm

No. of I/O Lines:

32

No. of Terminals:

44

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Trade Compliance

ST72F325J4TCE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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