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ST72F325J4T6

STMicroelectronics

ST72F325J4T6 by STMicroelectronics

ST72F325J4T6 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, operating b/w -40 °C and 85 °C. It supports up to 32 I/O lines and includes ADC channels for versatile applications. Ideal for industrial control systems, it operates on a supply voltage of 3.8V to 5.5V.

Median Price

$2.811

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 959 parts In-Stock

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$2.402

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959

$2.402

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Chip1Stop

Japan . 959 parts In-Stock

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$3.220

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959

$3.220

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Verical

USA . 959 parts In-Stock

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959

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Digiode

USA . 4,339 parts In-Stock

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$2.256

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4,339

$2.256

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Vyrian

USA . 4,967 parts In-Stock

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4,967

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Anansix

USA . 1,398 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,433 parts In-Stock

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$2.138

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2,433

$2.138

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Microchip USA

USA . 107 parts In-Stock

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$4.947

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107

$4.947

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AZTECH Wire

Italy . 386 parts In-Stock

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$16.070

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386

$16.070

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IDEA Electronic Components Group

UK . 2,256 parts In-Stock

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$39.451

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$35.506

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$39.451

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$35.506

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MKK Technologies

India . 96 parts In-Stock

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$74.186

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$74.186

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DigiPath Technology Company

USA . 96 parts In-Stock

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$74.186

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96

$74.186

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QUARKTWIN TECHNOLOGY LTD

USA . 11,977 parts In-Stock

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Perfect Parts

USA . 1,746 parts In-Stock

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Vigor

Singapore . 1,651 parts In-Stock

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Parana Technologies

USA . 1,326 parts In-Stock

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$47.170

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Assy Fe

Spain . 480 parts In-Stock

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Eliminating Global Boundries, Inc

USA . 20 parts In-Stock

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Overview

Unlock the potential of your next project with the ST72F325J4T6 microcontroller from STMicroelectronics! Renowned for its exceptional quality and reliability, this 8-bit powerhouse is designed for a wide range of applications—from industrial automation to consumer electronics. With features like low power consumption, robust performance in extreme temperatures, and versatile I/O options, it streamlines development and enhances efficiency, ensuring you stay ahead in today's competitive landscape. Elevate your designs effortlessly with STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy material ensures reliable protection against environmental factors.

Surface Mount: YES

Surface mount capability allows for efficient use of PCB space and is ideal for automated assembly.

Maximum Supply Voltage: 5.5 V

Supports a relatively wide voltage range, enabling flexibility in various application designs.

Package Shape: SQUARE

Square package shape allows for uniform mounting in tight spaces, optimizing layout on PCB.

Bit Size: 8

8-bit architecture is suitable for simple control applications, making it easy to handle and process data.

No. of Terminals: 44

A high number of terminals provides ample connectivity options for integrating various peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE

Low profile design reduces the overall height of the assembly, making it suitable for compact devices.

Minimum Supply Voltage: 3.8 V

Lower minimum voltage requirement allows operation in battery-powered and low-power applications.

Maximum Operating Temperature: 85 °C

High temperature tolerance ensures reliable performance in demanding industrial environments.

CPU Family: ST72

Part of a proven family of microcontrollers, offering reliability and extensive support.

No. of External Interrupts: 9

Multiple external interrupts enhance the device's ability to respond quickly to external events.

Minimum Operating Temperature: -40 °C

Low temperature operation makes this microcontroller suitable for harsh environmental applications.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and reduces the risk of corrosion over time.

ADC Channels: YES

On-chip ADC allows for direct signal processing, simplifying design and reducing component count.

Terminal Position: QUAD

Quad terminal position facilitates easier soldering and better connectivity in compact designs.

ROM Words: 16384

Sufficient ROM size accommodates complex applications and allows for more extensive program storage.

Maximum Seated Height: 1.6 mm

Low seated height supports designs where space is critical and requires low-profile components.

Width: 10 mm

Compact width allows for efficient use of PCB real estate.

Maximum Clock Frequency: 16 MHz

Moderate clock speed provides a good balance between performance and power consumption.

Maximum Time At Peak Reflow Temperature (s): 30

Compatible with standard soldering processes, ensuring reliable assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance allows for compatibility with various soldering techniques.

Length: 10 mm

Compact length aids in space-saving designs and enhances product versatility.

Temperature Grade: INDUSTRIAL

Industrial temperature grade guarantees robust operation in severe conditions.

Peripheral IC Type: MICROCONTROLLER

Microcontroller type provides a versatile solution for embedded applications.

RAM Bytes: 512

Adequate RAM capacity supports multitasking and efficient data handling for embedded systems.

Technology: CMOS

CMOS technology ensures low power consumption while maintaining high performance.

Terminal Form: GULL WING

Gull wing terminals provide a stable connection and are easy to solder onto PCBs.

Maximum Supply Current: 15 mA

Low maximum supply current enhances energy efficiency, making it suitable for battery-operated devices.

Nominal Supply Voltage: 5 V

Standard nominal voltage makes integration easier with existing power supplies.

PWM Channels: YES

PWM capability enables precise control of motors and other devices, enhancing application versatility.

ROM Programmability: FLASH

Flash ROM allows for easy program updates and modifications, improving product lifecycle management.

Terminal Pitch: 0.8 mm

Tighter terminal pitch supports denser designs while maintaining manufacturability.

Format: FIXED POINT

Fixed-point format is efficient for performance-focused applications with predictable numeric requirements.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level ensures suitability for general manufacturing processes.

Speed: 8 rpm

Low-speed operation is ideal for applications requiring precise motion control without overshoot.

Low Power Mode: YES

Low power mode enhances energy savings in applications where power conservation is crucial.

On Chip Program ROM Width: 8

8-bit ROM width simplifies complexity in program design, making it accessible for a variety of developers.

No. of I/O Lines: 32

A rich set of I/O lines allows for versatile interfacing with external devices and sensors.

Technical Specifications

Microcontrollers ST72F325J4T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

9

No. of I/O Lines:

32

No. of Terminals:

44

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

ST72F325J4T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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