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ST72F324LK6T6

STMicroelectronics

ST72F324LK6T6 by STMicroelectronics

ST72F324LK6T6 microcontroller from STMicroelectronics features an 8-bit CPU, operates at a max voltage of 3.6V, and includes 8 ADC channels. With a compact flatpack design and industrial temperature grade, it's ideal for embedded applications. Its low power consumption and versatile connectivity options enhance performance in various projects.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,837 parts In-Stock

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Digiode

USA . 3,987 parts In-Stock

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Bristol Electronics

USA . 2,864 parts In-Stock

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Anansix

USA . 1,516 parts In-Stock

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1,516

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ComSIT Distribution GmbH

Germany . 209 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 189 parts In-Stock

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$8.748

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189

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AZTECH Wire

Italy . 342 parts In-Stock

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$15.490

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342

$15.490

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IDEA Electronic Components Group

UK . 1,756 parts In-Stock

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$70.752

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$63.677

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$70.752

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$63.677

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Component Stockers USA

USA . 248 parts In-Stock

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$99.990

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MKK Technologies

India . 496 parts In-Stock

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$133.044

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496

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DigiPath Technology Company

USA . 496 parts In-Stock

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$133.044

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496

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QUARKTWIN TECHNOLOGY LTD

USA . 22,825 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Vigor

Singapore . 3,436 parts In-Stock

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Corphita

USA . 3,211 parts In-Stock

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Parana Technologies

USA . 1,927 parts In-Stock

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$84.594

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Perfect Parts

USA . 538 parts In-Stock

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A-Z Elektronik GmbH

Germany . 441 parts In-Stock

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441

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Overview

Unlock your projects' full potential with the ST72F324LK6T6 microcontroller from STMicroelectronics. Renowned for its reliability and innovation, STMicroelectronics delivers cutting-edge solutions that enhance performance across diverse applications—from industrial automation to consumer electronics. This robust 8-bit MCU offers low power consumption and advanced features, ensuring seamless integration and efficient operation. Elevate your designs with quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures longevity and robustness in various operating conditions.

Surface Mount: YES

Allows for compact designs and is ideal for modern automated manufacturing processes.

Maximum Supply Voltage: 3.6 V

Versatile supply voltage range suitable for a variety of applications.

Package Shape: SQUARE

This shape allows for efficient space utilization on PCBs.

Bit Size: 8

8-bit architecture is ideal for handling simpler control tasks and low-power applications.

Power Supplies (V): 3/3.3

Supports common logic levels in modern electronic devices, making integration easier.

No. of Terminals: 32

Provides ample I/O for various interfacing needs in embedded applications.

Package Style (Meter): FLATPACK, LOW PROFILE

Enables a slim design, perfect for space-constrained applications.

Minimum Supply Voltage: 2.85 V

Flexible operation in lower voltage environments for extended battery life.

Maximum Operating Temperature: 85 °C

Suitable for applications exposed to higher temperatures, ensuring reliability.

CPU Family: ST72

Part of a recognized family known for performance and diverse application support.

Minimum Operating Temperature: -40 °C

Can operate in extreme conditions, making it suitable for harsh environments.

Terminal Finish: MATTE TIN

Promotes solderability and prevents oxidation for reliable connections.

ADC Channels: YES

The inclusion of ADC channels allows for effective analog signal processing.

Terminal Position: QUAD

Facilitates efficient board layout and is compatible with various mounting configurations.

ROM Words: 32768

Offers ample ROM size for a wide range of embedded applications.

Maximum Seated Height: 1.6 mm

Compact form factor enables placement in tight spaces without compromising performance.

Width: 7 mm

Standard width for ease of compatibility with existing PCB designs.

Peripherals: TIMER(4)

Multiple timers enhance timing operations in applications such as PWM control.

Maximum Clock Frequency: 16 MHz

Provides adequate processing speed for a range of applications at low power consumption.

Maximum Time At Peak Reflow Temperature (s): 30

Robust soldering capability, enhancing manufacturing efficiency.

Peak Reflow Temperature °C: 235

Suitable for standard reflow soldering processes ensuring compatibility with PCB assembly.

Length: 7 mm

Standard dimension ensuring ease of integration into various projects.

Temperature Grade: INDUSTRIAL

Designed for reliability in industrial applications where performance consistency is critical.

Peripheral IC Type: MICROCONTROLLER

Versatile component ideal for controlling devices and systems efficiently.

RAM Bytes: 1024

Provides sufficient RAM for effective data handling and operations in embedded applications.

Technology: CMOS

Low power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Facilitates easy handling and soldering during assembly.

Analog To Digital Converters: 8-Ch 10-Bit

Allows for multiple channel input signals, essential for sensor applications.

Maximum Supply Current: 7 mA

Low current consumption contributes to energy-efficient designs.

Nominal Supply Voltage: 3 V

An ideal operating voltage for many standard applications in consumer electronics.

PWM Channels: YES

PWM capability enables precise control for various applications such as motor control.

Connectivity: SCI, SPI

Includes common communication protocols for easy interfacing with other devices.

ROM Programmability: FLASH

Offers flexibility in firmware updates and allows for easy reprogramming.

Terminal Pitch: 0.8 mm

Standard pitch facilitates compatibility with a range of PCB layouts.

Moisture Sensitivity Level (MSL): 3

Suitable for a variety of storage and handling conditions, making it easy to use in diverse environments.

Speed: 8 rpm

Provides adequate performance for slower, less intensive applications.

On Chip Program ROM Width: 8

Facilitates efficient data handling in a compact design.

No. of I/O Lines: 24

A high number of I/O lines enables versatile interfacing options for various peripherals.

Technical Specifications

Microcontrollers ST72F324LK6T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

24

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

7 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.85 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SCI, SPI

Peripherals:

TIMER(4)

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

ST72F324LK6T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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