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ST72F324LJ2T6

STMicroelectronics

ST72F324LJ2T6 by STMicroelectronics

ST72F324LJ2T6 microcontroller from STMicroelectronics features a 16 MHz CPU, 8-bit architecture, and operates b/w -40 °C to 85 °C. With 8192 ROM words and 384 RAM bytes, it’s ideal for industrial applications requiring reliable performance. Its low-profile design supports various connectivity options like SCI and SPI.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,046 parts In-Stock

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2,046

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Digiode

USA . 263 parts In-Stock

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263

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Anansix

USA . 167 parts In-Stock

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167

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Distributors (Availability)

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Microchip USA

USA . 117 parts In-Stock

1+ parts

$4.308

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117

$4.308

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AZTECH Wire

Italy . 1,111 parts In-Stock

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$18.150

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1,111

$18.150

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IDEA Electronic Components Group

UK . 1,951 parts In-Stock

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$33.997

100+ parts

-

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$30.597

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1,951

$33.997

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$30.597

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MKK Technologies

India . 255 parts In-Stock

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$63.929

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255

$63.929

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DigiPath Technology Company

USA . 255 parts In-Stock

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$63.929

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255

$63.929

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Component Stockers USA

USA . 346 parts In-Stock

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$99.990

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346

$99.990

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A-Z Elektronik GmbH

Germany . 5,960 parts In-Stock

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5,960

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Corphita

USA . 4,291 parts In-Stock

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Vigor

Singapore . 2,854 parts In-Stock

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2,854

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Parana Technologies

USA . 830 parts In-Stock

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$40.648

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830

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$40.648

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Overview

Unlock limitless possibilities with the ST72F324LJ2T6 microcontroller by STMicroelectronics. Renowned for its unparalleled quality and reliability, this cutting-edge device is ideal for a range of applications, from industrial automation to consumer electronics. Experience enhanced performance with low power consumption and a compact design that fits seamlessly into your projects. Elevate your innovations and gain a competitive edge with this versatile solution that drives efficiency and creativity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures reliability in various environments.

Surface Mount: YES

Surface mount technology allows for efficient use of PCB space, making it ideal for compact designs.

Maximum Supply Voltage: 3.6 V

Compatible with a wide range of power supply systems, enhancing versatility in applications.

Package Shape: SQUARE

Square shape aids in precise placement and uniform heat distribution during soldering.

Bit Size: 8

An 8-bit architecture is simple and cost-effective for applications that don't require high processing power.

Power Supplies (V): 3/3.3

Dual voltage supply options increase flexibility for designers in different applications.

No. of Terminals: 44

A high number of terminals allows for more I/O options, increasing functionality for complex tasks.

Package Style (Meter): FLATPACK, LOW PROFILE

Low-profile design is perfect for space-constrained applications, contributing to compact device designs.

Minimum Supply Voltage: 2.85 V

Wide operating voltage range makes it suitable for battery-operated devices.

Maximum Operating Temperature: 85 °C

High-temperature tolerance ensures reliable operation in industrial environments.

CPU Family: ST72

Part of a well-known family, offering robust performance and reliability for various applications.

Minimum Operating Temperature: -40 °C

Excellent low-temperature performance makes it suitable for harsh environmental conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and reduces oxidation for longer shelf life.

ADC Channels: YES

Integrated ADC channels facilitate easier implementation of analog signal processing.

Terminal Position: QUAD

Quad terminal position improves the robustness of connections and enhances board layout.

ROM Words: 8192

Sufficient on-chip ROM allows for storage of essential programs, suitable for more complex applications.

Maximum Seated Height: 1.6 mm

Compact height supports designs where space and weight are critical factors.

Width: 10 mm

Standard width makes it compatible with many existing designs and layouts.

Peripherals: TIMER(4)

Multiple timer peripherals allow for precise timing functionalities essential for real-time applications.

Maximum Clock Frequency: 16 MHz

16 MHz clock speed enables efficient processing for general control applications.

Maximum Time At Peak Reflow Temperature: 30 s

30-second peak reflow time during assembly ensures safe soldering without damaging components.

Peak Reflow Temperature: 260

A high reflow temperature tolerance allows for compatibility with modern soldering techniques.

Length: 10 mm

Standard dimensions lend adaptability in a variety of electronic designs.

Temperature Grade: INDUSTRIAL

Rated for industrial applications, indicating durability and reliability in challenging conditions.

Peripheral IC Type: MICROCONTROLLER

Microcontroller designation signifies versatility for a wide array of applications from simple to complex.

RAM Bytes: 384

Adequate RAM memory supports various tasks, enabling efficient data handling and execution.

Technology: CMOS

CMOS technology ensures low power consumption, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull-wing terminals provide excellent solder joint reliability, ensuring long-lasting connections.

Analog To Digital Converters: 12-Ch 10-Bit

With 12 channels and 10-bit resolution, it allows precise conversion of analog signals for digital processing.

Maximum Supply Current: 7 mA

Low supply current enhances energy efficiency, making it suitable for portable applications.

Nominal Supply Voltage: 3 V

Stable nominal voltage allows for consistent performance across various applications.

PWM Channels: YES

Presence of PWM channels facilitates control of motors and other devices needing adjustable power.

Connectivity: SCI, SPI

Multiple connectivity options enable easy integration into diverse communication architectures.

ROM Programmability: FLASH

FLASH programmability allows for easy updates and customization of firmware without replacing chips.

Terminal Pitch: 0.8 mm

A standard terminal pitch ensures compatibility with various PCB designs and manufacturing processes.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates reasonable handling precautions during PCB assembly, ensuring reliability.

Speed: 8 rpm

The specified speed makes it suitable for low-speed applications, such as sensors and control units.

On Chip Program ROM Width: 8

8-bit program ROM width is efficient for applications that need basic control logic.

No. of I/O Lines: 32

A high number of I/O lines supports complex operations and device interfacing, enhancing application range.

Technical Specifications

Microcontrollers ST72F324LJ2T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

32

No. of Terminals:

44

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

7 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.85 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SCI, SPI

Peripherals:

TIMER(4)

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

ST72F324LJ2T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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