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ST72F324K6TC

STMicroelectronics

ST72F324K6TC by STMicroelectronics

ST72F324K6TC by STMicroelectronics is an 8-bit microcontroller with 32 terminals, operating at a max clock frequency of 16 MHz. With 1024 bytes of RAM and ROM programmability, it's ideal for automotive applications due to its temperature grade and low profile package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,277 parts In-Stock

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Anansix

USA . 2,424 parts In-Stock

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Digiode

USA . 1,640 parts In-Stock

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1,640

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Chip Stock

USA . 562 parts In-Stock

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562

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Nova Conductors

Japan . 46 parts In-Stock

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46

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Distributors (Availability)

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AZTECH Wire

Italy . 856 parts In-Stock

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$5.830

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856

$5.830

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Microchip USA

USA . 468 parts In-Stock

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$7.462

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468

$7.462

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Ampacity Inc.

Singapore . 752 parts In-Stock

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$23.000

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752

$23.000

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IDEA Electronic Components Group

UK . 694 parts In-Stock

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$65.818

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$59.236

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694

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$59.236

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MKK Technologies

India . 603 parts In-Stock

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$123.766

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$123.766

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DigiPath Technology Company

USA . 603 parts In-Stock

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$123.766

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603

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Lixinc

USA . 16,221 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 4,101 parts In-Stock

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Vigor

Singapore . 3,918 parts In-Stock

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Parana Technologies

USA . 1,350 parts In-Stock

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Kepictronics

USA . 736 parts In-Stock

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RC Electronics

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Aranea Global

USA . 100 parts In-Stock

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Overview

Unlock the power of innovation with the ST72F324K6TC microcontroller from STMicroelectronics. Designed for automotive applications, this high-quality device offers unmatched performance and reliability. With 32 terminals and a maximum operating temperature of 125°C, this microcontroller is perfect for demanding environments. Benefit from its 8-bit CPU family, 32768 ROM words, and 1024 RAM bytes for seamless operation. Trust in the expertise of STMicroelectronics and revolutionize your projects with the ST72F324K6TC microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Allows for easy mounting on printed circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

Provides a wide operating range for versatility in various applications.

Package Shape: SQUARE

The square shape optimizes space utilization and allows for efficient PCB layout.

Bit Size: 8

Ideal for handling basic tasks and suitable for applications with lower processing requirements.

Power Supplies (V): 3.3

Offers low power consumption, making it suitable for battery-powered devices.

No. of Terminals: 32

Sufficient number of terminals for connecting external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE

Low profile design saves space in compact devices and enhances aesthetics.

Minimum Supply Voltage: 3.8 V

Allows for operation in low voltage conditions without compromising performance.

Maximum Operating Temperature: 125 °C

Enables reliable operation in high-temperature environments, such as automotive applications.

CPU Family: ST72

Part of a well-established CPU family known for reliability and performance.

Minimum Operating Temperature: -40 °C

Suitable for operation in extreme cold conditions, increasing the product's versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

Integrated ADC allows for analog input processing, expanding the product's functionality.

Terminal Position: QUAD

Quad positioning facilitates easy connection and PCB layout, enhancing ease of use.

ROM Words: 32768

Offers ample storage capacity for program data and enhances the product's processing capabilities.

Maximum Seated Height: 1.6 mm

Low profile design allows for compact device construction and efficient use of space.

Width: 7 mm

Compact width enables integration into densely populated PCBs without sacrificing performance.

Maximum Clock Frequency: 16 MHz

High clock frequency enables fast data processing and improves overall system performance.

Length: 7 mm

Compact length allows for space-efficient PCB layout and integration into small form factor devices.

Temperature Grade: AUTOMOTIVE

Certified for automotive use, ensuring reliability and performance in vehicle applications.

Peripheral IC Type: MICROCONTROLLER

Designed for microcontroller applications, offering diverse functions and features for various projects.

RAM Bytes: 1024

Sufficient RAM capacity for data storage and processing, enhancing the product's performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for energy-efficient devices.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical support and easy soldering for reliable connections.

Nominal Supply Voltage: 5 V

Standard supply voltage range for compatibility with a wide range of external components.

PWM Channels: YES

Integrated PWM channels enable precise control of analog signals, expanding the product's capabilities.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming of firmware, enhancing flexibility and functionality.

Terminal Pitch: 0.8 mm

Fine pitch terminals facilitate high-density PCB design and miniaturization of the device.

Speed: 8 rpm

Provides moderate processing speed suitable for a wide range of applications.

No. of I/O Lines: 24

Sufficient I/O lines for connecting external devices and interfaces, expanding the product's functionality.

Technical Specifications

Microcontrollers ST72F324K6TC attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e4

Length:

7 mm

No. of I/O Lines:

24

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

ST72F324K6TC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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