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ST72F324K6T6

STMicroelectronics

ST72F324K6T6 by STMicroelectronics

ST72F324K6T6 microcontroller from STMicroelectronics features a 16 MHz clock, operates b/w 3.8V and 5.5V, and includes 32 terminals with ADC and PWM capabilities. Its industrial-grade design supports applications in harsh environments. Ideal for embedded systems requiring reliable performance.

Median Price

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Lifecycle Status

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8

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Chip Stock

USA . 21,775 parts In-Stock

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Vyrian

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Digiode

USA . 2,406 parts In-Stock

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Anansix

USA . 1,994 parts In-Stock

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R&J Components

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ComSIT Distribution GmbH

Germany . 495 parts In-Stock

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495

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LIBRA Elektronik GmbH

Germany . 250 parts In-Stock

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LittleDiode

UK . 1 parts In-Stock

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Vigor

Singapore . 2,196 parts In-Stock

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$7.510

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AZTECH Wire

Italy . 53 parts In-Stock

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$17.370

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IDEA Electronic Components Group

UK . 1,210 parts In-Stock

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$32.884

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$29.595

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MKK Technologies

India . 1,180 parts In-Stock

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$61.835

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DigiPath Technology Company

USA . 1,180 parts In-Stock

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Futuretech Components

Singapore . 23,791 parts In-Stock

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Metaverse IC Inc.

Canada . 23,791 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Perfect Parts

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S.R.D Solutions

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Microchip USA

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Kepictronics

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A-Z Elektronik GmbH

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Corphita

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Authorized Procurement Solutions

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GreenTree Electronics

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Parana Technologies

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Infinite Electronics LLP (Excess)

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iodParts Technologies Inc.

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Overview

Unlock the potential of your projects with the ST72F324K6T6 microcontroller from STMicroelectronics! Known for its exceptional reliability and performance, this versatile 8-bit MCU brings innovation to a wide range of applications—from industrial control to consumer electronics. With low power consumption and a robust design, it ensures seamless integration and longevity. Elevate your designs with quality you can trust and enjoy the benefits of cutting-edge technology at your fingertips!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for efficient use of space and simplifies the manufacturing process, making it ideal for compact designs.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage is reasonable, ensuring compatibility with a wide range of power sources and reducing the risk of damage.

Package Shape: SQUARE

A square package shape enables easier layout and design on PCBs, enhancing usability in diverse applications.

Bit Size: 8

An 8-bit architecture is simple and cost-effective, suitable for basic processing tasks and smaller projects.

Power Supplies (V): 3.3

Operating at 3.3V ensures lower power consumption, which is crucial for battery-operated devices.

No. of Terminals: 32

With 32 terminals, this microcontroller can support a variety of peripherals and functionalities, enhancing versatility.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design allows for integration into thinner devices without sacrificing performance.

Minimum Supply Voltage: 3.8 V

A minimum supply voltage of 3.8V indicates resilience in lower voltage environments while maintaining functionality.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures ensures reliability in demanding environments like industrial settings.

CPU Family: ST72

The ST72 CPU family provides proven performance and reliability, making it a trustworthy choice for various applications.

Minimum Operating Temperature: -40 °C

Operating at -40 °C makes this microcontroller suitable for extreme environments such as automotive or outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish enhances reliability and reduces oxidation, ensuring stable connections over time.

ADC Channels: YES

The presence of ADC channels allows for easy interfacing with analog signals, making it ideal for sensor applications.

Terminal Position: QUAD

Quad terminal positioning provides stability and ease of soldering for better performance on PCBs.

ROM Words: 32768

A ROM capacity of 32,768 words enables ample storage for program code, beneficial for complex applications.

Maximum Seated Height: 1.6 mm

With a low seated height, this microcontroller fits easily into compact designs without crowding adjacent components.

Width: 7 mm

A width of 7 mm is favorable for space-constrained layouts, offering design flexibility in portable devices.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz ensures adequate processing power for typical control tasks while keeping energy consumption low.

Length: 7 mm

The 7 mm length complements the compact design, enabling integration into small-scale applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grading guarantees reliability over a wide range of conditions, suitable for robust applications.

Peripheral IC Type: MICROCONTROLLER

Designated as a microcontroller, it is well-suited for controlling various types of devices and systems.

RAM Bytes: 1024

With 1,024 bytes of RAM, it supports adequate temporary data storage for effective real-time processing.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, contributing to overall efficiency.

Terminal Form: GULL WING

Gull wing terminal form provides excellent solderability, facilitating robust connections in circuit assemblies.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V guarantees compatibility with many standard devices and systems.

PWM Channels: YES

PWM capability allows for precise control of motors and lights, expanding the range of applications.

ROM Programmability: FLASH

Flash programmability offers flexibility in application development by allowing updates and adjustments to the code.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm allows for more terminals in a compact layout, maximizing functionality without larger footprints.

Speed: 8 rpm

The speed indicates capability for controlling low-speed devices, perfect for applications like robotics and automation.

No. of I/O Lines: 24

With 24 I/O lines, this microcontroller provides substantial interface options for connecting with various components and peripherals.

Technical Specifications

Microcontrollers ST72F324K6T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e4

Length:

7 mm

No. of I/O Lines:

24

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

ST72F324K6T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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