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ST72F324BK6TCS

STMicroelectronics

ST72F324BK6TCS by STMicroelectronics

ST72F324BK6TCS microcontroller from STMicroelectronics features a 16 MHz clock, operates b/w 3-5.5 V, and includes ADC and PWM channels. Its compact 7x7 mm low-profile package is ideal for space-constrained applications. Perfect for embedded systems requiring efficient control.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,370 parts In-Stock

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6,370

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Anansix

USA . 1,677 parts In-Stock

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1,677

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ComSIT Distribution GmbH

Germany . 500 parts In-Stock

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500

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Digiode

USA . 454 parts In-Stock

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454

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 2,907 parts In-Stock

1+ parts

$7.244

100+ parts

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2,907

$7.244

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AZTECH Wire

Italy . 756 parts In-Stock

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$13.770

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756

$13.770

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IDEA Electronic Components Group

UK . 1,619 parts In-Stock

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$23.326

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$20.993

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1,619

$23.326

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$20.993

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MKK Technologies

India . 1,472 parts In-Stock

1+ parts

$43.862

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1,472

$43.862

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DigiPath Technology Company

USA . 1,472 parts In-Stock

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$43.862

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1,472

$43.862

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Authorized Procurement Solutions

USA . 9,500 parts In-Stock

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9,500

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Corphita

USA . 1,946 parts In-Stock

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1,946

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Perfect Parts

USA . 1,680 parts In-Stock

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1,680

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Parana Technologies

USA . 1,177 parts In-Stock

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$27.889

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1,177

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$27.889

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Overview

Unlock your project's potential with the ST72F324BK6TCS microcontroller from STMicroelectronics – a trusted name in innovation. This compact, high-performance solution ensures seamless integration with superior reliability for diverse applications, from industrial automation to consumer electronics. Experience enhanced efficiency and flexibility, empowering you to build smarter devices that stand out in the market. Elevate your designs today!

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for easy integration into compact electronic designs, saving PCB space and enhancing connectivity.

Maximum Supply Voltage: 5.5 V

A higher maximum supply voltage provides flexibility in power supply design and ensures compatibility with a wide range of applications.

Package Shape: SQUARE

The square package shape allows for efficient placement on printed circuit boards, contributing to high-density designs.

Bit Size: 8

An 8-bit architecture is ideal for applications requiring simplicity and cost-effectiveness, making it suitable for basic control tasks.

No. of Terminals: 32

With 32 terminals, this microcontroller can support a variety of peripherals and I/O functions, providing great flexibility for complex projects.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design contributes to lower heights, making it perfect for space-constrained applications.

Minimum Supply Voltage: 3 V

The low minimum supply voltage protects against power supply fluctuations and allows the microcontroller to operate in battery-powered applications.

ADC Channels: YES

Integrated ADC channels enable the microcontroller to process analog signals, making it suitable for applications involving sensors and feedback systems.

DMA Channels: YES

The presence of DMA channels improves data handling efficiency and reduces CPU workload, leading to faster response times in data-intensive tasks.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates efficient thermal management and soldering processes, enhancing the reliability of connections.

Width: 7 mm

A compact width allows for versatile positioning in tight spaces within a device, benefitting small-scale applications.

Maximum Clock Frequency: 16 MHz

With a max clock frequency of 16 MHz, it offers sufficient processing speed for many real-time applications, striking a balance between performance and power consumption.

Length: 7 mm

The short length further enhances its space-saving advantages, making it easy to fit into various designs and configurations.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller means it is designed for control applications, making it a perfect candidate for automation, robotics, and embedded systems.

Terminal Form: BALL

Ball terminal form provides a reliable connection with robust mechanical integrity and simplifies PCB assembly processes.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is standard for many devices, ensuring broad compatibility with existing designs and components.

PWM Channels: YES

Having PWM channels enables precise control over motors and lights, which is essential for applications in robotics and lighting.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch allows for denser packing on the PCB, optimizing the design and maintaining performance standards.

Speed: 8 rpm

A speed rating of 8 rpm indicates potential for effective control in low-speed applications, which is often critical in tasks like actuating mechanisms.

No. of I/O Lines: 24

With 24 I/O lines, it can efficiently manage multiple inputs and outputs, making it great for interfacing with various components.

Technical Specifications

Microcontrollers ST72F324BK6TCS attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

7 mm

No. of I/O Lines:

24

No. of Terminals:

32

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

8 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

ST72F324BK6TCS Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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