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ST72F324BK6TAS

STMicroelectronics

ST72F324BK6TAS by STMicroelectronics

ST72F324BK6TAS microcontroller from STMicroelectronics features a 16 MHz clock, operates b/w 3-5.5 V, and includes ADC and PWM channels. With 32 terminals in a low-profile flatpack package, it's ideal for compact applications. Its 24 I/O lines enhance versatility in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,086 parts In-Stock

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4,086

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Vyrian

USA . 3,874 parts In-Stock

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3,874

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Anansix

USA . 2,099 parts In-Stock

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2,099

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Distributors (Availability)

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Microchip USA

USA . 1,382 parts In-Stock

1+ parts

$6.164

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-

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1,382

$6.164

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AZTECH Wire

Italy . 622 parts In-Stock

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$14.420

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622

$14.420

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IDEA Electronic Components Group

UK . 1,503 parts In-Stock

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$27.485

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$24.736

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1,503

$27.485

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$24.736

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MKK Technologies

India . 202 parts In-Stock

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$51.684

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202

$51.684

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DigiPath Technology Company

USA . 202 parts In-Stock

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$51.684

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202

$51.684

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QUARKTWIN TECHNOLOGY LTD

USA . 24,853 parts In-Stock

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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8,000

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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Perfect Parts

USA . 1,400 parts In-Stock

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1,400

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Corphita

USA . 881 parts In-Stock

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881

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Parana Technologies

USA . 22 parts In-Stock

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$32.862

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22

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$32.862

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Overview

Unlock a world of innovation with the ST72F324BK6TAS microcontroller from STMicroelectronics. Renowned for their commitment to quality and cutting-edge technology, STMicroelectronics delivers a reliable solution that meets diverse application needs—from automotive to industrial automation. With its compact design and versatile features, this microcontroller empowers engineers to create efficient, high-performance systems that enhance product functionality and drive success. Experience the benefits of superior performance and seamless integration today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for compact designs, making it ideal for space-constrained applications.

Maximum Supply Voltage: 5.5 V

A higher maximum supply voltage provides flexibility for interfacing with various peripherals.

Package Shape: SQUARE

The square package shape offers efficient use of board space and easier handling during assembly.

Bit Size: 8

An 8-bit architecture is suitable for simpler tasks and applications that require less processing power.

No. of Terminals: 32

With 32 terminals, this microcontroller supports a wide range of functions and connections to external devices.

Package Style (Meter): FLATPACK, LOW PROFILE

Low-profile flatpack design enhances heat dissipation and fits perfectly into tight spaces in electronic assemblies.

Minimum Supply Voltage: 3 V

The capability to operate at a low minimum supply voltage helps in battery-powered applications, extending battery life.

ADC Channels: YES

Integrated ADC channels allow for real-time data acquisition from analog sensors, increasing the versatility of the microcontroller.

DMA Channels: YES

Support for DMA channels improves data handling efficiency, allowing the CPU to focus on processing tasks rather than data transfer.

Terminal Position: BOTTOM

Bottom terminal positioning is advantageous for thermal performance and compact PCB design.

Width: 7 mm

The compact width is ideal for small form factor designs and embedded systems with space limitations.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz enables sufficient processing speed for many control and automation tasks.

Length: 7 mm

This length contributes to a compact overall footprint, suitable for efficient PCB layouts.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it integrates the processing unit, memory, and peripherals, simplifying design and reducing component count.

Terminal Form: BALL

Ball terminal form ensures robust connection reliability and ease of soldering on surface-mount PCBs.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is common and facilitates compatibility with many existing electronic systems.

PWM Channels: YES

Support for PWM channels allows for precise control of motors and other output devices, enhancing functionality.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm is suitable for high-density PCB designs, maximizing the use of available space.

Speed: 8 rpm

This speed specification is relevant for low-speed applications, ensuring efficient operation in motor control applications.

No. of I/O Lines: 24

Having 24 I/O lines allows for extensive interfacing options with peripherals and sensors, enhancing versatility.

Technical Specifications

Microcontrollers ST72F324BK6TAS attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

7 mm

No. of I/O Lines:

24

No. of Terminals:

32

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

8 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

ST72F324BK6TAS Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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