Loading...

ST72F324BK6T3

STMicroelectronics

ST72F324BK6T3 by STMicroelectronics

ST72F324BK6T3 microcontroller from STMicroelectronics features an 8-bit architecture, operates b/w -40 °C to 125 °C, and supports up to 16 MHz clock frequency. With 32 terminals and integrated ADC channels, it's ideal for automotive applications. Its low-profile design ensures efficient space utilization in compact devices.

Median Price

$3.260

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 123,000 parts In-Stock

1+ parts

-

100+ parts

$3.260

1k+ parts

$2.920

10k+ parts

$2.740

123,000

-

$3.260

$2.920

$2.740

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,906 parts In-Stock

1+ parts

$3.439

100+ parts

-

1k+ parts

-

10k+ parts

-

2,906

$3.439

-

-

-

Vyrian

USA . 2,739 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,739

-

-

-

-

Anansix

USA . 2,062 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,062

-

-

-

-

Cyclops Electronics Ltd

UK . 1,488 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,488

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,267 parts In-Stock

1+ parts

$3.258

100+ parts

-

1k+ parts

-

10k+ parts

-

4,267

$3.258

-

-

-

AZTECH Wire

Italy . 867 parts In-Stock

1+ parts

$8.100

100+ parts

-

1k+ parts

-

10k+ parts

-

867

$8.100

-

-

-

IDEA Electronic Components Group

UK . 2,116 parts In-Stock

1+ parts

$78.389

100+ parts

-

1k+ parts

$70.550

10k+ parts

-

2,116

$78.389

-

$70.550

-

Component Stockers USA

USA . 765 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

765

$99.990

-

-

-

MKK Technologies

India . 1,384 parts In-Stock

1+ parts

$147.405

100+ parts

-

1k+ parts

-

10k+ parts

-

1,384

$147.405

-

-

-

DigiPath Technology Company

USA . 1,384 parts In-Stock

1+ parts

$147.405

100+ parts

-

1k+ parts

-

10k+ parts

-

1,384

$147.405

-

-

-

RC Electronics

USA . 31,921 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

31,921

-

-

-

-

Authorized Procurement Solutions

USA . 24,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

24,000

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 12,484 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,484

-

-

-

-

A-Z Elektronik GmbH

Germany . 5,169 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,169

-

-

-

-

Microchip USA

USA . 3,549 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,549

-

-

-

-

Vigor

Singapore . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Parana Technologies

USA . 1,557 parts In-Stock

1+ parts

-

100+ parts

$93.726

1k+ parts

-

10k+ parts

-

1,557

-

$93.726

-

-

ChipstoGo Electronic ltd

UK . 30 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

30

-

-

-

-

Overview

Unlock the potential of your projects with the ST72F324BK6T3 microcontroller from STMicroelectronics, a trusted leader in innovation and quality. This versatile 8-bit powerhouse offers exceptional performance for automotive applications, ensuring reliability even in extreme temperatures. Its compact design and advanced connectivity options streamline integration, delivering high efficiency and flexibility. Elevate your designs with a product that combines cutting-edge technology and unmatched support—experience the ST difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material ensures reliability in various environments.

Surface Mount: YES

Surface mount capability allows for compact designs and easier integration into modern circuits.

Maximum Supply Voltage: 5.5 V

The ability to operate at a maximum supply voltage of 5.5 V provides flexibility for different power supply designs.

Package Shape: SQUARE

The square package shape enables efficient use of PCB space, making it ideal for tight layouts.

Bit Size: 8

An 8-bit architecture is suitable for a range of applications, balancing complexity and performance.

Power Supplies (V): 5

Operating at a standard 5 V supply is convenient, given its prevalence in electronic circuits.

No. of Terminals: 32

With 32 terminals, this microcontroller offers extensive connectivity options for various peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE

The low profile flatpack style contributes to a slimmer design, enhancing space efficiency.

Minimum Supply Voltage: 3.8 V

A low minimum supply voltage allows for battery-powered applications and energy-efficient designs.

Maximum Operating Temperature: 125 °C

High operating temperature tolerance makes this microcontroller suitable for automotive and harsh environments.

CPU Family: ST72

The ST72 family is well-known for its reliability and robust performance in embedded systems.

Minimum Operating Temperature: -40 °C

Ability to function in low temperatures expands the potential applications, especially in outdoor environments.

Terminal Finish: Matte Tin (Sn)

Matte tin finish provides good solderability and resistance against oxidation, ensuring long-term reliability.

ADC Channels: YES

Inclusion of ADC channels allows for effective processing of analog signals, enhancing versatility.

Terminal Position: QUAD

Quad terminal position promotes stable connections on PCB, improving overall mechanical strength.

ROM Words: 32768

With 32 KB of ROM, there is ample space for application code, making it suitable for complex projects.

Maximum Seated Height: 1.6 mm

A low seated height is beneficial for designs requiring a compact form factor.

Width: 7 mm

A width of 7 mm allows for flexibility in PCB design and layout.

Peripherals: POR, TIMER(4)

Built-in peripherals like power-on reset and multiple timers enhance functionality without external components.

Maximum Clock Frequency: 16 MHz

A 16 MHz clock frequency provides sufficient processing power for many embedded applications.

Maximum Time At Peak Reflow Temperature (s): 30

Tolerance for peak reflow times ensures compatibility with standard assembly processes.

Peak Reflow Temperature °C: 235

Operating at a peak reflow temperature of 235 °C supports compatibility with common soldering techniques.

Length: 7 mm

A 7 mm length contributes to the overall compactness of the microcontroller, fitting well in space-constrained projects.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this microcontroller meets rigorous standards for temperature and reliability.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it can handle a variety of tasks, making it a versatile solution for embedded systems.

RAM Bytes: 1024

1 KB of RAM allows for efficient data handling and temporary storage during program execution.

Technology: CMOS

CMOS technology ensures low power consumption and higher efficiency, ideal for battery-operated devices.

Terminal Form: GULL WING

The gull wing terminal form provides reliable soldering options and improved thermal performance.

Analog To Digital Converters: 8-Ch 10-Bit

Having 8 channels with 10-bit resolution for ADC allows for precise measurements in analog applications.

Maximum Supply Current: 7 mA

A maximum supply current of 7 mA ensures energy efficiency, making it suitable for low-power designs.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V aligns with most common power supply systems for convenience.

PWM Channels: YES

PWM capability enables control over analog devices, enhancing the range of applications.

Connectivity: SCI, SPI

Supported serial protocols (SCI, SPI) facilitate easy communication with other devices and peripherals.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to stored programs.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm contributes to layout flexibility and ease of soldering.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating allows for controlled storage and handling reproducibility, suitable for various environments.

Speed: 8 rpm

A speed of 8 rpm provides sufficient response time for many embedded applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width is adequate for many application requirements without excessive resource usage.

No. of I/O Lines: 24

24 I/O lines provide significant control options for connecting to various sensors and actuators.

Technical Specifications

Microcontrollers ST72F324BK6T3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

24

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

7 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SCI, SPI

Peripherals:

POR, TIMER(4)

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

ST72F324BK6T3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20