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ST72F324BK4TAE

STMicroelectronics

ST72F324BK4TAE by STMicroelectronics

ST72F324BK4TAE microcontroller from STMicroelectronics features an 8-bit CPU, operates at a max voltage of 5.5V, and includes 24 I/O lines. With a temperature range of -40 °C to 85°C, it's ideal for industrial applications. Its low-profile design ensures efficient space utilization in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,574 parts In-Stock

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6,574

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Digiode

USA . 4,412 parts In-Stock

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4,412

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Anansix

USA . 1,576 parts In-Stock

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1,576

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Distributors (Availability)

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Microchip USA

USA . 247 parts In-Stock

1+ parts

$5.457

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247

$5.457

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AZTECH Wire

Italy . 573 parts In-Stock

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$9.840

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573

$9.840

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IDEA Electronic Components Group

UK . 1,294 parts In-Stock

1+ parts

$48.141

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-

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$43.327

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1,294

$48.141

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$43.327

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MKK Technologies

India . 854 parts In-Stock

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$90.526

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854

$90.526

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DigiPath Technology Company

USA . 854 parts In-Stock

1+ parts

$90.526

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854

$90.526

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Vigor

Singapore . 3,518 parts In-Stock

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Corphita

USA . 3,287 parts In-Stock

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3,287

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Parana Technologies

USA . 1,990 parts In-Stock

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$57.560

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1,990

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$57.560

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Overview

Unlock the potential of your projects with the ST72F324BK4TAE microcontroller from STMicroelectronics. Renowned for its exceptional quality and reliability, this 8-bit powerhouse is designed to excel in industrial applications, delivering robust performance even in extreme conditions. With a compact design and low power consumption, it offers seamless integration for diverse uses—from automation to consumer electronics—empowering you to innovate without limits. Experience unparalleled support and cutting-edge technology that drives your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides protection against physical damage, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for compact designs and is ideal for automated assembly processes.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage of 5.5 V ensures compatibility with a wide range of power sources.

Package Shape: SQUARE

The square package shape optimizes space on PCB layouts for easier integration.

Bit Size: 8

8-bit architecture is efficient for handling simple tasks, making it cost-effective for many applications.

Power Supplies (V): 3.3/5

Dual power supply options (3.3V and 5V) increase flexibility in application design.

No. of Terminals: 32

A high terminal count allows for greater connectivity and more I/O options for peripheral devices.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile design helps save space and contribute to thinner product designs.

Minimum Supply Voltage: 3.8 V

This minimum supply voltage ensures reliable operation under varying power conditions.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C ensures the microcontroller can function in demanding environments.

CPU Family: ST72

Part of the ST72 family, known for its reliability and efficiency in embedded applications.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this microcontroller suitable for extreme environmental conditions.

Terminal Finish: TIN/NICKEL PALLADIUM GOLD

High-quality terminal finish improves solderability and provides better corrosion resistance.

ADC Channels: YES

Integrated ADC channels allow for analog signal processing without the need for additional components.

Terminal Position: QUAD

Quad terminal positioning enhances routing options for PCB layout.

ROM Words: 16384

This amount of ROM space facilitates complex program storage for sophisticated applications.

Maximum Seated Height: 1.6 mm

The low seated height is ideal for space-constrained designs, enhancing overall product compactness.

Width: 7 mm

A compact width allows for integration in small devices without compromising layout design.

Maximum Clock Frequency: 16 MHz

The 16 MHz clock frequency supports moderate processing speed for many control tasks.

Maximum Time At Peak Reflow Temperature (s): 40

Extended peak reflow time allows for consistent soldering quality during manufacturing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures compatibility with lead-free soldering processes.

Length: 7 mm

A uniform length, along with the width, contributes to a balanced and compact design.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, offering durability and reliability in challenging environments.

Peripheral IC Type: MICROCONTROLLER

This microcontroller type is versatile for a wide range of embedded applications.

RAM Bytes: 512

Having 512 bytes of RAM supports moderate data processing and storage needs.

Technology: CMOS

CMOS technology provides low power consumption, making it efficient for battery-powered applications.

Terminal Form: GULL WING

Gull wing terminals simplify the soldering process and improve manufacturability.

Maximum Supply Current: 7 mA

Low supply current ensures energy efficiency, making it suitable for portable devices.

Nominal Supply Voltage: 5 V

A standard nominal supply voltage of 5V makes it widely compatible with existing systems.

PWM Channels: YES

Support for PWM channels enables versatile control of motors and other actuators.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to stored programs.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch aids in reducing the overall footprint on PCB layouts.

Speed: 8 rpm

This speed specification supports slower operational needs, suitable for certain low-speed applications.

No. of I/O Lines: 24

With 24 I/O lines, this microcontroller provides ample options for interfacing with various peripherals.

Technical Specifications

Microcontrollers ST72F324BK4TAE attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3/e4

Length:

7 mm

No. of I/O Lines:

24

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

7 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Peripheral IC Type:

Trade Compliance

ST72F324BK4TAE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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