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ST72F324BK2T6

STMicroelectronics

ST72F324BK2T6 by STMicroelectronics

ST72F324BK2T6 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, supporting up to 24 I/O lines. It operates within -40 °C to 85 °C and offers 8 ADC channels for versatile applications. Ideal for industrial use, it comes in a low-profile flatpack package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,818 parts In-Stock

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Anansix

USA . 1,592 parts In-Stock

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1,592

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ComSIT Distribution GmbH

Germany . 1,200 parts In-Stock

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1,200

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Digiode

USA . 1,029 parts In-Stock

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1,029

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R&J Components

USA . 750 parts In-Stock

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750

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 263 parts In-Stock

1+ parts

$7.598

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263

$7.598

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AZTECH Wire

Italy . 885 parts In-Stock

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$19.700

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885

$19.700

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IDEA Electronic Components Group

UK . 1,690 parts In-Stock

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$65.061

100+ parts

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$58.555

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1,690

$65.061

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$58.555

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Component Stockers USA

USA . 260 parts In-Stock

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$99.990

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260

$99.990

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MKK Technologies

India . 2,073 parts In-Stock

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$122.344

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2,073

$122.344

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DigiPath Technology Company

USA . 2,073 parts In-Stock

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$122.344

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2,073

$122.344

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Vigor

Singapore . 6,115 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,249 parts In-Stock

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Perfect Parts

USA . 3,972 parts In-Stock

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RC Electronics

USA . 3,700 parts In-Stock

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3,700

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Parana Technologies

USA . 1,970 parts In-Stock

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$77.791

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$77.791

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Kepictronics

USA . 1,500 parts In-Stock

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1,500

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Corphita

USA . 732 parts In-Stock

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732

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Overview

Unlock the power of innovation with the ST72F324BK2T6 microcontroller from STMicroelectronics, a leader in cutting-edge semiconductor solutions. Designed for reliability and versatility, this 8-bit gem shines in various applications—from automation to consumer electronics. Experience superior performance with low power consumption and robust features, ensuring efficiency in your projects while benefiting from ST's renowned quality and support. Embrace limitless possibilities with STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good protection against environmental factors and mechanical stress.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient manufacturing processes.

Maximum Supply Voltage: 5.5 V

Compatible with a wide range of power supply configurations, making it versatile for various applications.

Package Shape: SQUARE

A square package shape facilitates easy placement on PCBs and optimizes space utilization.

Bit Size: 8

The 8-bit architecture is well-suited for simple control tasks and cost-effective designs.

Power Supplies (V): 5

Standard 5V supply voltage simplifies integration with common electronic components.

No. of Terminals: 32

A sufficient number of terminals allows for various I/O operations and peripheral connections.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design is ideal for applications with space constraints.

Minimum Supply Voltage: 3.8 V

Low minimum supply voltage enables operation in battery-powered applications, extending battery life.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications where the operating environment can be challenging.

CPU Family: ST72

The ST72 family offers a reliable and well-supported series of microcontrollers for various applications.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures reliable operation in harsh environments.

Terminal Finish: Tin (Sn)

Tin finish provides good solderability and resistance to oxidation, enhancing longevity.

ADC Channels: YES

Built-in ADC channels allow for analog signal processing, making it ideal for sensor applications.

Terminal Position: QUAD

Quad terminal positioning promotes easier and more efficient PCB routing.

ROM Words: 8192

8192 words of ROM allows for adequate program storage and complex application development.

Maximum Seated Height: 1.6 mm

Low seated height helps in space-constrained designs without sacrificing performance.

Width: 7 mm

Compact width makes it easy to fit into various products and applications.

Peripherals: POR, TIMER(4)

Integrated peripherals such as Power-On Reset and timers simplify design efforts.

Maximum Clock Frequency: 16 MHz

16 MHz clock speed offers sufficient processing power for many embedded applications.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for proper soldering techniques, ensuring reliable assembly.

Peak Reflow Temperature °C: 235

Robustness against high temperatures during soldering provides reliability in production.

Length: 7 mm

Compact length is crucial for space-saving designs in modern electronics.

Temperature Grade: INDUSTRIAL

Industrial temperature rating guarantees reliability and longevity in demanding environments.

Peripheral IC Type: MICROCONTROLLER

Versatility as a microcontroller opens up a wide range of application possibilities.

RAM Bytes: 384

384 bytes of RAM provides enough memory for efficient operation in simple control applications.

Technology: CMOS

CMOS technology ensures low power consumption and high speed, ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminal form provides efficient heat dissipation and reliable connections.

Analog To Digital Converters: 8-Ch 10-Bit

8-channel, 10-bit ADCs allow for detailed data acquisition from multiple sensors.

Maximum Supply Current: 5.5 mA

Low supply current helps in power-sensitive applications, reducing the overall energy consumption.

Nominal Supply Voltage: 5 V

Standard nominal voltage simplifies integration with existing systems and enhances compatibility.

PWM Channels: YES

PWM capability makes it a suitable choice for applications involving motor control or LED brightness adjustment.

Connectivity: SCI, SPI

Built-in SCI and SPI interfaces enhance communication options with other devices.

ROM Programmability: FLASH

Flash ROM enables easy reprogramming and updates, providing flexibility in design.

Terminal Pitch: 0.8 mm

Narrow terminal pitch allows for higher density PCB designs, maximizing space efficiency.

Moisture Sensitivity Level (MSL): 2

MSL 2 rating indicates suitable handling and storage, making it reliable for manufacturing.

Speed: 8 rpm

Adequate speed for applications requiring moderate performance and control.

On Chip Program ROM Width: 8

8-bit program ROM width ensures compatibility with various existing software and algorithms.

No. of I/O Lines: 24

24 I/O lines allow for ample connectivity options, supporting diverse application needs.

Technical Specifications

Microcontrollers ST72F324BK2T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

24

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

5.5 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SCI, SPI

Peripherals:

POR, TIMER(4)

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

ST72F324BK2T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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