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ST72F324BK2T3

STMicroelectronics

ST72F324BK2T3 by STMicroelectronics

ST72F324BK2T3 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, operating b/w -40 °C to 125 °C. It supports 24 I/O lines and includes ADC channels for versatile applications in automotive systems. Its compact flatpack design ensures efficient integration in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,086 parts In-Stock

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6,086

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Digiode

USA . 4,534 parts In-Stock

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4,534

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Anansix

USA . 919 parts In-Stock

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919

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Distributors (Availability)

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Vigor

Singapore . 113 parts In-Stock

1+ parts

$4.670

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113

$4.670

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Microchip USA

USA . 475 parts In-Stock

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$5.921

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475

$5.921

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AZTECH Wire

Italy . 288 parts In-Stock

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$17.580

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288

$17.580

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IDEA Electronic Components Group

UK . 1,155 parts In-Stock

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$61.996

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$55.796

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$61.996

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$55.796

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MKK Technologies

India . 1,031 parts In-Stock

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$116.580

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$116.580

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DigiPath Technology Company

USA . 1,031 parts In-Stock

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$116.580

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$116.580

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A-Z Elektronik GmbH

Germany . 6,227 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Parana Technologies

USA . 1,816 parts In-Stock

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$74.126

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$74.126

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Perfect Parts

USA . 1,658 parts In-Stock

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Corphita

USA . 1,420 parts In-Stock

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Overview

Elevate your projects with the ST72F324BK2T3 microcontroller from STMicroelectronics, a trusted name in innovative technology. Delivering robust performance in demanding environments, this versatile microcontroller is perfect for automotive applications and beyond. Enjoy enhanced efficiency, low power consumption, and seamless integration with advanced features like ADC channels and PWM control. Experience unparalleled quality and reliability that empowers you to create cutting-edge solutions with confidence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, ensuring reliable performance in various environments.

Surface Mount: YES

Allows for compact design and efficient use of space on printed circuit boards.

Maximum Supply Voltage: 5.5 V

Supports a wide range of operating voltages, making it versatile for various applications.

Package Shape: SQUARE

Provides a uniform surface area for mounting and helps in thermal management.

Bit Size: 8

Suitable for simple applications while saving on power consumption.

Power Supplies (V): 5

Standard operating voltage simplifies design and integration with other components.

No. of Terminals: 32

Offers ample connectivity options for a variety of peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE

Facilitates space-saving designs, ideal for compact electronic devices.

Minimum Supply Voltage: 3.8 V

Allows for flexible power supply options, enhancing usability in diverse applications.

Maximum Operating Temperature: 125 °C

Suitable for automotive and industrial applications where high temperature resilience is necessary.

CPU Family: ST72

Proven architecture that ensures reliability and ease of programming.

Minimum Operating Temperature: -40 °C

Ideal for use in extreme conditions, making it suitable for outdoor and harsh environments.

Terminal Finish: MATTE TIN

Provides good solderability and enhances the overall reliability of connections.

ADC Channels: YES

Enables analog signal processing, crucial for many embedded applications.

Terminal Position: QUAD

Allows for optimized space usage on PCBs, enhancing the design flexibility.

ROM Words: 8192

Ample memory for program storage, accommodating complex applications.

Maximum Seated Height: 1.6 mm

Low profile design helps in compact device designs while ensuring effective thermal dissipation.

Width: 7 mm

Compact dimension complements space-constrained designs in consumer electronics.

Peripherals: POR, TIMER(4)

Integrated peripherals extend functionality, allowing for sophisticated timing and reset features.

Maximum Clock Frequency: 16 MHz

Provides sufficient processing power for a wide range of applications.

Length: 7 mm

Compact size supports various portable and embedded applications.

Temperature Grade: AUTOMOTIVE

Meets stringent automotive standards, ensuring reliability in vehicle applications.

Peripheral IC Type: MICROCONTROLLER

Versatile component that can handle various control tasks efficiently.

RAM Bytes: 384

Provides adequate memory for data handling in real-time applications.

Technology: CMOS

Low power consumption technology, making it suited for battery-operated devices.

Terminal Form: GULL WING

Facilitates easier handling and soldering during assembly.

Analog To Digital Converters: 8-Ch 10-Bit

Supports accurate digital representation of analog signals, essential for sensor interfacing.

Maximum Supply Current: 5.5 mA

Low current consumption extends battery life in portable applications.

Nominal Supply Voltage: 5 V

Standard voltage level simplifies the design process and enhances interoperability.

PWM Channels: YES

Enables control of motors and light dimming, enhancing application versatility.

Connectivity: SCI, SPI

Multiprotocol support facilitates communication with a variety of devices.

ROM Programmability: FLASH

Allows for easy updates and programming changes, enhancing flexibility in development.

Terminal Pitch: 0.8 mm

Facilitates high-density mounting while maintaining ease of assembly.

Speed: 8 rpm

Sufficient speed capabilities for various processing tasks without excessive energy consumption.

On Chip Program ROM Width: 8

Optimizes data processing efficiency, fitting well with 8-bit architectures.

No. of I/O Lines: 24

Provides high input/output capability, accommodating a range of interfacing options.

Technical Specifications

Microcontrollers ST72F324BK2T3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

24

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

5.5 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SCI, SPI

Peripherals:

POR, TIMER(4)

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

ST72F324BK2T3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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