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ST72F324BK2B6

STMicroelectronics

ST72F324BK2B6 by STMicroelectronics

ST72F324BK2B6 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, operating b/w -40 °C to 85 °C. It includes 8 ADC channels and supports SPI/SCI connectivity. Ideal for industrial applications, it offers robust performance in compact designs.

Median Price

$2.184

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,851 parts In-Stock

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6,851

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Digiode

USA . 3,484 parts In-Stock

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3,484

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Anansix

USA . 2,258 parts In-Stock

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2,258

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Bristol Electronics

USA . 32 parts In-Stock

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-

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$2.184

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32

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$2.184

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Microfarads

USA . 31 parts In-Stock

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31

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Distributors (Availability)

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Vigor

Singapore . 2,398 parts In-Stock

1+ parts

$3.220

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-

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2,398

$3.220

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Microchip USA

USA . 302 parts In-Stock

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$3.903

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302

$3.903

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AZTECH Wire

Italy . 957 parts In-Stock

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$18.500

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957

$18.500

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IDEA Electronic Components Group

UK . 826 parts In-Stock

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$61.451

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$55.306

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826

$61.451

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$55.306

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Component Stockers USA

USA . 641 parts In-Stock

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$99.990

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641

$99.990

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MKK Technologies

India . 1,174 parts In-Stock

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$115.555

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1,174

$115.555

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DigiPath Technology Company

USA . 1,174 parts In-Stock

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$115.555

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1,174

$115.555

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Kepictronics

USA . 6,895 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,129 parts In-Stock

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Infinite Electronics LLP (Excess)

. 1,927 parts In-Stock

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Corphita

USA . 649 parts In-Stock

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649

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Perfect Parts

USA . 502 parts In-Stock

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502

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Parana Technologies

USA . 90 parts In-Stock

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$73.474

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90

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$73.474

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Overview

Unlock the potential of innovation with the ST72F324BK2B6 microcontroller from STMicroelectronics, a leader in high-performance solutions. This versatile 8-bit powerhouse is ideal for industrial applications where reliability and efficiency matter. With robust temperature tolerances and extensive peripheral support, it seamlessly integrates into your designs, delivering exceptional value while optimizing performance. Elevate your projects with unmatched quality and precision that only STMicroelectronics can provide!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy material provides excellent protection against environmental factors, ensuring long-lasting performance.

Maximum Supply Voltage: 5.5 V

Allows for compatibility with a wide range of power supplies and devices, making it versatile for use in various applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of PCB space and makes it easier to design compact devices.

Bit Size: 8

An 8-bit architecture is adequate for many basic tasks, making it a cost-effective solution for simple control applications.

Power Supplies (V): 5

Standard 5V supply simplifies integration with existing systems and peripherals.

No. of Terminals: 32

A higher number of terminals provides more flexibility for connecting various peripherals and I/O devices.

Package Style (Meter): IN-LINE, SHRINK PITCH

Shrink pitch design facilitates compact layout while maintaining signal integrity.

Minimum Supply Voltage: 3.8 V

The lower minimum voltage allows for operation in power-sensitive applications, extending battery life.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications where higher temperature tolerance is required.

CPU Family: ST72

Belongs to a reliable family of controllers known for stability and performance.

Minimum Operating Temperature: -40 °C

Wide temperature range makes it suitable for harsh environments and extreme conditions.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and corrosion resistance.

ADC Channels: YES

Integrated ADC channels allow for direct interfacing with analog sensors, enhancing functionality.

Terminal Position: DUAL

Dual terminal positioning enables easier assembly and reduces the risk of misalignment during soldering.

ROM Words: 8192

Sufficient ROM capacity to accommodate complex programs, allowing for more sophisticated applications.

Maximum Seated Height: 5.08 mm

Compact height makes it suitable for space-constrained designs.

Width: 10.16 mm

Slim width ensures effective use of PCB real estate, facilitating dense layouts.

Peripherals: POR, TIMER(4)

Multiple peripherals enhance the microcontroller's capabilities for diverse control tasks.

Maximum Clock Frequency: 16 MHz

A clock frequency of 16 MHz provides adequate speed for many control applications without excessive power consumption.

Length: 27.94 mm

Length is optimized for compact designs, allowing for integration into smaller devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability and performance in challenging conditions.

Peripheral IC Type: MICROCONTROLLER

Designed specifically as a microcontroller, offering tailored functionalities for control and automation.

RAM Bytes: 384

Adequate RAM allows for effective data handling in applications without risking performance limitations.

Technology: CMOS

CMOS technology offers low power consumption, which is ideal for battery-operated applications.

Terminal Form: THROUGH-HOLE

Through-hole design ensures robust physical connections, suitable for rugged environments.

Analog To Digital Converters: 8-Ch 10-Bit

8-channel, 10-bit ADCs provide versatile analog interfacing capabilities for monitoring multiple sensors.

Maximum Supply Current: 5.5 mA

Low supply current minimizes energy consumption, making it ideal for battery-powered devices.

Nominal Supply Voltage: 5 V

Nominal voltage of 5V is standard, simplifying integration with other components.

PWM Channels: YES

PWM capability allows for precise control over motors, lights, and other output devices.

Connectivity: SCI, SPI

Supports various communication protocols, enhancing design flexibility and interface options.

ROM Programmability: FLASH

Flash programming enables easy updates and modifications to the firmware, providing long-term usability.

Terminal Pitch: 1.778 mm

Standard terminal pitch simplifies PCB layout and manufacturing processes.

Speed: 8 rpm

Operations at 8 rpm are suitable for specific control applications like motors, enhancing design versatility.

On Chip Program ROM Width: 8

8-bit program ROM width supports straightforward programming and application development.

No. of I/O Lines: 24

A sufficient number of I/O lines for diverse interfacing needs, suitable for complex interactions and control.

Technical Specifications

Microcontrollers ST72F324BK2B6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T32

JESD-609 Code:

e3

Length:

27.94 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

24

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP32,.4

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

5.08 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

5.5 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

10.16 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SCI, SPI

Peripherals:

POR, TIMER(4)

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

ST72F324BK2B6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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