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ST72F324BJ6T3

STMicroelectronics

ST72F324BJ6T3 by STMicroelectronics

ST72F324BJ6T3 microcontroller from STMicroelectronics features a 16 MHz CPU, 32 I/O lines, and operates within -40 °C to 125 °C. With a supply voltage range of 3.8V to 5.5V, it's ideal for automotive applications requiring reliable performance. Its low-profile design and integrated ADC enhance versatility in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,538 parts In-Stock

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6,538

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Anansix

USA . 2,590 parts In-Stock

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2,590

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Digiode

USA . 819 parts In-Stock

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819

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Distributors (Availability)

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AZTECH Wire

Italy . 1,162 parts In-Stock

1+ parts

$10.740

100+ parts

-

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1,162

$10.740

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Microchip USA

USA . 2,012 parts In-Stock

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$28.373

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2,012

$28.373

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IDEA Electronic Components Group

UK . 1,530 parts In-Stock

1+ parts

$28.551

100+ parts

-

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$25.696

10k+ parts

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1,530

$28.551

-

$25.696

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MKK Technologies

India . 722 parts In-Stock

1+ parts

$53.689

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722

$53.689

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DigiPath Technology Company

USA . 722 parts In-Stock

1+ parts

$53.689

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722

$53.689

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Vigor

Singapore . 3,132 parts In-Stock

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3,132

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Parana Technologies

USA . 1,953 parts In-Stock

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$34.137

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1,953

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$34.137

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Corphita

USA . 591 parts In-Stock

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591

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Overview

Unleash your creativity with the ST72F324BJ6T3 microcontroller from STMicroelectronics, a trusted leader in innovative technology. Designed for versatility and reliability, this 8-bit powerhouse excels in automotive applications, ensuring optimal performance even in extreme conditions. With its compact flatpack design and advanced features like ADC channels and multiple timers, it empowers engineers to craft superior solutions while maximizing efficiency and minimizing footprint. Elevate your projects with unmatched quality!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides a durable and lightweight design, making it well-suited for a variety of applications.

Surface Mount: YES

Surface mount capability allows for compact PCB designs and efficient production processes.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage offers flexibility in powering the microcontroller, accommodating various supply designs.

Package Shape: SQUARE

The square package shape optimizes space utilization on the PCB, aiding in denser circuit designs.

Bit Size: 8

An 8-bit architecture is suitable for simpler applications, providing efficient processing for low-cost solutions.

Power Supplies (V): 5

Operating on a standard 5V power supply simplifies system design and integration with other components.

No. of Terminals: 44

With 44 terminals, it offers plenty of I/O options for connecting various peripherals and devices.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack style is advantageous for space-constrained applications, enabling efficient design.

Minimum Supply Voltage: 3.8 V

A low minimum supply voltage enhances compatibility with battery-powered applications.

Maximum Operating Temperature: 125 °C

Designed for high-temperature environments, making it suitable for automotive and industrial applications.

CPU Family: ST72

The ST72 CPU family is known for its reliability, ensuring stability in critical applications.

Minimum Operating Temperature: -40 °C

Ability to operate in extreme cold makes it ideal for outdoor and harsh environment applications.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides good solderability and resistance to corrosion, ensuring longevity of the connections.

ADC Channels: YES

The presence of ADC channels allows for seamless interfacing with analog sensors, enhancing the controller's versatility.

Terminal Position: QUAD

Quad terminal positioning optimizes layout options on PCB, facilitating easier routing and design flexibility.

ROM Words: 32768

Sufficient ROM size supports complex firmware, enabling diverse functionalities in applications.

Maximum Seated Height: 1.6 mm

Compact seated height allows for stacking or integration in space-constrained designs.

Width: 10 mm

A width of 10 mm suits a wide variety of applications, from consumer electronics to automotive.

Peripherals: POR, TIMER(4)

Integrated peripherals like power-on reset and multiple timers enhance functionality without the need for external components.

Maximum Clock Frequency: 16 MHz

A 16 MHz clock frequency provides sufficient processing power for many embedded applications.

Maximum Time At Peak Reflow Temperature (s): 30

A max reflow time of 30 seconds ensures compatibility with standard PCB assembly processes.

Peak Reflow Temperature °C: 260

Withstand high temperatures during PCB manufacturing, ensuring lasting performance after assembly.

Length: 10 mm

The 10 mm length contributes to a compact form factor ideal for small electronic devices.

Temperature Grade: AUTOMOTIVE

Automotive grade means it meets stringent reliability standards, making it a dependable choice for vehicle applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller allows for control and processing in a single component, simplifying design.

RAM Bytes: 1024

With 1024 bytes of RAM, it provides enough memory for basic applications and data handling.

Technology: CMOS

CMOS technology offers low power consumption while maintaining high performance, ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals simplify assembly, especially in automated processes, ensuring reliable connections.

Analog To Digital Convertors: 12-Ch 10-Bit

A 12-channel, 10-bit ADC allows for extensive analog signal measurement, enhancing application's capabilities.

Maximum Supply Current: 7 mA

Low supply current decreases energy consumption, making it an efficient choice for portable applications.

Nominal Supply Voltage: 5 V

Standard 5V operation simplifies the integration into existing systems and components.

PWM Channels: YES

PWM capability enables precise control of motors and other peripherals, expanding application possibilities.

Connectivity: SCI, SPI

Supports SCI and SPI for versatile communication options, making it adaptable to various networking needs.

ROM Programmability: FLASH

Flash programmability enables easy updates and modifications to firmware, enhancing long-term product utility.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch allows for fine-pitch applications, contributing to density on PCB.

Moisture Sensitivity Level (MSL): 3

MSL level 3 ensures adequate protection against moisture during storage and handling, promoting reliability.

Speed: 8 rpm

A speed rating of 8 rpm indicates it's suitable for applications requiring low-speed control.

On Chip Program ROM Width: 8

An 8-bit program ROM width is compatible with many applications involving simple logic and control.

No. of I/O Lines: 32

With 32 I/O lines, it provides extensive interfacing options for a variety of peripherals and sensors.

Technical Specifications

Microcontrollers ST72F324BJ6T3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

32

No. of Terminals:

44

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

7 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SCI, SPI

Peripherals:

POR, TIMER(4)

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

ST72F324BJ6T3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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