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ST72F324BJ2T6

STMicroelectronics

ST72F324BJ2T6 by STMicroelectronics

ST72F324BJ2T6 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, operating b/w -40 °C to 85 °C. It includes 12 ADC channels and supports SPI/SCI connectivity. Ideal for industrial applications, it offers low power consumption at 5 V supply.

Median Price

$11.540

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 100 parts In-Stock

1+ parts

$11.540

100+ parts

$8.650

1k+ parts

$7.500

10k+ parts

-

100

$11.540

$8.650

$7.500

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Vyrian

USA . 7,518 parts In-Stock

1+ parts

-

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7,518

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Digiode

USA . 4,556 parts In-Stock

1+ parts

-

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1k+ parts

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4,556

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-

-

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Anansix

USA . 2,783 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,783

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-

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ComSIT Distribution GmbH

Germany . 1,280 parts In-Stock

1+ parts

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1k+ parts

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1,280

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,450 parts In-Stock

1+ parts

$5.440

100+ parts

-

1k+ parts

-

10k+ parts

-

1,450

$5.440

-

-

-

AZTECH Wire

Italy . 763 parts In-Stock

1+ parts

$8.650

100+ parts

-

1k+ parts

-

10k+ parts

-

763

$8.650

-

-

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Microchip USA

USA . 292 parts In-Stock

1+ parts

$9.336

100+ parts

-

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292

$9.336

-

-

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IDEA Electronic Components Group

UK . 1,838 parts In-Stock

1+ parts

$60.208

100+ parts

-

1k+ parts

$54.188

10k+ parts

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1,838

$60.208

-

$54.188

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MKK Technologies

India . 1,754 parts In-Stock

1+ parts

$113.218

100+ parts

-

1k+ parts

-

10k+ parts

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1,754

$113.218

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DigiPath Technology Company

USA . 1,754 parts In-Stock

1+ parts

$113.218

100+ parts

-

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1,754

$113.218

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

1+ parts

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25,000

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A-Z Elektronik GmbH

Germany . 6,698 parts In-Stock

1+ parts

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6,698

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Corphita

USA . 3,928 parts In-Stock

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3,928

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Perfect Parts

USA . 1,886 parts In-Stock

1+ parts

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1,886

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Parana Technologies

USA . 1,372 parts In-Stock

1+ parts

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100+ parts

$71.988

1k+ parts

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1,372

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$71.988

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Kepictronics

USA . 700 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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700

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Overview

Unlock your project's potential with the ST72F324BJ2T6 microcontroller from STMicroelectronics, a leader in innovation and reliability. This compact powerhouse offers exceptional performance across a wide temperature range, making it perfect for industrial and automotive applications. Benefit from advanced features like integrated ADCs and flexible communication interfaces, ensuring seamless integration into your designs. Choose STMicroelectronics for quality you can trust and elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easier integration into modern circuit designs, facilitating compact and efficient layouts.

Maximum Supply Voltage: 5.5 V

The flexibility of operating up to 5.5 V makes it compatible with a wide range of power supply configurations.

Package Shape: SQUARE

A square package shape aids in efficient space utilization on PCBs, optimizing layout and design.

Bit Size: 8

With an 8-bit architecture, this microcontroller is suitable for applications that require basic processing capabilities and lower complexity.

Power Supplies (V): 5

Operating on a nominal 5V supply makes it standard and convenient for many existing systems and devices.

No. of Terminals: 44

A higher number of terminals provides more connectivity options, allowing for a wider range of peripherals and functionalities.

Package Style (Meter): FLATPACK, LOW PROFILE

The low profile flatpack design minimizes height, which is beneficial for space-constrained applications.

Minimum Supply Voltage: 3.8 V

Operating down to 3.8 V enables its use in battery-powered and low-voltage applications, extending the operational range.

Maximum Operating Temperature: 85 °C

An operational temperature of up to 85 °C makes this microcontroller suitable for industrial environments.

CPU Family: ST72

The ST72 CPU family is known for reliability and robustness in embedded applications, ensuring trusted performance.

Minimum Operating Temperature: -40 °C

Operating down to -40 °C allows this product to function in extreme conditions, further enhancing its suitability for critical applications.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides excellent solderability and resistance to corrosion, ensuring longer lifespan and reliability.

ADC Channels: YES

Integrated ADC channels allow for direct sensing capabilities, making this microcontroller versatile for data acquisition tasks.

Terminal Position: QUAD

Quad-terminal positioning simplifies layout and assembly, reducing potential soldering issues.

ROM Words: 8192

With 8192 ROM words, this microcontroller can store substantial program instructions, allowing for more complex applications.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm supports space-efficient designs in compact electronics.

Width: 10 mm

The 10 mm width provides a balanced form factor suitable for a variety of mounting and integration scenarios.

Peripherals: POR, TIMER(4)

Integration of peripherals like Power-On Reset and multiple timers adds functionality, enhancing system capabilities.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz offers a good balance of speed and power consumption for efficient processing.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand peak reflow temperatures for 30 seconds ensures compatibility with standard soldering processes.

Peak Reflow Temperature °C: 260

Tolerance to a peak reflow temperature of 260 °C provides reliability during thermal management in assembly.

Length: 10 mm

A 10 mm length allows designers to fit these microcontrollers into tight spaces without sacrificing performance.

Temperature Grade: INDUSTRIAL

An industrial temperature grade signifies robustness and dependability in demanding environments.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller peripheral IC type, it is specifically designed for control applications, making it ideal for embedded systems.

RAM Bytes: 384

384 bytes of RAM provide sufficient capacity for many applications, allowing for moderate data manipulation.

Technology: CMOS

CMOS technology enhances energy efficiency and lowers power consumption, key for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals enable easy soldering and reliable connectivity for robust electronic assemblies.

Analog To Digital Converters: 12-Ch 10-Bit

The presence of 12 channels of 10-bit ADC allows for accurate analog signal processing, critical for diverse applications.

Maximum Supply Current: 5.5 mA

A maximum supply current of 5.5 mA helps ensure low power operation, extending battery life in portable devices.

Nominal Supply Voltage: 5 V

Operating at a standard 5 V nominal supply allows for easy integration with typical board designs and systems.

PWM Channels: YES

Support for Pulse Width Modulation channels enables versatile control for motor drives and signal generation.

Connectivity: SCI, SPI

Built-in connectivity options such as SCI and SPI enhance communication capabilities with other devices and sensors.

ROM Programmability: FLASH

Programmable FLASH ROM allows for easy updates and customization of the firmware, enabling flexibility in application development.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8 mm, it offers good density while maintaining ease of soldering and handling.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates the product is suitable for moderate assembly processes and handling environments.

Speed: 8 rpm

An operational speed of 8 rpm indicates suitability for slow-moving application processes, providing sufficient timing control.

On Chip Program ROM Width: 8

8-bit program ROM width allows efficient data handling and interfacing, ideal for simple logic applications.

No. of I/O Lines: 24

Having 24 I/O lines provides ample interfacing options with external devices, enhancing the microcontroller's usability in complex applications.

Technical Specifications

Microcontrollers ST72F324BJ2T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

24

No. of Terminals:

44

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

5.5 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SCI, SPI

Peripherals:

POR, TIMER(4)

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

ST72F324BJ2T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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