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ST72F321J9T6

STMicroelectronics

ST72F321J9T6 by STMicroelectronics

ST72F321J9T6 microcontroller from STMicroelectronics features a 16 MHz CPU, operates b/w 3.8V and 5.5V, and includes 12 ADC channels. Its compact design with a low-profile flatpack makes it ideal for industrial applications. With 32 I/O lines, it's perfect for embedded systems.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Vyrian

USA . 7,130 parts In-Stock

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Digiode

USA . 3,617 parts In-Stock

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Chip Stock

USA . 945 parts In-Stock

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945

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Anansix

USA . 201 parts In-Stock

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Vectronix, Inc

USA . 56 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 320 parts In-Stock

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$17.690

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320

$17.690

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IDEA Electronic Components Group

UK . 2,044 parts In-Stock

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$41.122

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$37.010

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2,044

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$37.010

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Microchip USA

USA . 103 parts In-Stock

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$69.067

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103

$69.067

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MKK Technologies

India . 2,318 parts In-Stock

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$77.328

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2,318

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DigiPath Technology Company

USA . 2,318 parts In-Stock

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$77.328

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Component Stockers USA

USA . 686 parts In-Stock

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$99.990

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RC Electronics

USA . 6,077 parts In-Stock

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Vigor

Singapore . 5,800 parts In-Stock

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Perfect Parts

USA . 2,258 parts In-Stock

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Corphita

USA . 1,272 parts In-Stock

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Kepictronics

USA . 540 parts In-Stock

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iodParts Technologies Inc.

India . 150 parts In-Stock

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Parana Technologies

USA . 51 parts In-Stock

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$49.168

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$49.168

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Overview

Unlock innovation with the ST72F321J9T6 microcontroller from STMicroelectronics, a leader in high-quality embedded solutions. Designed for versatility, this compact powerhouse excels in industrial applications, empowering your projects with reliable performance while operating across a wide temperature range. Benefit from its advanced peripherals and robust connectivity options, ensuring seamless integration into your designs. Elevate your creations with confidence and efficiency, backed by ST's legacy of excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides robustness and durability, ensuring the microcontroller can withstand environmental stresses.

Surface Mount: YES

Surface mount technology allows for a compact design, making it ideal for space-constrained applications.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility in power supply options for various applications.

Package Shape: SQUARE

The square package shape optimizes space on the PCB and facilitates easier routing of traces.

Bit Size: 8

An 8-bit microcontroller is suitable for a wide range of basic control tasks, making it cost-effective for many applications.

Power Supplies (V): 3.3/5

Supports both 3.3 V and 5 V power supplies, enhancing compatibility with various systems.

No. of Terminals: 44

A higher number of terminals allows for more I/O options, enabling more complex tasks and connectivity.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design is suitable for applications that require a slim form factor.

Minimum Supply Voltage: 3.8 V

The minimum supply voltage requirement of 3.8 V ensures stable performance across various applications.

Maximum Operating Temperature: 85 °C

With a maximum temperature rating of 85 °C, this microcontroller is reliable for industrial applications.

CPU Family: ST72

The ST72 CPU family offers a proven track record of reliability and performance in microcontroller applications.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this microcontroller suitable for harsh environments.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish improves solderability and makes it suitable for high-volume assembly.

ADC Channels: YES

Built-in ADC channels enable the microcontroller to process analog signals, suitable for various sensors.

Terminal Position: QUAD

Quad terminal positions improve connectivity options and reduce PCB space usage.

ROM Words: 61440

A large ROM capacity allows for complex applications and extensive programming.

Maximum Seated Height: 1.6 mm

The low seated height aids in compact designs and improves thermal performance.

Width: 10 mm

A width of 10 mm allows for easy integration into small devices and applications.

Peripherals: POR, TIMER(5)

Integrated peripherals like Power-On Reset and multiple timers enhance functionality without extra components.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz provides quick processing, suitable for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures reliability during manufacturing and assembly processes.

Peak Reflow Temperature °C: 260

The high reflow temperature indicates compatibility with modern soldering techniques.

Length: 10 mm

A length of 10 mm complements the compact design, making it suitable for dense layouts.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures consistent performance in demanding environments.

Peripheral IC Type: MICROCONTROLLER

Designed specifically as a microcontroller, it offers dedicated functions ideal for control applications.

RAM Bytes: 2048

With 2048 bytes of RAM, this microcontroller can handle moderate data processing requirements.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, ideal for portable applications.

Terminal Form: GULL WING

Gull-wing terminals facilitate easy soldering and improve mechanical strength.

Analog To Digital Converters: 12-Ch 10-Bit

The 12-channel, 10-bit ADC offers ample capacity for reading various analog signals, ideal for sensor applications.

Maximum Supply Current: 15 mA

Low supply current ensures energy efficiency, making it suitable for battery-powered devices.

Nominal Supply Voltage: 4 V

The nominal supply voltage is within a standard range, simplifying power design requirements.

PWM Channels: YES

Pulse Width Modulation channels support various control techniques, enhancing functionality.

Connectivity: I2C, SCI, SPI

Support for multiple communication protocols provides flexibility in connecting with external devices.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications of the application.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch aids in compact PCB layouts while maintaining reliability.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates the need for standard precautions during storage and handling, ensuring longevity and reliability.

Speed: 8 rpm

The specified speed can cater to specific applications requiring exact timing and control.

On Chip Program ROM Width: 8

The 8-bit ROM width is efficient for processing and control functions in various applications.

No. of I/O Lines: 32

A generous number of I/O lines enables expanded functionality and connectivity options.

Technical Specifications

Microcontrollers ST72F321J9T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

32

No. of Terminals:

44

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SCI, SPI

Peripherals:

POR, TIMER(5)

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

ST72F321J9T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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