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ST72F321BJ9T3

STMicroelectronics

ST72F321BJ9T3 by STMicroelectronics

ST72F321BJ9T3 microcontroller from STMicroelectronics features a 16 MHz CPU, operates b/w 3.8-5.5 V, and includes 12 ADC channels. With a temperature range of -40 °C to 125°C, it's ideal for automotive applications. Its compact design supports various connectivity options like I2C and SPI.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,240 parts In-Stock

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7,240

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Digiode

USA . 3,739 parts In-Stock

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3,739

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Anansix

USA . 1,056 parts In-Stock

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1,056

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Distributors (Availability)

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AZTECH Wire

Italy . 455 parts In-Stock

1+ parts

$11.660

100+ parts

-

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455

$11.660

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IDEA Electronic Components Group

UK . 632 parts In-Stock

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$30.757

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-

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$27.682

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632

$30.757

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$27.682

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Microchip USA

USA . 254 parts In-Stock

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$35.988

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254

$35.988

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MKK Technologies

India . 2,200 parts In-Stock

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$57.837

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2,200

$57.837

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DigiPath Technology Company

USA . 2,200 parts In-Stock

1+ parts

$57.837

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2,200

$57.837

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Component Stockers USA

USA . 771 parts In-Stock

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$99.990

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771

$99.990

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Corphita

USA . 4,753 parts In-Stock

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4,753

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Vigor

Singapore . 2,600 parts In-Stock

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2,600

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Parana Technologies

USA . 2,203 parts In-Stock

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$36.775

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2,203

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$36.775

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Overview

Elevate your projects with the ST72F321BJ9T3 microcontroller from STMicroelectronics, a trusted leader in innovative semiconductor solutions. Designed for exceptional reliability and versatility, this 8-bit powerhouse ensures seamless performance across automotive and industrial applications. With robust connectivity options and efficient power management, it’s perfect for smart devices needing precision and speed. Unlock unparalleled quality and performance—choose STMicroelectronics for your next breakthrough!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy offers a lightweight and durable package, ensuring reliability in various applications.

Surface Mount: YES

Surface mount technology facilitates compact design, allowing for denser circuit layouts and efficient space utilization.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage allows compatibility with a wide range of power sources, enhancing versatility in applications.

Package Shape: SQUARE

The square package shape provides uniform dimension, making it easier to integrate into various PCB layouts.

Bit Size: 8

An 8-bit architecture is sufficient for many embedded applications, balancing performance and power consumption.

Power Supplies (V): 3.8/5.5

Supports a range of voltage supply, enabling use in diverse environments and applications.

No. of Terminals: 44

With 44 terminals, this microcontroller offers a good number of input/output options for peripheral devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This style allows for a low-profile design ideal for space-constrained applications.

Minimum Supply Voltage: 3.8 V

The low minimum supply voltage enables energy-efficient operation, making it suitable for battery-powered devices.

Maximum Operating Temperature: 125 °C

High temperature tolerance is ideal for automotive applications, ensuring performance in harsh environments.

CPU Family: ST72

Part of the ST72 family, known for reliability and performance in embedded applications.

Minimum Operating Temperature: -40 °C

Low operating temperature specification ensures functionality in extreme cold environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish enhances solderability and long-term reliability against corrosion.

ADC Channels: YES

Integrated ADC channels enable analog signal processing, making it suitable for sensor applications.

Terminal Position: QUAD

Quad terminal positioning aids in multi-directional connections, optimizing board layout.

ROM Words: 61440

Ample ROM capacity facilitates richer program functionalities and complex algorithms.

Maximum Seated Height: 1.6 mm

Low seated height allows for a slim profile, making it ideal for compact designs.

Width: 10 mm

A 10 mm width allows easy integration into various designs without excessive space consumption.

Peripherals: TIMER(5)

Multiple timers provide flexibility for task scheduling and timing functionalities.

Maximum Clock Frequency: 16 MHz

A clock frequency of 16 MHz offers sufficient processing power for many embedded applications.

Maximum Time At Peak Reflow Temperature (s): 30

Capability to withstand peak reflow conditions ensures durability during assembly processes.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance guarantees the device can endure modern PCB manufacturing processes.

Length: 10 mm

Compact length ensures efficient space usage, making it suitable for small electronic devices.

Temperature Grade: AUTOMOTIVE

Automotive-grade components meet stringent standards for reliability and safety in vehicles.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates various functionalities, reducing the need for additional components.

RAM Bytes: 2048

Sufficient RAM capacity allows for better data handling and storage for applications.

Technology: CMOS

CMOS technology offers low power consumption while maintaining good performance, ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve manufacturing efficiency.

Analog To Digital Convertors: 12-Ch 10-Bit

With 12 ADC channels, the microcontroller can effectively interact with multiple analog sensors simultaneously.

Maximum Supply Current: 15 mA

Low supply current enhances energy efficiency, extending the life of portable applications.

Nominal Supply Voltage: 5 V

Common nominal voltage makes the microcontroller easily compatible with many existing systems.

PWM Channels: YES

Integrated PWM channels allow for efficient control of motors and other devices needing variable outputs.

Connectivity: I2C, SCI, SPI

Supports multiple communication protocols, enhancing compatibility with a wide range of peripherals.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications, extending the life of the product.

Terminal Pitch: 0.5 mm

Fine pitch enables high-density mounting, accommodating complex circuit designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity, suitable for standard assembly processes with proper handling.

Speed: 8 rpm

A speed of 8 rpm is adequate for many control applications, promoting effective system performance.

On Chip Program ROM Width: 8

An 8-bit ROM width is sufficient for simple to moderate programming needs in embedded systems.

No. of I/O Lines: 48

A generous number of I/O lines allows for extensive interfacing with peripherals and components.

Technical Specifications

Microcontrollers ST72F321BJ9T3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Terminals:

44

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.8/5.5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SCI, SPI

Peripherals:

TIMER(5)

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

ST72F321BJ9T3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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