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ST72F321BAR9T6

STMicroelectronics

ST72F321BAR9T6 by STMicroelectronics

ST72F321BAR9T6 by STMicroelectronics is an 8-bit microcontroller with 64 terminals, operating at a max frequency of 16 MHz. It features 2048 bytes of RAM, 61440 ROM words, and 16 ADC channels. Ideal for industrial applications requiring I2C, SCI, and SPI connectivity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,100 parts In-Stock

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Anansix

USA . 2,433 parts In-Stock

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Chip Stock

USA . 1,125 parts In-Stock

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Digiode

USA . 815 parts In-Stock

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815

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Avant Electronics Limited

UK . 620 parts In-Stock

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620

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ComSIT USA

USA . 155 parts In-Stock

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155

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ComSIT Distribution GmbH

Germany . 152 parts In-Stock

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Lantek

USA . 2 parts In-Stock

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Distributors (Availability)

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Vigor

Singapore . 1,093 parts In-Stock

1+ parts

$7.250

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1,093

$7.250

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AZTECH Wire

Italy . 636 parts In-Stock

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$12.990

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636

$12.990

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IDEA Electronic Components Group

UK . 1,610 parts In-Stock

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$46.892

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$42.203

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$46.892

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$42.203

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Microchip USA

USA . 237 parts In-Stock

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$73.599

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MKK Technologies

India . 244 parts In-Stock

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$88.178

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DigiPath Technology Company

USA . 244 parts In-Stock

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$88.178

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244

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Component Stockers USA

USA . 629 parts In-Stock

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$99.990

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Kepictronics

USA . 13,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 7,312 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,450 parts In-Stock

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Perfect Parts

USA . 5,358 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Parana Technologies

USA . 2,111 parts In-Stock

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$56.067

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Metaverse IC Inc.

Canada . 1,120 parts In-Stock

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Corphita

USA . 799 parts In-Stock

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799

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iodParts Technologies Inc.

India . 155 parts In-Stock

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GreenTree Electronics

Israel . 30 parts In-Stock

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Overview

Upgrade your technology with the ST72F321BAR9T6 microcontroller from STMicroelectronics. This high-quality product offers a range of applications in industries such as automotive, industrial control, and consumer electronics. With its advanced features and reliable performance, this microcontroller provides value and benefits to customers looking for efficient solutions. Trust the manufacturer's reputation for excellence and choose the ST72F321BAR9T6 for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

Surface mount technology allows for easier assembly and enables miniaturization of the overall product size.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, providing flexibility in powering the microcontroller.

Package Shape: SQUARE

Square package shape is space-efficient and allows for easy placement on a circuit board.

Bit Size: 8

8-bit architecture is suitable for applications with moderate processing requirements, offering a good balance between performance and cost.

Power Supplies (V): 3.3/5

Supports multiple power supply voltages, allowing compatibility with different voltage requirements of peripherals and external components.

No. of Terminals: 64

Ample number of terminals provide versatility in connecting external devices and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack design with low profile and fine pitch enables high-density mounting on PCBs, saving space in compact designs.

Minimum Supply Voltage: 3.8 V

Low minimum supply voltage ensures efficient power consumption and operation in low-power applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the microcontroller can function reliably in harsh environments without overheating.

CPU Family: ST72

The ST72 CPU family offers a balance between performance and power efficiency, suitable for a wide range of embedded applications.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures reliable operation in extreme cold conditions, making it suitable for outdoor and industrial applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/palladium/gold terminal finish provides excellent conductivity, preventing corrosion and ensuring stable connections.

ADC Channels: YES

Built-in Analog to Digital Converters enable the microcontroller to interface with analog sensors and signals, expanding its functionality.

Terminal Position: QUAD

Quad terminal position simplifies the layout and routing of connections on the PCB, enhancing ease of use and reducing design complexity.

ROM Words: 61440

Large ROM capacity allows for storing complex code and data, making the microcontroller suitable for applications requiring extensive program memory.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and ease of soldering during assembly, ensuring reliable connections.

Maximum Clock Frequency: 16 MHz

High maximum clock frequency enables fast processing and real-time responsiveness in applications with time-critical operations.

RAM Bytes: 2048

Adequate RAM capacity for storing variables and temporary data, facilitating efficient multitasking and data processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Analog To Digital Convertors: 16-Ch 10-Bit

16-channel 10-bit ADCs provide high-resolution analog signal conversion, offering accurate measurement and control capabilities.

PWM Channels: YES

Built-in Pulse Width Modulation channels enable precise control of analog outputs, such as motor speed and LED brightness.

Connectivity: I2C, SCI, SPI

Support for I2C, SCI, and SPI interfaces allows seamless communication with external devices and peripherals, enhancing system integration and versatility.

ROM Programmability: FLASH

Flash programmable ROM provides flexibility in updating firmware and software, enabling easy maintenance and future enhancements.

No. of I/O Lines: 48

Abundance of I/O lines facilitates versatile interfacing with external devices and peripherals, enhancing the microcontroller's functionality and expandability.

Technical Specifications

Microcontrollers ST72F321BAR9T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

8 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SCI, SPI

Peripherals:

TIMER(5)

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

ST72F321BAR9T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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