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ST72F321AR9TA

STMicroelectronics

ST72F321AR9TA by STMicroelectronics

ST72F321AR9TA microcontroller from STMicroelectronics features a 5V supply, operates in -40 °C to 85 °C range, and includes 16 ADC channels. With 64 terminals and a max clock frequency of 16 MHz, it's ideal for industrial applications requiring reliable performance. Its low-profile design ensures efficient space utilization in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,384 parts In-Stock

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Digiode

USA . 1,913 parts In-Stock

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Anansix

USA . 1,783 parts In-Stock

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AZTECH Wire

Italy . 769 parts In-Stock

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$11.980

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769

$11.980

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Microchip USA

USA . 454 parts In-Stock

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$49.865

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454

$49.865

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IDEA Electronic Components Group

UK . 257 parts In-Stock

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$64.553

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$58.097

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257

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Component Stockers USA

USA . 244 parts In-Stock

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$99.990

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244

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MKK Technologies

India . 1,115 parts In-Stock

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$121.387

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$121.387

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DigiPath Technology Company

USA . 1,115 parts In-Stock

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$121.387

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QUARKTWIN TECHNOLOGY LTD

USA . 8,597 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,515 parts In-Stock

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Vigor

Singapore . 3,250 parts In-Stock

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Corphita

USA . 1,109 parts In-Stock

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Parana Technologies

USA . 199 parts In-Stock

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Kepictronics

USA . 149 parts In-Stock

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Overview

Unlock the potential of your next project with the ST72F321AR9TA microcontroller from STMicroelectronics, a trusted leader in innovation and quality. Designed for versatility and performance, this low-profile wonder excels in industrial applications, ensuring reliability even under extreme temperatures. With advanced connectivity options and powerful peripherals, it delivers unmatched value, empowering you to create smarter, more efficient solutions that stand the test of time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material ensures that the microcontroller is resistant to environmental factors, making it suitable for various applications.

Surface Mount: YES

Being surface mount compatible allows for high-density and compact designs, making the microcontroller ideal for modern electronic devices.

Maximum Supply Voltage: 5.5 V

A maximum voltage of 5.5 V ensures compatibility with a wide range of power supply configurations.

Package Shape: SQUARE

The square package shape aids in uniform heat dissipation and makes it easier to design around in PCB layouts.

Bit Size: 8

As an 8-bit microcontroller, it is efficient for handling basic control tasks while being cost-effective for many simpler applications.

Power Supplies (V): 5

Operating at 5V is a standard voltage, making it easy to integrate into existing systems without needing special power supplies.

No. of Terminals: 64

With 64 terminals, this microcontroller provides ample I/O options for complex interfacing with multiple devices and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile flatpack packaging allows for space-efficient designs, reducing the overall footprint of the electronic device.

Minimum Supply Voltage: 3.8 V

The low minimum supply voltage enhances compatibility with battery-operated devices, increasing its versatility.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C allows the microcontroller to perform reliably in relatively high-temperature environments.

CPU Family: ST72

The ST72 CPU family is known for its robust performance and is widely used in various applications, ensuring good support and resources.

Minimum Operating Temperature: -40 °C

The ability to function at -40 °C makes it suitable for use in harsh environments, including industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent corrosion resistance and enhances the reliability of the solder joints.

ADC Channels: YES

Built-in ADC channels allow for direct interfacing with analog sensors, broadening the range of applications for this microcontroller.

Terminal Position: QUAD

Quad terminal positioning enhances the device’s stability and improves electrical performance by ensuring shorter trace lengths on the PCB.

ROM Words: 61440

With 61440 ROM words, there is plenty of onboard program storage available for complex software applications.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm allows for a compact design, making it ideal for applications with strict space constraints.

Width: 10 mm

A compact width of 10 mm facilitates easy integration into space-limited environments, enhancing design flexibility.

Peripherals: TIMER(5)

Having multiple timers (5) allows for precise time management in applications that require timing operations.

Maximum Clock Frequency: 16 MHz

With a maximum clock frequency of 16 MHz, this microcontroller can handle a variety of tasks efficiently, balancing performance and power consumption.

Length: 10 mm

With a compact length of 10 mm, this microcontroller is suitable for small form factor applications and devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability and longevity in demanding environments, making it suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates a CPU, memory, and peripherals into one chip, simplifying designs and reducing component count.

No. of Timers: 5

The availability of 5 timers offers flexibility for various timing and scheduling applications, enhancing its versatility.

RAM Bytes: 2048

2048 bytes of RAM allow for more data handling and processing, making it suitable for applications that require moderate computation.

Technology: CMOS

CMOS technology offers low power consumption, making this microcontroller efficient for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide ease of soldering and improved mechanical strength, ensuring reliable connections on PCBs.

Analog To Digital Converters: 16-Ch 10-Bit

With 16 channels and 10-bit resolution, the ADC capability allows for accurate monitoring and control in a wide range of applications.

Maximum Supply Current: 15 mA

A maximum supply current of 15 mA is efficient for power-sensitive applications, allowing longer battery life.

Nominal Supply Voltage: 5 V

Operating nominally at 5V ensures compatibility with standard power supply circuits, simplifying integration.

PWM Channels: YES

The presence of PWM channels allows for precise control of motors and other actuators, making it suitable for embedded systems.

Connectivity: I2C, SCI, SPI

Offering multiple communication protocols (I2C, SCI, SPI) enhances its interoperability with various peripherals and devices.

ROM Programmability: FLASH

Flash programmability enables easy reprogramming of the ROM, facilitating product updates and modifications post-deployment.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for finer designs and more compact layouts on printed circuit boards.

Speed: 8 rpm

A speed of 8 rpm is sufficient for many automation tasks, making it versatile for various control applications.

On Chip Program ROM Width: 8

With an 8-bit program ROM width, it is designed to handle tasks efficiently, making it suitable for simple to moderately complex applications.

No. of I/O Lines: 48

The availability of 48 I/O lines provides extensive interfacing capability for various sensors, actuators, and displays.

Technical Specifications

Microcontrollers ST72F321AR9TA attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

No. of I/O Lines:

48

No. of Terminals:

64

No. of Timers:

5

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SCI, SPI

Peripherals:

TIMER(5)

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

ST72F321AR9TA Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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