Loading...

ST72F321AR7T6

STMicroelectronics

ST72F321AR7T6 by STMicroelectronics

ST72F321AR7T6 microcontroller from STMicroelectronics features a 16 MHz CPU, 64 terminals, and operates b/w -40 °C to 85°C. With 48 I/O lines and integrated ADC channels, it's ideal for industrial applications requiring reliable performance. Its compact design ensures efficient space utilization in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,326 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,326

-

-

-

-

Anansix

USA . 2,869 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,869

-

-

-

-

Digiode

USA . 206 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

206

-

-

-

-

ComSIT Distribution GmbH

Germany . 21 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

21

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,253 parts In-Stock

1+ parts

$7.470

100+ parts

-

1k+ parts

-

10k+ parts

-

1,253

$7.470

-

-

-

Microchip USA

USA . 152 parts In-Stock

1+ parts

$8.043

100+ parts

-

1k+ parts

-

10k+ parts

-

152

$8.043

-

-

-

AZTECH Wire

Italy . 364 parts In-Stock

1+ parts

$18.370

100+ parts

-

1k+ parts

-

10k+ parts

-

364

$18.370

-

-

-

IDEA Electronic Components Group

UK . 2,138 parts In-Stock

1+ parts

$53.749

100+ parts

-

1k+ parts

$48.374

10k+ parts

-

2,138

$53.749

-

$48.374

-

MKK Technologies

India . 877 parts In-Stock

1+ parts

$101.072

100+ parts

-

1k+ parts

-

10k+ parts

-

877

$101.072

-

-

-

DigiPath Technology Company

USA . 877 parts In-Stock

1+ parts

$101.072

100+ parts

-

1k+ parts

-

10k+ parts

-

877

$101.072

-

-

-

A-Z Elektronik GmbH

Germany . 5,529 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,529

-

-

-

-

Corphita

USA . 2,513 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,513

-

-

-

-

Perfect Parts

USA . 2,229 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,229

-

-

-

-

Parana Technologies

USA . 1,718 parts In-Stock

1+ parts

-

100+ parts

$64.265

1k+ parts

-

10k+ parts

-

1,718

-

$64.265

-

-

RC Electronics

USA . 960 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

960

-

-

-

-

Overview

Unlock limitless possibilities with the ST72F321AR7T6 microcontroller from STMicroelectronics, where innovation meets reliability. Designed for industrial applications, this high-performance device boasts exceptional temperature resilience and efficient power management. Benefit from advanced connectivity options, ensuring seamless integration into your projects. Trust in STMicroelectronics' legacy of quality to elevate your designs and empower your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures a robust package that can withstand environmental stresses, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for a compact design and easier automated assembly, enhancing manufacturing efficiency.

Maximum Supply Voltage: 5.5 V

The flexible maximum supply voltage offers compatibility with a wide range of power sources, providing versatility in circuit design.

Package Shape: SQUARE

The square package shape optimizes space on PCB layouts, facilitating better design and integration into compact systems.

Bit Size: 8

An 8-bit architecture is suitable for applications requiring basic control and processing capabilities, ideal for low-resource projects.

Power Supplies (V): 3.8/5.5

The ability to operate on a range from 3.8V to 5.5V increases its application possibilities in different systems.

No. of Terminals: 64

Having a larger number of terminals allows for more connectivity options and provides greater flexibility for different applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This style helps in reducing the overall footprint of the component, facilitating dense designs.

Minimum Supply Voltage: 3.8 V

Lower minimum supply voltage can be beneficial for battery-powered applications, enhancing energy efficiency.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures makes it suitable for industrial applications where thermal conditions can be harsh.

CPU Family: ST72

The ST72 CPU family offers proven performance and reliability in embedded applications.

Minimum Operating Temperature: -40 °C

Operating at low temperatures allows for deployment in extreme environments, such as automotive and outdoor applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish ensures excellent conductivity and resistance to corrosion, extending product longevity.

ADC Channels: YES

Integrated ADC channels enable easy interfacing with analog sensors, broadening the range of applications.

Terminal Position: QUAD

Quad terminal positioning allows for efficient power distribution and signal integrity on the PCB.

ROM Words: 49152

A substantial ROM size supports complex code and data storage, suitable for more sophisticated applications.

Maximum Seated Height: 1.6 mm

Low seated height contributes to a slim profile, making it an excellent choice for space-constrained designs.

Width: 10 mm

A compact width enables integration into narrow spaces, relevant in consumer electronics and portable devices.

Peripherals: POR, TIMER(5)

Integrated peripherals like power-on reset and multiple timers enhance functionality, reducing needed components.

Maximum Clock Frequency: 16 MHz

16 MHz clock frequency provides adequate processing speed for a multitude of general-purpose applications.

Maximum Time At Peak Reflow Temperature (s): 30

The reflow specification ensures compatibility with standard soldering processes, facilitating easy assembly.

Peak Reflow Temperature °C: 260

A high peak reflow temperature indicates it can endure typical soldering temperatures without damage.

Length: 10 mm

A compact length aids in reducing PCB space requirements, which is vital for modern electronic design.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability in challenging environments, appealing for industrial and automotive applications.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it is equipped for tasks like automation, control systems, and data processing in embedded systems.

RAM Bytes: 1536

Adequate RAM size supports efficient operation of embedded applications, allowing for better multitasking capabilities.

Technology: CMOS

CMOS technology benefits from low power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull-wing terminals are beneficial for wave soldering processes, enhancing manufacturing efficiency.

Analog To Digital Convertors: 16-Ch 10-Bit

Having multiple 10-bit ADC channels allows for capturing detailed sensor data, broadening application potential.

Maximum Supply Current: 15 mA

A low maximum supply current is advantageous for battery-powered applications, enhancing overall energy efficiency.

Nominal Supply Voltage: 4 V

The nominal supply voltage of 4V is ideal for maintaining stable performance in precise applications.

PWM Channels: YES

Integrated PWM channels support various applications like motor control and LED dimming, increasing functionality.

Connectivity: I2C, SCI, SPI

Multiple connectivity options facilitate seamless communication with other devices and components, enhancing versatility.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to firmware, extending product lifecycle and adaptability.

Terminal Pitch: 0.5 mm

A fine terminal pitch enables more compact PCB designs, maximizing the use of available space on the board.

Moisture Sensitivity Level (MSL): 3

Level 3 moisture sensitivity indicates standard handling practices are sufficient, easing assembly processes.

Speed: 8 rpm

An 8 rpm speed rating is suitable for many applications where high-speed operation is not critical.

On Chip Program ROM Width: 8

8-bit ROM width fits well with typical microcontroller architectures, ensuring compatibility with existing programs.

No. of I/O Lines: 48

Having 48 I/O lines enables extensive interfacing capabilities, supporting a wide array of sensors and actuators.

Technical Specifications

Microcontrollers ST72F321AR7T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.8/5.5

Qualification:

Not Qualified

RAM Bytes:

1536

ROM Words:

49152

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SCI, SPI

Peripherals:

POR, TIMER(5)

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

ST72F321AR7T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20