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ST72F321AR6TAE

STMicroelectronics

ST72F321AR6TAE by STMicroelectronics

ST72F321AR6TAE by STMicroelectronics is an 8-bit microcontroller with 5V supply, 16MHz clock frequency, and 1024 bytes of RAM. Ideal for industrial applications, it features 16-Ch ADC, FLASH ROM programmability, and connectivity via I2C, SCI, SPI interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,703 parts In-Stock

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8,703

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Anansix

USA . 2,670 parts In-Stock

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2,670

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Digiode

USA . 2,002 parts In-Stock

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2,002

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Distributors (Availability)

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AZTECH Wire

Italy . 594 parts In-Stock

1+ parts

$18.820

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594

$18.820

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IDEA Electronic Components Group

UK . 1,835 parts In-Stock

1+ parts

$25.609

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-

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$23.048

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1,835

$25.609

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$23.048

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MKK Technologies

India . 1,269 parts In-Stock

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$48.156

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1,269

$48.156

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DigiPath Technology Company

USA . 1,269 parts In-Stock

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$48.156

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1,269

$48.156

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QUARKTWIN TECHNOLOGY LTD

USA . 11,473 parts In-Stock

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11,473

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Vigor

Singapore . 4,200 parts In-Stock

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Microchip USA

USA . 4,007 parts In-Stock

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4,007

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Parana Technologies

USA . 1,805 parts In-Stock

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$30.620

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1,805

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$30.620

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Corphita

USA . 1,226 parts In-Stock

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Overview

Experience the seamless integration and high performance of the ST72F321AR6TAE microcontroller by STMicroelectronics. Crafted with precision and reliability, this microcontroller is designed to meet the demands of industrial applications. With its advanced features and versatile connectivity options including I2C, SCI, and SPI, the ST72F321AR6TAE offers unparalleled value and benefits to customers looking for a superior solution. Trust in STMicroelectronics' expertise and innovation to elevate your projects to new heights with the ST72F321AR6TAE microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for various application environments.

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 5.5 V

Provides flexibility in power supply options while ensuring safe operation within recommended voltage limits.

Bit Size: 8

Offers a good balance between processing capabilities and cost efficiency for general purpose microcontroller applications.

No. of Terminals: 64

Provides ample connectivity options for interfacing with external devices and peripherals.

Minimum Supply Voltage: 3.8 V

Allows for operation under lower power supply conditions, increasing energy efficiency and potential battery-operated applications.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in a wide range of operating temperatures, suitable for industrial and harsh environments.

CPU Family: ST72

Comes from a reputable and reliable microcontroller manufacturer, ensuring quality and support for the product.

ADC Channels: YES

Enables analog-to-digital conversion for sensing and measuring external signals, expanding the functionality of the microcontroller.

ROM Words: 32768

Provides sufficient memory for storing program code and data, accommodating complex applications and algorithms.

Maximum Seated Height: 1.6 mm

Low profile design allows for compact and slim form factor applications, saving space in products.

Peripheral IC Type: MICROCONTROLLER

Clearly identifies the product as a microcontroller, ensuring compatibility with development tools and software.

PWM Channels: YES

Supports pulse-width modulation for applications requiring precise control over analog signals, such as motor speed control and LED dimming.

Connectivity: I2C, SCI, SPI

Offers versatile communication options for interfacing with a wide range of sensors, displays, and other devices.

No. of I/O Lines: 48

Provides ample input/output options for connecting to external devices and peripherals, expanding the capabilities of the microcontroller.

Technical Specifications

Microcontrollers ST72F321AR6TAE attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

48

No. of Terminals:

64

No. of Timers:

5

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SCI, SPI

Peripherals:

TIMER(5)

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

ST72F321AR6TAE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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