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ST72F321AR6TA

STMicroelectronics

ST72F321AR6TA by STMicroelectronics

ST72F321AR6TA microcontroller from STMicroelectronics features a 5V supply, 64 terminals, and operates in -40 °C to 85 °C. With 32KB ROM and 1KB RAM, it supports I2C, SPI connectivity for industrial applications. Its low-profile design ensures efficient space utilization.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,127 parts In-Stock

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Vyrian

USA . 2,749 parts In-Stock

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2,749

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Anansix

USA . 507 parts In-Stock

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507

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Microchip USA

USA . 356 parts In-Stock

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$5.573

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356

$5.573

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AZTECH Wire

Italy . 1,017 parts In-Stock

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$18.880

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$18.880

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IDEA Electronic Components Group

UK . 646 parts In-Stock

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$31.605

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$28.444

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646

$31.605

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$28.444

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MKK Technologies

India . 1,254 parts In-Stock

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$59.431

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$59.431

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DigiPath Technology Company

USA . 1,254 parts In-Stock

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$59.431

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$59.431

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Component Stockers USA

USA . 448 parts In-Stock

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$99.990

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$99.990

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Vigor

Singapore . 5,907 parts In-Stock

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Corphita

USA . 4,122 parts In-Stock

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Kepictronics

USA . 960 parts In-Stock

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Parana Technologies

USA . 777 parts In-Stock

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$37.788

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Overview

Unlock limitless possibilities with the ST72F321AR6TA microcontroller from STMicroelectronics, a trusted leader in high-quality semiconductor solutions. Designed for reliability and performance, this versatile microcontroller excels in industrial applications, offering exceptional processing power and integrated features tailored for your needs. Experience unmatched efficiency, robust connectivity, and long-term value that enhances your projects, ensuring they thrive in any environment.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material provides good protection and insulation, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of PCB space.

Maximum Supply Voltage: 5.5 V

This voltage range provides flexibility for various power supply options.

Package Shape: SQUARE

A square shape helps in even heat distribution and effective mounting on PCBs.

Bit Size: 8

An 8-bit architecture is efficient for simple control tasks and is widely supported.

Power Supplies: 5 V

A common supply voltage that simplifies integration with other components.

No. of Terminals: 64

A higher number of terminals allows for greater connectivity and flexibility in design.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This style is ideal for compact applications where space is a premium.

Minimum Supply Voltage: 3.8 V

Allows for operation in lower voltage environments, enhancing versatility.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments where higher temperatures may be encountered.

CPU Family: ST72

This family is known for reliability and support, making it a trusted choice among manufacturers.

Minimum Operating Temperature: -40 °C

This range makes it suitable for harsh environments and outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish enhances corrosion resistance and improves solderability.

ADC Channels: YES

Presence of ADC channels allows for analog data processing, making it versatile for sensor applications.

Terminal Position: QUAD

Quad terminal positioning enhances connection stability and supports fine pitch mounting.

ROM Words: 32768

A considerable amount of ROM allows for storing complex programs and data.

Maximum Seated Height: 1.6 mm

Low profile design minimizes space requirements, suitable for sleek applications.

Width: 10 mm

Compact width facilitates integration into smaller devices.

Peripherals: TIMER(5)

Multiple timers provide enhanced timing functionalities for various applications.

Maximum Clock Frequency: 16 MHz

A relatively high clock frequency enables faster processing and responsiveness.

Length: 10 mm

This compact length supports space-constrained designs.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring reliability in tough conditions.

Peripheral IC Type: MICROCONTROLLER

Microcontroller type provides robust computing capabilities for control and automation.

No. of Timers: 5

Having multiple timers grants developers enhanced scheduling and timing options.

RAM Bytes: 1024

Adequate RAM for storing data during operations, essential for complex tasks.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing leads promote ease of soldering and better heat dissipation.

Analog To Digital Convertors: 16-Ch 10-Bit

High number of ADCs allows for many analog inputs, crucial for sensor-rich applications.

Maximum Supply Current: 15 mA

Low current consumption keeps power requirements minimal, ideal for battery-operated devices.

Nominal Supply Voltage: 5 V

Standard operating voltage simplifies design and integration with existing systems.

PWM Channels: YES

PWM capability allows for efficient motor control and other applications requiring duty cycle modulation.

Connectivity: I2C, SCI, SPI

Diverse communication interfaces enhance connectivity with other devices and systems.

ROM Programmability: FLASH

Flash programmability allows for easy updating and reprogramming of firmware.

Terminal Pitch: 0.5 mm

Fine pitch is suitable for high-density PCB layouts, making this microcontroller ideal for advanced designs.

Speed: 8 rpm

This speed specification suggests suitability for slow-speed applications, enhancing control.

On Chip Program ROM Width: 8

An 8-bit ROM width aligns with the microcontroller's architecture, ensuring efficient data handling.

No. of I/O Lines: 48

A high number of I/O lines allows for comprehensive interfacing with multiple devices and peripherals.

Technical Specifications

Microcontrollers ST72F321AR6TA attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

No. of I/O Lines:

48

No. of Terminals:

64

No. of Timers:

5

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SCI, SPI

Peripherals:

TIMER(5)

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

ST72F321AR6TA Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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