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ST72F262G2B6

STMicroelectronics

ST72F262G2B6 by STMicroelectronics

ST72F262G2B6 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, operating b/w 3.3V and 5.5V. It includes 8192 words of FLASH ROM and supports up to 6 ADC channels, ideal for industrial applications. Its compact design ensures efficient performance in various embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,110 parts In-Stock

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Digiode

USA . 4,955 parts In-Stock

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4,955

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Anansix

USA . 1,579 parts In-Stock

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1,579

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ComSIT Distribution GmbH

Germany . 400 parts In-Stock

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400

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Distributors (Availability)

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Microchip USA

USA . 421 parts In-Stock

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$3.548

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421

$3.548

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AZTECH Wire

Italy . 697 parts In-Stock

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$18.320

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697

$18.320

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IDEA Electronic Components Group

UK . 576 parts In-Stock

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$34.207

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$30.786

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576

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$30.786

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MKK Technologies

India . 1,062 parts In-Stock

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$64.323

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$64.323

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DigiPath Technology Company

USA . 1,062 parts In-Stock

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$64.323

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$64.323

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Component Stockers USA

USA . 709 parts In-Stock

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$99.990

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709

$99.990

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A-Z Elektronik GmbH

Germany . 6,486 parts In-Stock

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Vigor

Singapore . 6,000 parts In-Stock

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Corphita

USA . 3,261 parts In-Stock

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Parana Technologies

USA . 2,044 parts In-Stock

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$40.899

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Assy Fe

Spain . 1,920 parts In-Stock

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Kepictronics

USA . 746 parts In-Stock

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Overview

Unlock the power of innovation with the ST72F262G2B6 microcontroller from STMicroelectronics. Renowned for their commitment to quality and reliability, STMicroelectronics delivers a versatile solution perfect for industrial automation, consumer electronics, and automotive applications. Enjoy enhanced performance with low power consumption, ensuring longevity and efficiency in your designs. Choose ST72F262G2B6 for a seamless blend of cutting-edge technology and exceptional value, tailored to elevate your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides durability and protection against environmental factors, making it suitable for various applications.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with most common power supplies while maintaining safety margins.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient board layout and space utilization in electronic designs.

Bit Size: 8

An 8-bit architecture enables the microcontroller to handle a wide range of applications, especially in control and communication tasks.

Power Supplies (V): 3/5

Supports both 3V and 5V power supplies, providing design flexibility for various applications.

No. of Terminals: 32

With 32 terminals, this microcontroller offers ample connectivity options for input and output, enhancing its versatility.

Package Style (Meter): IN-LINE, SHRINK PITCH

In-line, shrink pitch package style allows for easier integration into compact circuits with limited space.

Minimum Supply Voltage: 3.3 V

The minimum supply voltage of 3.3 V supports low-power applications, making it energy-efficient.

Maximum Operating Temperature: 85 °C

Rated for a maximum operating temperature of 85 °C, it can be used in industrial environments without failure.

CPU Family: ST72

Based on the ST72 CPU family, it offers reliable performance and is backed by widespread support and resources.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this microcontroller ideal for harsh environments, including outdoor and industrial applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish enhances solderability and helps prevent corrosion, ensuring long-term reliability.

ADC Channels: YES

Incorporating ADC channels allows the microcontroller to interface with analog sensors directly, expanding its functionality.

Terminal Position: DUAL

Dual terminal positioning facilitates flexible mounting options, making installation easier.

ROM Words: 8192

With 8192 ROM words, it provides sufficient memory for storing complex programs while ensuring code efficiency.

Maximum Seated Height: 5.08 mm

A low seated height of 5.08 mm allows for compact circuit designs without compromising performance.

Width: 10.16 mm

The width of 10.16 mm ensures compatibility with space-constrained applications while maintaining functionality.

Peripherals: TIMER(4)

Featuring 4 timers enhances capability for precise timing and event control in various applications.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz provides sufficient processing power for most control applications.

Length: 27.94 mm

Compact length of 27.94 mm accommodates space-restricted designs while providing essential functionality.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures reliable performance in demanding environments.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller peripheral IC, it adds intelligent control capabilities to a variety of electronic systems.

RAM Bytes: 256

With 256 RAM bytes, it offers sufficient memory for efficient data processing and code execution.

Technology: CMOS

CMOS technology contributes to low power consumption and high noise immunity, making it suitable for battery-operated devices.

Terminal Form: THROUGH-HOLE

Through-hole terminal form simplifies assembly processes, particularly in DIY and prototyping environments.

Analog To Digital Convertors: 6-Ch 10-Bit

Includes a 6-channel 10-bit ADC, allowing for precise measurements from multiple sensors simultaneously.

Maximum Supply Current: 11 mA

A maximum supply current of 11 mA indicates low power consumption, suitable for mobile and battery-powered applications.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V makes it compatible with standard digital circuits.

PWM Channels: YES

Support for PWM channels enables effective control of motors and other devices requiring variable power.

Connectivity: SPI

SPI connectivity allows for fast data transfer rates between the microcontroller and other devices, enhancing performance.

ROM Programmability: FLASH

Flash ROM programmability allows for easy code updates and reprogramming, leading to longer product life cycles.

Terminal Pitch: 1.778 mm

A terminal pitch of 1.778 mm is optimal for modern PCB designs, facilitating denser layouts.

Speed: 16 rpm

Operational speed of 16 rpm is suitable for applications requiring moderate processing capability.

On Chip Program ROM Width: 8

An 8-bit wide on-chip program ROM allows for efficient instruction processing and greater design simplicity.

No. of I/O Lines: 22

With 22 I/O lines, this microcontroller supports a broad range of interfacing requirements for various applications.

Technical Specifications

Microcontrollers ST72F262G2B6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T32

JESD-609 Code:

e3

Length:

27.94 mm

No. of I/O Lines:

22

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP32,.4

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

5.08 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

10.16 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SPI

Peripherals:

TIMER(4)

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

ST72F262G2B6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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