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ST72F262G1M6

STMicroelectronics

ST72F262G1M6 by STMicroelectronics

ST72F262G1M6 microcontroller from STMicroelectronics features an 8-bit CPU, operates at 3.3-5.5V, and includes 6 ADC channels for precise data conversion. With a max clock frequency of 16 MHz and industrial-grade temperature range (-40 °C to 85 °C), it's ideal for embedded applications. Its compact SO package (28 terminals) ensures efficient space utilization in designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,989 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,334 parts In-Stock

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Anansix

USA . 2,230 parts In-Stock

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Digiode

USA . 1,849 parts In-Stock

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ComSIT USA

USA . 1,010 parts In-Stock

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R&J Components

USA . 690 parts In-Stock

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Zilex Electronics Inc.

Canada . 56 parts In-Stock

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Distributors (Availability)

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Vigor

Singapore . 8,295 parts In-Stock

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$6.800

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8,295

$6.800

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IDEA Electronic Components Group

UK . 998 parts In-Stock

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$16.752

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$15.077

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998

$16.752

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$15.077

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AZTECH Wire

Italy . 210 parts In-Stock

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$20.120

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210

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Microchip USA

USA . 214 parts In-Stock

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$30.225

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MKK Technologies

India . 269 parts In-Stock

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$31.502

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DigiPath Technology Company

USA . 269 parts In-Stock

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$31.502

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Component Stockers USA

USA . 565 parts In-Stock

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$99.990

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Perfect Parts

USA . 2,007 parts In-Stock

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Corphita

USA . 1,634 parts In-Stock

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Parana Technologies

USA . 1,450 parts In-Stock

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$20.030

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Assy Fe

Spain . 51 parts In-Stock

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Overview

Unlock innovation with the ST72F262G1M6 microcontroller from STMicroelectronics, a leader renowned for quality and reliability. Designed for industrial applications, this compact powerhouse delivers exceptional performance in automation, control systems, and consumer electronics. With advanced features like integrated ADCs and timers, it ensures seamless connectivity and efficiency. Experience superior durability, low power consumption, and versatility that elevate your projects to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides robustness, making it suitable for various applications.

Surface Mount: YES

Supports modern manufacturing techniques, allowing for a compact design and efficient placement on PCBs.

Maximum Supply Voltage: 5.5 V

Wide voltage tolerance enables versatility in power sourcing for different applications.

Package Shape: RECTANGULAR

Rectangular package shape optimizes space utilization on the circuit board.

Bit Size: 8

8-bit architecture is suitable for a wide range of simple control tasks, lowering complexity.

Power Supplies (V): 3/5

Supports dual voltage supply (3V and 5V), enhancing flexibility for different system designs.

No. of Terminals: 28

28 terminals allow for a greater number of input/output connections, enhancing functionality.

Package Style (Meter): SMALL OUTLINE

Small outline package helps reduce space requirements on PCBs, ideal for compact designs.

Minimum Supply Voltage: 3.3 V

Lower supply voltage increases energy efficiency, ideal for battery-powered devices.

Maximum Operating Temperature: 85 °C

Higher operating temperature rating allows the microcontroller to function in demanding environments.

CPU Family: ST72

Well-known CPU family offers reliable performance and long-term availability.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures reliability in extreme conditions, suitable for industrial applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality finish ensures excellent solderability and enhances corrosion resistance.

ADC Channels: YES

Presence of ADC channels allows for straightforward analog signal processing.

Terminal Position: DUAL

Dual terminal position provides flexibility in layout design, improving connectivity options.

ROM Words: 4096

Adequate ROM capacity for storing essential firmware or application code.

Maximum Seated Height: 2.65 mm

Low profile minimizes height constraints in design, especially in compact applications.

Width: 7.5 mm

Narrow width contributes to space-saving designs, ideal for PCB layouts.

Peripherals: TIMER(4)

Multiple timer peripherals allow for sophisticated timing operations and event management.

Maximum Clock Frequency: 16 MHz

16 MHz clock speed ensures sufficient processing power for various applications.

Maximum Time At Peak Reflow Temperature (s): 30

Adheres to industry standards for assembly, ensuring reliable solder connections.

Peak Reflow Temperature °C: 250

High peak reflow temperature tolerance supports compatibility with standard soldering processes.

Length: 17.9 mm

Compact length helps in reducing overall size of the product, suitable for space-constrained designs.

Temperature Grade: INDUSTRIAL

Industrial grade assessment guarantees durability and reliability in harsh environments.

Peripheral IC Type: MICROCONTROLLER

Designed specifically as a microcontroller, providing optimal performance for control applications.

RAM Bytes: 256

256 bytes of RAM offers adequate temporary storage for efficient operation of embedded applications.

Technology: CMOS

CMOS technology ensures low power consumption, enhancing battery life in portable devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and provide a reliable electrical connection.

Analog To Digital Convertors: 6-Ch 10-Bit

6 channel 10-bit ADC empowers the microcontroller to handle multiple analog inputs effectively.

Maximum Supply Current: 11 mA

Low maximum current draw contributes to energy-efficient designs, especially in battery-operated devices.

Nominal Supply Voltage: 5 V

Standard 5V operation is common in many applications, simplifying design compatibility.

PWM Channels: YES

PWM channel availability supports motor control and dimming applications, enhancing versatility.

Connectivity: SPI

SPI connectivity provides high-speed communication with other devices, improving system performance.

ROM Programmability: FLASH

Flash programmability allows for easy updating and reprogramming of firmware.

Terminal Pitch: 1.27 mm

1.27 mm pitch helps with soldering precision and compatibility with standard PCB designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating ensures adequate handling requirements for moisture-sensitive components.

Speed: 16 rpm

Moderate speed capability makes it suitable for various applications where quick response is needed.

On Chip Program ROM Width: 8

8-bit program ROM width allows efficient execution of control logic in embedded applications.

No. of I/O Lines: 22

22 I/O lines offer ample interfacing possibilities with sensors and other peripherals, enhancing functionality.

Technical Specifications

Microcontrollers ST72F262G1M6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

22

No. of Terminals:

28

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SPI

Peripherals:

TIMER(4)

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

ST72F262G1M6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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