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ST72C314J4T6

STMicroelectronics

ST72C314J4T6 by STMicroelectronics

ST72C314J4T6 microcontroller from STMicroelectronics features an 8-bit CPU, operates b/w -40 °C to 85 °C, and includes 16KB of FLASH ROM. Ideal for industrial applications, it comes in a square flatpack with 44 terminals. Its CMOS technology ensures efficient performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Vyrian

USA . 4,319 parts In-Stock

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Anansix

USA . 2,437 parts In-Stock

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Bristol Electronics

USA . 314 parts In-Stock

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ComSIT Distribution GmbH

Germany . 80 parts In-Stock

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ComSIT USA

USA . 80 parts In-Stock

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Digiode

USA . 76 parts In-Stock

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J2 Sourcing AB

Sweden . 40 parts In-Stock

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Zilex Electronics Inc.

Canada . 22 parts In-Stock

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Microchip USA

USA . 466 parts In-Stock

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$10.309

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AZTECH Wire

Italy . 1,054 parts In-Stock

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$10.830

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IDEA Electronic Components Group

UK . 1,713 parts In-Stock

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$56.902

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$51.212

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Component Stockers USA

USA . 321 parts In-Stock

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$99.990

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MKK Technologies

India . 2,266 parts In-Stock

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DigiPath Technology Company

USA . 2,266 parts In-Stock

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Vigor

Singapore . 4,950 parts In-Stock

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Assy Fe

Spain . 4,482 parts In-Stock

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RC Electronics

USA . 3,573 parts In-Stock

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Corphita

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

Germany . 1,964 parts In-Stock

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Kepictronics

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Parana Technologies

USA . 927 parts In-Stock

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

UK . 36 parts In-Stock

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Overview

Unlock the potential of your projects with the ST72C314J4T6 microcontroller from STMicroelectronics, a leader in innovation and quality. Designed for industrial applications, this robust 8-bit MCU delivers reliability across temperature extremes, ensuring peak performance under pressure. With its compact design and superior power efficiency, it empowers engineers to create cutting-edge solutions that stand out, driving your success in today’s competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and improved performance due to shorter electrical paths.

Package Shape: SQUARE

A square package shape helps in uniform heat distribution and optimizes space on printed circuit boards.

Bit Size: 8

An 8-bit architecture is ideal for simpler applications, providing a balance between processing power and energy efficiency.

Power Supplies (V): 3.5/5.5

The versatile power supply range enables compatibility with a wide variety of systems, enhancing usability.

No. of Terminals: 44

A higher number of terminals allows for more input/output options, making it suitable for complex applications.

Package Style (Meter): FLATPACK

The flatpack style leads to better heat dissipation and mounting efficiency, enhancing the stability of the microcontroller.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this microcontroller is reliable in environments with moderate heat.

CPU Family: ST72

The ST72 CPU family is known for its efficiency in various embedded applications, ensuring performance and reliability.

Minimum Operating Temperature: -40 °C

This microcontroller can operate in extremely low temperatures, making it suitable for harsh environments.

Terminal Finish: MATTE TIN

Matte tin finish provides excellent solderability and corrosion resistance, enhancing the overall durability of the product.

Terminal Position: QUAD

Quad terminal positioning facilitates easier connections and improves layout flexibility on circuit boards.

ROM Words: 16384

With 16,384 ROM words, there is ample space for program storage, allowing complex applications to be developed.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds ensures that the microcontroller does not suffer thermal damage during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance indicates compatibility with modern soldering processes.

Temperature Grade: INDUSTRIAL

The industrial temperature grade signifies robustness and suitability for demanding applications.

RAM Bytes: 512

512 bytes of RAM supports moderate data processing needs, making it efficient for a variety of tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall device reliability.

Terminal Form: GULL WING

Gull wing terminals provide excellent solder joint strength and ensure reliable electrical connections.

ROM Programmability: FLASH

Flash memory programmability ensures quick updates and easier field reprogramming in diverse applications.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch allows for a compact design while maintaining ease of soldering and assembly.

Moisture Sensitivity Level (MSL): 3

An MSL level of 3 indicates the product has moderate moisture sensitivity, making it manageable during storage and handling.

Speed: 8 rpm

With a speed rating of 8 rpm, this microcontroller can handle basic I/O operations efficiently, suitable for many embedded applications.

Technical Specifications

Microcontrollers ST72C314J4T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

Bit Size:

8

CPU Family:

ST72

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.5/5.5

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

16384

ROM Programmability:

FLASH

Speed:

8 rpm

Sub-Category:

Microcontrollers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

ST72C314J4T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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