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ST62T65CB6

STMicroelectronics

ST62T65CB6 by STMicroelectronics

ST62T65CB6 by STMicroelectronics is an 8-bit microcontroller with 3.3/5V power supplies, 128 bytes RAM, and 21 I/O lines. It operates at a max clock frequency of 8MHz and has OTPROM ROM programmability. Ideal for industrial applications requiring a reliable microcontroller with PWM channels and ADC capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,197 parts In-Stock

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6,197

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Digiode

USA . 4,870 parts In-Stock

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4,870

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Anansix

USA . 1,880 parts In-Stock

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1,880

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Cyclops Electronics Ltd

UK . 723 parts In-Stock

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723

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Chip Stock

USA . 658 parts In-Stock

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658

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GES GmbH

Germany . 8 parts In-Stock

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8

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LittleDiode

UK . 3 parts In-Stock

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3

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Distributors (Availability)

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AZTECH Wire

Italy . 132 parts In-Stock

1+ parts

$8.570

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-

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132

$8.570

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IDEA Electronic Components Group

UK . 182 parts In-Stock

1+ parts

$72.074

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$64.866

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182

$72.074

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$64.866

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Component Stockers USA

USA . 287 parts In-Stock

1+ parts

$99.990

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287

$99.990

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Microchip USA

USA . 186 parts In-Stock

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$121.534

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186

$121.534

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MKK Technologies

India . 836 parts In-Stock

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$135.530

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836

$135.530

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DigiPath Technology Company

USA . 836 parts In-Stock

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$135.530

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836

$135.530

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Authorized Procurement Solutions

USA . 8,970 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,085 parts In-Stock

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Corphita

USA . 4,603 parts In-Stock

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Kepictronics

USA . 4,045 parts In-Stock

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Perfect Parts

USA . 2,215 parts In-Stock

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2,215

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Parana Technologies

USA . 1,820 parts In-Stock

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$86.175

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$86.175

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Vigor

Singapore . 1,518 parts In-Stock

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1,518

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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iodParts Technologies Inc.

India . 10 parts In-Stock

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10

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Overview

Discover the ST62T65CB6 by STMicroelectronics, a top-of-the-line microcontroller that offers unparalleled quality and performance. Crafted by a renowned manufacturer, this microcontroller is perfect for a wide range of applications. With its advanced features and cutting-edge technology, this product provides customers with exceptional value and benefits. Experience the advantages of the ST62T65CB6 and take your projects to the next level with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the microcontroller.

Maximum Supply Voltage: 6 V

Allows for flexibility in power supply options and compatibility with a wide range of peripherals.

Package Shape: RECTANGULAR

Saves space and allows for easier integration into circuit designs.

Bit Size: 8

Offers a good balance between performance and power efficiency for a variety of applications.

Power Supplies (V): 3.3/5

Can be powered by both standard 5V and lower power 3.3V supplies, increasing compatibility.

ADC Channels: YES

Enables analog to digital conversion, allowing the microcontroller to interact with analog sensors and devices.

ROM Words: 3884

Provides ample storage for program code, allowing for complex tasks to be executed efficiently.

RAM Bytes: 128

Sufficient RAM for storing variables and temporary data during program execution.

Maximum Clock Frequency: 8 MHz

Offers high processing speed for quick response to input signals and efficient execution of tasks.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments with wide temperature ranges and harsh conditions.

Technical Specifications

Microcontrollers ST62T65CB6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 3V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST6200

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e3

Length:

37.4 mm

No. of I/O Lines:

21

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

128

ROM Words:

3884

ROM Programmability:

OTPROM

Maximum Seated Height:

6.35 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

7 mA

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

3.6 V

Nominal Supply Voltage:

4 V

Surface Mount:

NO

Technology:

HCMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Peripheral IC Type:

Trade Compliance

ST62T65CB6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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