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ST6200CBN6/CCC

STMicroelectronics

ST6200CBN6/CCC by STMicroelectronics

ST6200CBN6/CCC by STMicroelectronics is an 8-bit microcontroller with 1024 ROM words, 64 RAM bytes, and 14 I/O lines. Operating at a max clock frequency of 8 MHz, it is suitable for industrial applications requiring a small outline package with shrink pitch. With a supply voltage range of 3.6V to 5V and operating temperature from -40 °C to +85°C, this microcontroller offers versatile performance in various embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,684 parts In-Stock

1+ parts

-

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2,684

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Digiode

USA . 1,985 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,985

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Anansix

USA . 298 parts In-Stock

1+ parts

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298

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 854 parts In-Stock

1+ parts

$75.856

100+ parts

-

1k+ parts

$68.270

10k+ parts

-

854

$75.856

-

$68.270

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MKK Technologies

India . 1,266 parts In-Stock

1+ parts

$142.642

100+ parts

-

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10k+ parts

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1,266

$142.642

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DigiPath Technology Company

USA . 1,266 parts In-Stock

1+ parts

$142.642

100+ parts

-

1k+ parts

-

10k+ parts

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1,266

$142.642

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Corphita

USA . 2,409 parts In-Stock

1+ parts

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2,409

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Parana Technologies

USA . 1,372 parts In-Stock

1+ parts

-

100+ parts

$90.697

1k+ parts

-

10k+ parts

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1,372

-

$90.697

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Overview

Unlock the power of innovation with the ST6200CBN6/CCC microcontroller by STMicroelectronics. Crafted with precision and expertise, this versatile product offers endless possibilities for a wide range of applications. From smart home devices to automotive electronics, this microcontroller provides exceptional performance and reliability. Experience seamless integration and enhanced functionality with the advanced features of this product. Elevate your projects and bring your ideas to life with the ST6200CBN6/CCC microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and reliability, making the product suitable for various industrial applications.

Surface Mount: YES

Surface mount technology allows for space-saving and efficient PCB design, enabling compact and high-density circuitry.

Maximum Supply Voltage: 6 V

Supports a higher supply voltage range, providing flexibility in power supply options for different application requirements.

Bit Size: 8

8-bit processing capability offers a good balance between performance and cost, suitable for many embedded control applications.

Power Supplies (V): 3.3/5

Supports multiple voltage options, allowing for compatibility with different power sources and peripherals.

No. of Terminals: 16

Sufficient number of terminals for interfacing with external devices and components, enhancing the connectivity and functionality of the product.

Maximum Operating Temperature: 85 °C

High operating temperature range makes the product suitable for industrial environments with harsh conditions.

CPU Family: ST6200

Belonging to the ST6200 CPU family ensures compatibility with existing software and development tools, facilitating ease of integration.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, the product integrates multiple peripheral functions into a single chip, simplifying system design and reducing component count.

RAM Bytes: 64

A decent amount of RAM allows for efficient data processing and storage, enabling complex algorithms and multitasking capabilities.

Speed: 8 rpm

Operating at 8 rpm speed ensures smooth and responsive performance for real-time control applications.

No. of I/O Lines: 14

With 14 I/O lines, the product offers flexibility in interfacing with external devices and sensors, enabling a wide range of control and communication options.

Technical Specifications

Microcontrollers ST6200CBN6/CCC attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST6200

Maximum Clock Frequency:

8 MHz

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

6.2 mm

No. of I/O Lines:

14

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

64

ROM Words:

1024

ROM Programmability:

MROM

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

4.8 mA

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

3.6 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Peripheral IC Type:

Trade Compliance

ST6200CBN6/CCC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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