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ST6220BM1

STMicroelectronics

ST6220BM1 by STMicroelectronics

ST6220BM1 by STMicroelectronics is an 8-bit microcontroller with 4096 ROM words and 64 RAM words. It operates at a max clock frequency of 8 MHz, suitable for low power applications. With ADC channels and dual terminal position, it's ideal for commercial-grade projects requiring a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,617 parts In-Stock

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2,617

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Digiode

USA . 1,363 parts In-Stock

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1,363

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Vyrian

USA . 833 parts In-Stock

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833

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Ampacity Inc.

Singapore . 382 parts In-Stock

1+ parts

$11.000

100+ parts

-

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382

$11.000

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AZTECH Wire

Italy . 362 parts In-Stock

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$11.636

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362

$11.636

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IDEA Electronic Components Group

UK . 737 parts In-Stock

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$32.714

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-

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$29.443

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737

$32.714

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$29.443

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MKK Technologies

India . 1,525 parts In-Stock

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$61.517

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1,525

$61.517

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DigiPath Technology Company

USA . 1,525 parts In-Stock

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$61.517

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1,525

$61.517

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Argo Parts USA

USA . 3,004 parts In-Stock

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3,004

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Continental Prestige Electronics

USA . 1,486 parts In-Stock

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1,486

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Corphita

USA . 942 parts In-Stock

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942

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Aranea Global

USA . 500 parts In-Stock

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500

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Parana Technologies

USA . 433 parts In-Stock

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$39.115

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433

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$39.115

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Overview

Unlock the potential of your next project with the ST6220BM1 microcontroller by STMicroelectronics. Designed with the highest quality standards, this versatile component offers unrivaled performance and reliability for a wide range of applications. With its advanced features and cutting-edge technology, the ST6220BM1 delivers exceptional value and benefits to customers looking for a powerful and efficient solution. Trust in STMicroelectronics' expertise and innovation to take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Surface mount capability offers ease of PCB assembly and allows for compact design of electronic products.

Maximum Supply Voltage: 6 V

With a maximum supply voltage of 6V, this microcontroller can handle a wide range of power sources.

On Chip Data RAM Width: 8

Having a data RAM width of 8 enhances data processing capabilities and enables efficient operation of the microcontroller.

Package Shape: RECTANGULAR

The rectangular package shape makes it easy to integrate the microcontroller into different electronic systems.

Bit Size: 8

An 8-bit size allows for precise and efficient processing of data within the microcontroller.

No. of Terminals: 20

Having 20 terminals provides ample connectivity options for interfacing with external devices and components.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps in saving space on the PCB and enables a more compact design for the overall product.

Minimum Supply Voltage: 4.5 V

With a minimum supply voltage of 4.5V, this microcontroller can operate efficiently even in lower power conditions.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C allows the microcontroller to function in colder environments without any issues.

ADC Channels: YES

Having ADC channels enables the microcontroller to convert analog signals to digital data, expanding its range of applications.

Terminal Position: DUAL

Dual terminal position offers flexibility in connecting the microcontroller to external devices and peripherals.

ROM Words: 4096

With 4096 ROM words, the microcontroller can store a large amount of program data for executing various tasks efficiently.

RAM Words: 64

64 RAM words provide sufficient memory for temporary data storage during operation, enhancing the microcontroller's processing speed.

Maximum Clock Frequency: 8 MHz

An 8 MHz maximum clock frequency allows for fast and responsive operation of the microcontroller.

Temperature Grade: COMMERCIAL

Being a commercial-grade microcontroller, it meets industry standards for temperature tolerance and performance reliability.

Peripheral IC Type: MICROCONTROLLER

Designed as a microcontroller, this product offers integrated peripherals for handling a wide range of tasks within electronic systems.

Technology: CMOS

Using CMOS technology ensures low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering onto the PCB, enhancing the manufacturing process.

Nominal Supply Voltage: 5 V

Having a nominal supply voltage of 5V makes this microcontroller compatible with standard power sources and voltage levels.

ROM Programmability: MROM

MROM programmability ensures that the program data stored in ROM is secure and cannot be easily modified, enhancing system reliability.

Format: FIXED POINT

Operating in a fixed-point format allows for precise mathematical calculations and data processing within the microcontroller.

Speed: 8 rpm

With a speed of 8 rpm, this microcontroller can execute tasks efficiently and meet the performance requirements of various applications.

Low Power Mode: YES

Low power mode capability helps in reducing power consumption during idle or low activity periods, increasing energy efficiency.

On Chip Program ROM Width: 8

An on-chip program ROM width of 8 enhances program storage capacity and ensures efficient execution of tasks by the microcontroller.

No. of I/O Lines: 12

Having 12 I/O lines provides ample connectivity options for interfacing with external devices and sensors, making the microcontroller versatile in its applications.

Technical Specifications

Microcontrollers ST6220BM1 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

3 TO 6 V @ 2 MHZ; ROM PROTECT; USER SELECTABLE DATA ROM

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

Low Power Mode:

YES

No. of DMA Channels:

0

No. of External Interrupts:

1

No. of I/O Lines:

12

No. of Serial I/Os:

0

No. of Terminals:

20

No. of Timers:

1

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

RAM Words:

64

ROM Words:

4096

ROM Programmability:

MROM

Speed:

8 rpm

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

ST6220BM1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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