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ST6220BM6

STMicroelectronics

ST6220BM6 by STMicroelectronics

ST6220BM6 by STMicroelectronics is an 8-bit microcontroller with 4096 ROM words and 64 RAM words. It operates at a max clock frequency of 8 MHz, suitable for industrial applications requiring low power mode. With a supply voltage range of 4.5V to 6V, it features dual terminal position and Gull Wing form factor for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,950 parts In-Stock

1+ parts

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3,950

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Anansix

USA . 1,174 parts In-Stock

1+ parts

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1,174

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Nova Conductors

Japan . 700 parts In-Stock

1+ parts

-

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700

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Vyrian

USA . 145 parts In-Stock

1+ parts

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145

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,545 parts In-Stock

1+ parts

$2.000

100+ parts

-

1k+ parts

-

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1,545

$2.000

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AZTECH Wire

Italy . 222 parts In-Stock

1+ parts

$13.048

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222

$13.048

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IDEA Electronic Components Group

UK . 486 parts In-Stock

1+ parts

$50.700

100+ parts

-

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$45.630

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486

$50.700

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$45.630

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MKK Technologies

India . 577 parts In-Stock

1+ parts

$95.339

100+ parts

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577

$95.339

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DigiPath Technology Company

USA . 577 parts In-Stock

1+ parts

$95.339

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577

$95.339

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Corphita

USA . 4,547 parts In-Stock

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4,547

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Argo Parts USA

USA . 4,439 parts In-Stock

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4,439

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Parana Technologies

USA . 1,492 parts In-Stock

1+ parts

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100+ parts

$60.620

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1,492

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$60.620

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Continental Prestige Electronics

USA . 1,124 parts In-Stock

1+ parts

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1,124

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Overview

Elevate your projects with the ST6220BM6 microcontroller from STMicroelectronics. Designed with precision and innovation, this small outline package offers industrial-grade performance with a maximum clock frequency of 8 MHz. With 4096 ROM words and 64 RAM words, this microcontroller provides versatile solutions for various applications. From embedded systems to IoT devices, the ST6220BM6 delivers efficient operation at low power consumption levels. Trust in STMicroelectronics' reputation for quality and reliability, and unlock the potential of your designs with this advanced microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY package material provides durability and protection to the microcontroller, making it suitable for various environments.

Bit Size: 8

8-bit architecture allows for efficient processing of data and instructions, making the microcontroller suitable for a wide range of applications.

Maximum Clock Frequency: 8 MHz

With a maximum clock frequency of 8 MHz, this microcontroller offers high-speed performance for quick execution of tasks.

ROM Words: 4096

4096 ROM words provide ample storage for program instructions, allowing for complex functionality to be implemented on the microcontroller.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product offers integrated peripherals that enhance its capabilities and make it suitable for standalone applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making this microcontroller energy-efficient and reliable.

Maximum Supply Current: 3.5 mA

Low maximum supply current of 3.5 mA indicates energy efficiency, making this microcontroller suitable for battery-powered applications.

Nominal Supply Voltage: 5 V

Nominal supply voltage of 5 V is standard and widely available, simplifying the power supply design for the microcontroller.

ADC Channels: YES

Built-in ADC channels allow the microcontroller to interface with analog sensors and signals, increasing its versatility in different applications.

Low Power Mode: YES

Incorporating a low power mode feature enables the microcontroller to conserve energy during idle periods, prolonging battery life in portable devices.

Technical Specifications

Microcontrollers ST6220BM6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

3 TO 6 V @ 2 MHZ; ROM PROTECT; USER SELECTABLE DATA ROM

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

Low Power Mode:

YES

No. of DMA Channels:

0

No. of External Interrupts:

1

No. of I/O Lines:

12

No. of Serial I/Os:

0

No. of Terminals:

20

No. of Timers:

1

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

RAM Words:

64

ROM Words:

4096

ROM Programmability:

MROM

Speed:

8 rpm

Maximum Supply Current:

3.5 mA

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

ST6220BM6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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