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ST6200CBN3/CCC

STMicroelectronics

ST6200CBN3/CCC by STMicroelectronics

ST6200CBN3/CCC by STMicroelectronics is an 8-bit microcontroller with 1024 ROM words, 64 RAM bytes, and 14 I/O lines. Operating at a max clock frequency of 8 MHz, it is suitable for automotive applications due to its temperature grade and low power consumption of 4.8 mA at a supply voltage range of 3.6V to 6V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 910 parts In-Stock

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Anansix

USA . 785 parts In-Stock

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785

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Vyrian

USA . 280 parts In-Stock

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280

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 31 parts In-Stock

1+ parts

$32.746

100+ parts

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$29.472

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31

$32.746

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$29.472

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MKK Technologies

India . 261 parts In-Stock

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$61.578

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DigiPath Technology Company

USA . 261 parts In-Stock

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$61.578

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$61.578

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Corphita

USA . 2,430 parts In-Stock

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2,430

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Parana Technologies

USA . 1,629 parts In-Stock

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$39.153

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1,629

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$39.153

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Overview

Unleash the power of innovation with the ST6200CBN3/CCC microcontroller by STMicroelectronics. Crafted with precision and expertise, this microcontroller offers unparalleled quality and reliability. Ideal for a wide range of applications, this product boasts cutting-edge technology that delivers exceptional performance. Experience seamless integration and enhanced functionalities with the ST6200CBN3/CCC, providing value and benefits that exceed expectations. Elevate your projects with this innovative solution and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and labor costs.

Maximum Supply Voltage: 6 V

Ability to operate at a maximum supply voltage of 6V provides flexibility in power source selection.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and allows for easy integration into existing designs.

Bit Size: 8

8-bit architecture provides a good balance between performance and cost, suitable for a wide range of applications.

Power Supplies (V): 3.3/5

Support for multiple power supply voltages allows for compatibility with different power sources.

No. of Terminals: 16

16 terminals provide ample connectivity options for interfacing with external components and peripherals.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline package with shrink pitch design saves PCB space and enables compact and miniaturized designs.

Minimum Supply Voltage: 3.6 V

Ability to operate at a minimum supply voltage of 3.6V ensures reliable performance even under low power conditions.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125 °C makes this microcontroller suitable for automotive and industrial applications where high temperatures may be encountered.

CPU Family: ST6200

ST6200 CPU family offers proven performance and reliability, ensuring stable operation of the microcontroller.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40 °C allows the microcontroller to operate in harsh cold environments without issues.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections.

ADC Channels: YES

Built-in analog-to-digital converter channels enable the microcontroller to interface with analog sensors and signals.

Terminal Position: DUAL

Dual terminal position allows for flexibility in PCB layout and routing, making it easier to connect the microcontroller to external components.

ROM Words: 1024

1024 ROM words provide sufficient non-volatile memory for storing program code and data.

Width: 5.3 mm

Compact width of 5.3mm allows for space-efficient PCB layout and integration into small form factor devices.

Maximum Clock Frequency: 8 MHz

High maximum clock frequency of 8MHz enables fast processing and execution of instructions, improving overall system performance.

Length: 6.2 mm

Short length of 6.2mm helps in keeping the overall size of the microcontroller small, ideal for applications with space constraints.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade certification ensures reliable operation in automotive environments where temperature fluctuations are common.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product integrates various peripherals and interfaces into a single chip, simplifying system design and reducing component count.

RAM Bytes: 64

64 bytes of RAM provide temporary data storage for efficient processing of instructions and data manipulation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and inspection during assembly, improving manufacturing efficiency.

Maximum Supply Current: 4.8 mA

Low maximum supply current of 4.8mA helps in reducing power consumption and heat dissipation, enhancing the overall energy efficiency of the system.

Nominal Supply Voltage: 5 V

5V nominal supply voltage is a common and standard voltage level, ensuring compatibility with a wide range of power sources and components.

ROM Programmability: MROM

MROM (Mask ROM) programmability offers secure permanent storage of program code, preventing unauthorized modification or tampering.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65mm allows for high-density mounting and miniaturization of the PCB, saving space and enabling compact designs.

Speed: 8 rpm

Speed rating of 8 rpm indicates the data processing capability of the microcontroller, making it suitable for real-time control and signal processing applications.

No. of I/O Lines: 14

14 I/O lines provide flexibility for interfacing with external devices and peripherals, enabling versatile connectivity options for the microcontroller.

Technical Specifications

Microcontrollers ST6200CBN3/CCC attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST6200

Maximum Clock Frequency:

8 MHz

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

6.2 mm

No. of I/O Lines:

14

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

64

ROM Words:

1024

ROM Programmability:

MROM

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

4.8 mA

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

3.6 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Peripheral IC Type:

Trade Compliance

ST6200CBN3/CCC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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