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ST6220BB6

STMicroelectronics

ST6220BB6 by STMicroelectronics

ST6220BB6 by STMicroelectronics is an 8-bit microcontroller with 4096 ROM words and 64 RAM words. Operating at a max clock frequency of 8 MHz, it features low power mode and ADC channels for industrial applications. With a package style of IN-LINE, it has a temperature range from -40 to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,838 parts In-Stock

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1,838

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Digiode

USA . 1,779 parts In-Stock

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1,779

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Vyrian

USA . 1,137 parts In-Stock

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1,137

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Nova Conductors

Japan . 18 parts In-Stock

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18

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Distributors (Availability)

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Ampacity Inc.

Singapore . 298 parts In-Stock

1+ parts

$4.000

100+ parts

-

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-

298

$4.000

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AZTECH Wire

Italy . 880 parts In-Stock

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$17.620

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880

$17.620

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IDEA Electronic Components Group

UK . 2,183 parts In-Stock

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$31.141

100+ parts

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$28.027

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2,183

$31.141

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$28.027

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MKK Technologies

India . 1,517 parts In-Stock

1+ parts

$58.559

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1,517

$58.559

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DigiPath Technology Company

USA . 1,517 parts In-Stock

1+ parts

$58.559

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1,517

$58.559

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Continental Prestige Electronics

USA . 6,486 parts In-Stock

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6,486

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Corphita

USA . 2,180 parts In-Stock

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2,180

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Argo Parts USA

USA . 1,025 parts In-Stock

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1,025

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Parana Technologies

USA . 1,019 parts In-Stock

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$37.234

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1,019

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$37.234

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Aranea Global

USA . 50 parts In-Stock

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50

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Overview

Elevate your projects with the ST6220BB6 microcontroller from STMicroelectronics, a trusted manufacturer known for reliable and innovative technology. Designed for industrial applications, this versatile microcontroller offers low power mode, ADC channels, and a maximum clock frequency of 8 MHz. With 4096 ROM words and 64 RAM words, this powerful device provides the performance and flexibility you need to bring your ideas to life. Upgrade your designs today with the ST6220BB6 and experience the quality and value that only STMicroelectronics can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protects the microcontroller from external elements, making it a reliable choice for various applications.

Maximum Supply Voltage: 6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with different systems.

On Chip Data RAM Width: 8

With a wide on-chip data RAM width of 8, this microcontroller can efficiently handle and process data, enhancing its performance.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into circuit boards and compact design, saving space in electronic devices.

Bit Size: 8

The 8-bit size offers sufficient processing capabilities for a wide range of applications while maintaining a balance between performance and cost.

No. of Terminals: 20

The 20 terminals provide ample connectivity options for interfacing with other components, making this microcontroller versatile in different designs.

Package Style (Meter): IN-LINE

The in-line package style allows for a streamlined and organized arrangement on a circuit board, aiding in easier assembly and maintenance.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures compatibility with various power sources and efficient power management in different operating conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range of 85 °C enables reliable operation in industrial environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows for usage in cold conditions, making this microcontroller suitable for diverse environments.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion, facilitating the interfacing of analog sensors and signals for a wider range of applications.

Terminal Position: DUAL

The dual terminal position provides flexibility in connecting external components or peripherals, enhancing the versatility of this microcontroller.

ROM Words: 4096

With a large capacity of 4096 ROM words, this microcontroller can store program instructions efficiently, enabling complex functionalities in embedded systems.

RAM Words: 64

The 64 RAM words offer sufficient memory storage for temporary data processing, ensuring smooth operation of the microcontroller in various tasks.

Maximum Clock Frequency: 8 MHz

The high maximum clock frequency of 8 MHz allows for fast data processing and execution of instructions, improving the overall performance of the microcontroller.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures robust operation in harsh environments, making this microcontroller suitable for industrial applications requiring reliability.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product offers integrated peripheral functions, reducing the need for additional components and simplifying the design of electronic systems.

Technology: CMOS

The CMOS technology used in this microcontroller provides low power consumption, high noise immunity, and versatility, making it a cost-effective and efficient choice.

Terminal Form: THROUGH-HOLE

The through-hole terminal form allows for secure and stable connections on a circuit board, ensuring reliability in various applications.

Maximum Supply Current: 3.5 mA

The low maximum supply current of 3.5 mA indicates efficient power usage, contributing to energy savings and prolonged battery life in portable devices.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V provides a standard power requirement, ensuring compatibility with most electronic systems and ease of integration.

ROM Programmability: MROM

The MROM (Mask ROM) programmability ensures that the program instructions stored in ROM are secure and cannot be altered, enhancing the reliability of the microcontroller.

Format: FIXED POINT

The fixed-point format enables efficient numerical calculations and arithmetic operations, making this microcontroller suitable for various computational tasks.

Speed: 8 rpm

The speed of 8 rpm indicates the processing capability of the microcontroller in executing instructions and data manipulation, meeting the performance requirements of different applications.

Low Power Mode: YES

The availability of a low power mode allows for energy-efficient operation, reducing power consumption in standby or idle states, making this microcontroller suitable for battery-powered devices.

On Chip Program ROM Width: 8

With an on-chip program ROM width of 8, this microcontroller can store and execute program instructions efficiently, contributing to faster operation and improved performance.

No. of I/O Lines: 12

The 12 I/O lines provide ample input-output options for connecting external devices and components, enhancing the connectivity and functionality of the microcontroller in a system.

Technical Specifications

Microcontrollers ST6220BB6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

3 TO 6 V @ 2 MHZ; ROM PROTECT; USER SELECTABLE DATA ROM

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDIP-T20

Low Power Mode:

YES

No. of DMA Channels:

0

No. of External Interrupts:

1

No. of I/O Lines:

12

No. of Serial I/Os:

0

No. of Terminals:

20

No. of Timers:

1

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

RAM Words:

64

ROM Words:

4096

ROM Programmability:

MROM

Speed:

8 rpm

Maximum Supply Current:

3.5 mA

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

ST6220BB6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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