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ST6200CBB1/CCC

STMicroelectronics

ST6200CBB1/CCC by STMicroelectronics

ST6200CBB1/CCC by STMicroelectronics is an 8-bit microcontroller with 1024 ROM words, 64 RAM bytes, and max clock frequency of 8 MHz. It operates b/w 0 to 70 °C and has a supply voltage range of 3.6V to 6V. Ideal for commercial applications requiring low power consumption and high-speed processing capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,516 parts In-Stock

1+ parts

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100+ parts

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2,516

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Anansix

USA . 2,356 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,356

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Vyrian

USA . 1,508 parts In-Stock

1+ parts

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100+ parts

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1,508

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 597 parts In-Stock

1+ parts

$69.634

100+ parts

-

1k+ parts

$62.670

10k+ parts

-

597

$69.634

-

$62.670

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MKK Technologies

India . 2,116 parts In-Stock

1+ parts

$130.942

100+ parts

-

1k+ parts

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10k+ parts

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2,116

$130.942

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DigiPath Technology Company

USA . 2,116 parts In-Stock

1+ parts

$130.942

100+ parts

-

1k+ parts

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10k+ parts

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2,116

$130.942

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Corphita

USA . 4,439 parts In-Stock

1+ parts

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4,439

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Parana Technologies

USA . 606 parts In-Stock

1+ parts

-

100+ parts

$83.258

1k+ parts

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10k+ parts

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606

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$83.258

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Overview

Experience the power of innovation with the ST6200CBB1/CCC microcontroller by STMicroelectronics. Designed with precision and quality, this versatile device offers endless possibilities in various applications. From smart home automation to automotive systems, this microcontroller delivers unparalleled performance and reliability. Trust in the expertise of STMicroelectronics, a leading manufacturer in the industry, to provide you with cutting-edge technology that exceeds expectations. Elevate your projects and unlock new opportunities with the ST6200CBB1/CCC microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the microcontroller easy to handle and suitable for various applications.

Maximum Supply Voltage: 6 V

Allows for a wide range of input voltages, providing flexibility in circuit design and power supply options.

Package Shape: RECTANGULAR

Rectangular shape facilitates easy integration into circuit boards and systems.

Bit Size: 8

An 8-bit microcontroller offers sufficient processing power for many low to mid-range applications.

Power Supplies (V): 3.3/5

Supports multiple power supply options, allowing compatibility with different voltage levels and system requirements.

No. of Terminals: 16

Sufficient number of terminals for connecting input/output devices and peripherals to the microcontroller.

Package Style (Meter): IN-LINE

In-line package style saves space and simplifies PCB layout, especially in compact designs.

Minimum Supply Voltage: 3.6 V

Provides a reliable minimum operating voltage for the microcontroller to ensure stable performance.

Maximum Operating Temperature: 70 °C

Withstands high temperature environments, enhancing the reliability and longevity of the device.

CPU Family: ST6200

Belongs to a well-established CPU family known for its performance, compatibility, and reliability.

Minimum Operating Temperature: 0 °C

Capable of operating in a wide temperature range, making it suitable for various environmental conditions.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and conductivity, ensuring secure connections with other components.

ADC Channels: YES

Integrated Analog-to-Digital Converter (ADC) allows for analog signal conversions, enabling sensor interfacing and data acquisition.

Terminal Position: DUAL

Dual terminal positions provide flexibility in PCB mounting orientations and can simplify assembly processes.

ROM Words: 1024

Sufficient ROM capacity for storing program instructions and data, supporting a wide range of applications.

Width: 7.62 mm

Compact width dimension saves space on the PCB and allows for integration into small form factor devices.

Maximum Clock Frequency: 8 MHz

Fast clock frequency enables rapid data processing and execution of instructions, enhancing overall performance.

Length: 19.18 mm

Optimal length dimension for accommodating the necessary components and circuitry within a defined space.

Temperature Grade: COMMERCIAL

Designed for commercial applications, meeting industry standards for performance and reliability in typical operating conditions.

Peripheral IC Type: MICROCONTROLLER

Integrated peripheral ICs enhance the microcontroller's functionality and versatility for interfacing with external devices.

RAM Bytes: 64

Adequate RAM capacity for temporary data storage and processing, supporting multitasking and complex algorithms.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for energy-efficient and reliable operation.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and stable connections to the PCB, suitable for applications requiring robust mounting.

Maximum Supply Current: 4.8 mA

Low supply current consumption minimizes power usage and heat generation, ideal for battery-powered devices and energy-efficient designs.

Nominal Supply Voltage: 5 V

Standard nominal voltage ensures compatibility with commonly available power sources and simplifies circuit design.

ROM Programmability: MROM

Mask-ROM (MROM) provides permanent storage of essential firmware and data, offering reliability and security for critical applications.

Terminal Pitch: 2.54 mm

Standard terminal pitch facilitates easy PCB layout and soldering, enabling efficient manufacturing and assembly processes.

Speed: 8 rpm

Operates at a moderate speed suitable for most embedded applications, balancing performance with power efficiency.

No. of I/O Lines: 14

Sufficient number of Input/Output (I/O) lines for connecting to external devices and peripherals, enabling data exchange and control functionalities.

Technical Specifications

Microcontrollers ST6200CBB1/CCC attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST6200

Maximum Clock Frequency:

8 MHz

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Length:

19.18 mm

No. of I/O Lines:

14

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

64

ROM Words:

1024

ROM Programmability:

MROM

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

4.8 mA

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

3.6 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Peripheral IC Type:

Trade Compliance

ST6200CBB1/CCC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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