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ST485ERXN

STMicroelectronics

ST485ERXN by STMicroelectronics

ST485ERXN by STMicroelectronics is a robust line transceiver designed for EIA-422/EIA-485 applications. It operates b/w 4.75V and 5.25V, with a max transmit delay of 60 ns and supports temperatures from -55 °C to 150 °C. Ideal for military-grade communication systems, it ensures reliable data transmission.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,063 parts In-Stock

1+ parts

-

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2,063

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Digiode

USA . 1,802 parts In-Stock

1+ parts

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1,802

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Anansix

USA . 1,157 parts In-Stock

1+ parts

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1,157

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 137 parts In-Stock

1+ parts

$1.134

100+ parts

-

1k+ parts

-

10k+ parts

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137

$1.134

-

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AZTECH Wire

Italy . 964 parts In-Stock

1+ parts

$11.160

100+ parts

-

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10k+ parts

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964

$11.160

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-

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IDEA Electronic Components Group

UK . 1,015 parts In-Stock

1+ parts

$11.927

100+ parts

-

1k+ parts

$10.734

10k+ parts

-

1,015

$11.927

-

$10.734

-

MKK Technologies

India . 781 parts In-Stock

1+ parts

$22.428

100+ parts

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781

$22.428

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DigiPath Technology Company

USA . 781 parts In-Stock

1+ parts

$22.428

100+ parts

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10k+ parts

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781

$22.428

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Parana Technologies

USA . 2,353 parts In-Stock

1+ parts

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100+ parts

$14.260

1k+ parts

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2,353

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$14.260

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Vigor

Singapore . 1,323 parts In-Stock

1+ parts

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1,323

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Corphita

USA . 595 parts In-Stock

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595

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Overview

Elevate your designs with the ST485ERXN from STMicroelectronics, a leader in reliable and high-performance semiconductor solutions. This exceptional line driver and receiver excels in demanding applications, ensuring robust data transmission with minimal delay. Engineered for military-grade durability, it operates seamlessly across extreme temperatures, making it perfect for industrial automation and communication systems. Experience superior quality and unwavering performance that drives your innovation forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures good protection against environmental factors, making it suitable for various applications.

Maximum Supply Voltage: 5.25 V

A maximum supply voltage of 5.25 V allows for compatibility with a variety of systems operating within this voltage range.

Package Shape: RECTANGULAR

The rectangular package shape enables efficient PCB layout and optimization of space in compact design applications.

Maximum Transmit Delay: 60 ns

A low transmit delay of 60 ns improves the overall speed of data transmission, making it ideal for high-performance applications.

Power Supplies (V): 5

Power supply of 5 V is standard in many electronic systems, simplifying integration and design.

No. of Terminals: 8

An 8-terminal design provides versatility in connectivity options while keeping the layout manageable.

Package Style (Meter): IN-LINE

The in-line package style allows for easy alignment and installation on PCBs.

Maximum High Level Input Current: 0.000002 Amp

Extremely low maximum input current saves power and reduces heat generation, beneficial in high-density applications.

Minimum Supply Voltage: 4.75 V

It operates at a minimum supply voltage of 4.75 V, enhancing compatibility with lower voltage systems.

Maximum Operating Temperature: 150 °C

A high operating temperature threshold ensures reliability in demanding environments.

Minimum Operating Temperature: -55 °C

Able to function in extreme low temperatures makes this product suitable for aerospace and military applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides excellent solderability and resistance to corrosion, ensuring long-term performance.

Terminal Position: DUAL

Dual terminal positioning allows for flexible mounting options on the PCB.

Maximum Seated Height: 4.8 mm

A low seated height enables compact designs in space-constrained environments.

Width: 7.62 mm

A width of 7.62 mm allows for easy integration into various PCB designs.

Maximum Output Low Current: 4 Amp

High current output capacity ensures adequate performance for substantial loads.

Differential Output: YES

Differential output improves signal integrity over distance, making it suitable for long-range communication.

Minimum Out Swing: 1.5 V

This out swing allows for effective signal representation, enhancing communication reliability.

Temperature Grade: MILITARY

MILITARY-grade temperature specifications ensure that the device can withstand harsh operational environments.

Maximum Receive Delay: 210 ns

The reasonable receive delay ensures prompt data response, maintaining efficient communication speed.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust connection stability and ease of handling during assembly.

Interface Standard: EIA-422; EIA-485

Compatibility with EIA-422 and EIA-485 standards makes it suitable for robust industrial and communication applications.

Maximum Supply Current: 0.9 mA

Low supply current enhances energy efficiency, making it an eco-friendly choice for battery-operated devices.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

Differential Schmitt trigger input ensures signal quality and noise immunity, ideal for noisy environments.

Nominal Supply Voltage: 5 V

Operating with a nominal supply voltage of 5 V aligns with many common electronic components, simplifying integration.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm makes it compatible with standard PCB layout grids, facilitating easier assembly.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, it effectively supports bidirectional data communication, essential in many communication systems.

Technical Specifications

Line Drivers & Receivers ST485ERXN attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.000002 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422; EIA-485

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Minimum Out Swing:

1.5 V

Maximum Output Low Current:

4 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

210 ns

Receiver No. of Bits:

1

Maximum Seated Height:

4.8 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

.9 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

60 ns

Width:

7.62 mm

Trade Compliance

ST485ERXN Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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