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ST485ABD

STMicroelectronics

ST485ABD by STMicroelectronics

ST485ABD by STMicroelectronics is a dual line transceiver designed for EIA-422/EIA-485 applications. It operates b/w -40 °C to 85 °C with a max supply voltage of 5.5V and features a fast transmit/receive delay of 30ns. Ideal for industrial communication, it supports differential signaling with low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,767 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,767

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-

-

-

Digiode

USA . 2,002 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,002

-

-

-

-

Vyrian

USA . 1,461 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,461

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 157 parts In-Stock

1+ parts

$9.659

100+ parts

-

1k+ parts

$8.693

10k+ parts

-

157

$9.659

-

$8.693

-

MKK Technologies

India . 1,984 parts In-Stock

1+ parts

$18.163

100+ parts

-

1k+ parts

-

10k+ parts

-

1,984

$18.163

-

-

-

DigiPath Technology Company

USA . 1,984 parts In-Stock

1+ parts

$18.163

100+ parts

-

1k+ parts

-

10k+ parts

-

1,984

$18.163

-

-

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Corphita

USA . 4,810 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,810

-

-

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Parana Technologies

USA . 2,067 parts In-Stock

1+ parts

-

100+ parts

$11.549

1k+ parts

-

10k+ parts

-

2,067

-

$11.549

-

-

Overview

Unlock superior performance with the ST485ABD from STMicroelectronics—a game-changing line driver and receiver designed for industrial applications. With its robust construction and exceptional reliability, this compact device operates seamlessly across a wide temperature range, ensuring optimal functionality even in challenging environments. Leverage its advanced capabilities for high-speed data transmission while enjoying the peace of mind that comes from partnering with a trusted leader in semiconductor innovation. Experience efficiency and excellence today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact and efficient designs, saving space on the PCB.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, the product is compatible with a wide range of electronic devices.

Package Shape: RECTANGULAR

The rectangular shape provides ease of placement on PCBs, optimizing layout and assembly processes.

Maximum Transmit Delay: 30 ns

A low transmit delay improves data transmission speed, making it a great choice for high-speed applications.

Power Supplies (V): 5

Designed for standard 5 V power supplies, making integration into existing systems straightforward.

No. of Terminals: 8

The 8-terminal design allows for versatile connectivity options and streamlined integration into circuits.

Package Style (Meter): SMALL OUTLINE

A small outline package style enhances space efficiency, ideal for dense electronic applications.

Minimum Supply Voltage: 4.5 V

An operational range down to 4.5 V ensures stable performance even in a variety of supply conditions.

Maximum Operating Temperature: 85 °C

High-temperature tolerance makes this product reliable for industrial applications and harsh environments.

Minimum Operating Temperature: -40 °C

The wide temperature range (-40 °C to 85 °C) ensures functionality in extreme environments, adding to its versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finishes enhance conductivity and provide corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position offers flexibility in layout design, accommodating different board configurations.

Maximum Seated Height: 1.75 mm

Low seated height supports designs requiring space-saving components without compromising performance.

Width: 3.9 mm

The compact width contributes to more efficient PCB space management, allowing for more components.

Maximum Output Low Current: 4 Amp

A high maximum output low current capability makes the device suitable for driving larger loads.

Differential Output: YES

Differential outputs reduce noise and improve signal integrity over long distances, making it ideal for communication lines.

Length: 4.9 mm

The short length reinforces compact designs, perfect for modern electronic devices needing efficient space utilization.

Minimum Out Swing: 1.5 V

A minimum out swing of 1.5 V provides ample voltage levels for reliable signal transmission.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring reliability and performance in demanding environments.

Maximum Receive Delay: 30 ns

A low maximum receive delay improves data reception speed and overall performance in communication networks.

Terminal Form: GULL WING

Gull wing terminals are easy to solder, enhancing manufacturability and reliability of connections.

Interface Standard: EIA-422; EIA-485

Supports standard communication protocols (EIA-422 and EIA-485) enhancing compatibility with various industry applications.

Maximum Supply Current: 5 mA

A low maximum supply current ensures energy efficiency, critical for battery-powered applications.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

Differential Schmitt trigger inputs provide noise immunity and reliable signal processing, enhancing communication integrity.

Nominal Supply Voltage: 5 V

Designed for a nominal supply voltage of 5 V, ensuring compatibility with most digital systems and ease of use.

Terminal Pitch: 1.27 mm

A standard terminal pitch allows for easy integration into various PCB designs without special considerations.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, this IC is specialized for long-distance communication, ensuring reliable data transmission and reception.

Technical Specifications

Line Drivers & Receivers ST485ABD attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422; EIA-485

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

1.5 V

Maximum Output Low Current:

4 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

30 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

5 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

30 ns

Width:

3.9 mm

Trade Compliance

ST485ABD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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