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ST485ADR

STMicroelectronics

ST485ADR by STMicroelectronics

ST485ADR by STMicroelectronics is a military-grade line transceiver with a max supply voltage of 5.25V and operates b/w -55 °C to 125°C. It features differential output and boasts transmit/receive delays of 70ns and 230ns, respectively. Ideal for EIA-422/EIA-485 applications, it ensures reliable data communication in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,259 parts In-Stock

1+ parts

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2,259

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Digiode

USA . 2,035 parts In-Stock

1+ parts

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1k+ parts

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2,035

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Anansix

USA . 1,906 parts In-Stock

1+ parts

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1,906

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 802 parts In-Stock

1+ parts

$11.229

100+ parts

-

1k+ parts

$10.106

10k+ parts

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802

$11.229

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$10.106

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MKK Technologies

India . 636 parts In-Stock

1+ parts

$21.115

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636

$21.115

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DigiPath Technology Company

USA . 636 parts In-Stock

1+ parts

$21.115

100+ parts

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636

$21.115

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Corphita

USA . 4,597 parts In-Stock

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4,597

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Parana Technologies

USA . 519 parts In-Stock

1+ parts

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100+ parts

$13.426

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519

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$13.426

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Overview

Elevate your designs with the ST485ADR from STMicroelectronics, a trusted leader in semiconductor innovation. This robust line driver and receiver excels in reliability and performance across diverse applications, from industrial automation to telecommunications. With its military-grade temperature range and compact surface-mount package, it ensures seamless data communication while delivering exceptional speed and efficiency. Choose ST485ADR for unmatched quality and peace of mind in every project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Being surface mount compatible enhances the ease of integration into modern circuit designs, saving space on PCBs.

Maximum Supply Voltage: 5.25 V

A maximum supply voltage of 5.25V gives flexibility in power supply options while maintaining safe operational limits.

Package Shape: RECTANGULAR

The rectangular package shape helps in efficient utilization of board space and simplifies alignment during assembly.

Maximum Transmit Delay: 70 ns

A low maximum transmit delay ensures quick signal transmission, enhancing the overall performance of communication systems.

No. of Terminals: 8

With 8 terminals, this IC provides ample connectivity options while keeping the design streamlined and manageable.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for compact designs, making it ideal for space-constrained applications.

Minimum Supply Voltage: 4.75 V

Having a minimum supply voltage of 4.75V allows for operation with a range of standard power supplies, ensuring compatibility.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C ensures reliability in high-temperature environments, suitable for military and industrial applications.

Minimum Operating Temperature: -55 °C

A minimum operating temperature of -55 °C makes this product ideal for extreme environments, providing robustness under harsh conditions.

Terminal Position: DUAL

Dual terminal positioning facilitates dual connections, improving flexibility in circuit designs and configurations.

Maximum Seated Height: 1.75 mm

A low seated height contributes to a compact design, essential for modern electronics that prioritize space efficiency.

Width: 3.9 mm

A width of 3.9 mm allows for efficient layout options, providing flexibility in PCB design.

Differential Output: YES

Differential outputs provide improved noise immunity and increased signal integrity, making this product suitable for long-distance communication.

Length: 4.9 mm

The length of 4.9 mm complements the compact packaging, enhancing integration with other small components.

Temperature Grade: MILITARY

Military-grade temperature specifications signify reliability and performance under extreme environmental conditions.

Maximum Receive Delay: 230 ns

A manageable maximum receive delay supports effective communication while maintaining data integrity and timing.

Terminal Form: GULL WING

Gull wing terminals provide easy soldering and mounting, enhancing the reliability of connections on PCBs.

Interface Standard: EIA-422; EIA-485

Compliance with EIA-422 and EIA-485 standards allows this product to be used in a wide range of data communication applications.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

The differential Schmitt trigger input characteristics improve noise immunity and ensure clean switching, critical for accurate signal processing.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V is ideal for compatibility with most digital logic levels, simplifying design.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for high-density designs while ensuring ease of handling during assembly.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver IC, it is specifically designed for robust data transmission, offering versatility for various communications applications.

Technical Specifications

Line Drivers & Receivers ST485ADR attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422; EIA-485

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Receive Delay:

230 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

70 ns

Width:

3.9 mm

Trade Compliance

ST485ADR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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