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ST485EBD

STMicroelectronics

ST485EBD by STMicroelectronics

ST485EBD by STMicroelectronics is a line driver & receiver with 1 function, operating voltage range of 4.75V to 5.25V, and max transmit delay of 45ns. It is used in EIA-422 and EIA-485 interface applications for industrial temperature grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 114,449 parts In-Stock

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Bristol Electronics

USA . 6,474 parts In-Stock

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6,474

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Anansix

USA . 795 parts In-Stock

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795

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Vyrian

USA . 699 parts In-Stock

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699

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Digiode

USA . 56 parts In-Stock

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56

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 187 parts In-Stock

1+ parts

$6.322

100+ parts

-

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$5.690

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187

$6.322

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$5.690

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MKK Technologies

India . 858 parts In-Stock

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$11.889

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858

$11.889

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DigiPath Technology Company

USA . 858 parts In-Stock

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$11.889

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$11.889

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AZTECH Wire

Italy . 805 parts In-Stock

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$12.257

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805

$12.257

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Ampacity Inc.

Singapore . 216 parts In-Stock

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$15.500

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216

$15.500

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Semicontronic

India . 989 parts In-Stock

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$34.500

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$33.638

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$33.465

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989

$34.500

$33.638

$33.465

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S.R.D Solutions

India . 20,000 parts In-Stock

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Lixinc

USA . 12,362 parts In-Stock

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Infinite Electronics LLP (Excess)

. 6,475 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,297 parts In-Stock

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Continental Prestige Electronics

USA . 1,546 parts In-Stock

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Futuretech Components

Singapore . 1,500 parts In-Stock

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Argo Parts USA

USA . 727 parts In-Stock

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Parana Technologies

USA . 395 parts In-Stock

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$7.559

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Corphita

USA . 277 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Discover the ST485EBD by STMicroelectronics, a high-quality line driver and receiver that offers unparalleled performance and reliability. With its small outline package and surface mount capability, this versatile product is perfect for a wide range of applications. Whether you need to transmit data over long distances or ensure robust communication in harsh industrial environments, the ST485EBD has got you covered. Benefit from its low power consumption, wide temperature range, and differential output, delivering exceptional value and peace of mind. Trust in STMicroelectronics, a trusted manufacturer known for delivering innovative solutions that meet the highest industry standards. Elevate your designs with the ST485EBD and experience the advantage of superior quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Surface mount capability allows for easy and convenient assembly onto circuit boards.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for compatibility with a wide range of power sources.

Package Shape: RECTANGULAR

The rectangular shape enables efficient use of space on the circuit board.

Maximum Transmit Delay: 45 ns

The low maximum transmit delay ensures fast and efficient data transmission.

Power Supplies (V): 5

The standard power supply voltage of 5V makes it compatible with many systems.

No. of Terminals: 8

Having 8 terminals provides flexibility in connecting the product to other components in the system.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage ensures reliable operation even with slight fluctuations in power.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for use in a variety of environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish provides good electrical conductivity and corrosion resistance.

Terminal Position: DUAL

Dual terminal positions offer flexibility in mounting and connection options.

Maximum Seated Height: 1.75 mm

The low maximum seated height minimizes the overall height of the product on the circuit board.

Width: 3.9 mm

The narrow width helps in saving space on the circuit board.

Maximum Output Low Current: 4 Amp

The high output current capability allows for driving larger loads.

Differential Output: YES

Differential output helps in reducing noise and interference in data transmission.

Length: 4.9 mm

The compact length of the product saves space on the circuit board.

Minimum Out Swing: 1.5 V

The low minimum output swing ensures compatibility with a variety of input signals.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments.

Maximum Receive Delay: 130 ns

The low maximum receive delay ensures fast reception of data signals.

Terminal Form: GULL WING

The gull wing terminal form offers secure mounting onto the circuit board.

Interface Standard: EIA-422; EIA-485

Compliance with EIA-422 and EIA-485 standards ensures compatibility with industry-standard interfaces.

Maximum Supply Current: 0.9 mA

Low maximum supply current helps in minimizing power consumption.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

Differential Schmitt trigger input characteristics help in improving noise immunity and signal integrity.

Nominal Supply Voltage: 5 V

The standard nominal supply voltage of 5V ensures compatibility with many systems.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for high-density mounting on the circuit board.

Interface IC Type: LINE TRANSCEIVER

Being a line transceiver IC type, the product can interface between different communication protocols effectively.

Technical Specifications

Line Drivers & Receivers ST485EBD attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422; EIA-485

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

1.5 V

Maximum Output Low Current:

4 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

130 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

.9 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

45 ns

Width:

3.9 mm

Trade Compliance

ST485EBD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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