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ST485ACDR

STMicroelectronics

ST485ACDR by STMicroelectronics

ST485ACDR by STMicroelectronics is a versatile line transceiver with a max supply voltage of 5.5V and operates within -0 °C to 70 °C. It features a fast transmit/receive delay of 30ns and supports EIA-422/EIA-485 standards, ideal for robust data communication applications. Its compact SO package ensures efficient space utilization in electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,739 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,739

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-

-

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Digiode

USA . 3,589 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,589

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Anansix

USA . 736 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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736

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 887 parts In-Stock

1+ parts

$4.629

100+ parts

-

1k+ parts

$4.166

10k+ parts

-

887

$4.629

-

$4.166

-

MKK Technologies

India . 330 parts In-Stock

1+ parts

$8.705

100+ parts

-

1k+ parts

-

10k+ parts

-

330

$8.705

-

-

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DigiPath Technology Company

USA . 330 parts In-Stock

1+ parts

$8.705

100+ parts

-

1k+ parts

-

10k+ parts

-

330

$8.705

-

-

-

Metaverse IC Inc.

Canada . 12,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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12,000

-

-

-

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A-Z Elektronik GmbH

Germany . 6,788 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,788

-

-

-

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Parana Technologies

USA . 2,114 parts In-Stock

1+ parts

-

100+ parts

$5.535

1k+ parts

-

10k+ parts

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2,114

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$5.535

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Corphita

USA . 1,479 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,479

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Kepictronics

USA . 100 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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100

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Overview

Elevate your designs with the ST485ACDR from STMicroelectronics—the ideal choice for reliable line driving and receiving applications. Renowned for its exceptional quality, STMicroelectronics ensures top-notch performance, making this compact solution perfect for industrial and communication systems. With fast transmit and receive capabilities, you gain efficiency and robustness in data transmission, empowering your projects with unmatched reliability and speed. Experience innovation that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body enhances durability and protection against environmental factors, making the product suitable for various applications.

Surface Mount: YES

Surface mount capability allows for compact designs and easier integration into modern circuit boards, contributing to space-saving layouts.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a wide range of power sources while safeguarding against overvoltage conditions.

Package Shape: RECTANGULAR

The rectangular package shape aids in efficient layout and assembly, optimizing space on the PCB.

Maximum Transmit Delay: 30 ns

With a maximum transmit delay of 30 ns, this device ensures fast data transmission, making it ideal for high-speed communication applications.

Power Supplies (V): 5

Designed to operate at a nominal supply voltage of 5 V, it fits seamlessly into standard electronic circuits.

No. of Terminals: 8

An 8-terminal design provides versatile connectivity options while keeping the footprint compact.

Package Style (Meter): SMALL OUTLINE

The small outline package style enhances density and reduces space usage on the board, promoting more compact device designs.

Minimum Supply Voltage: 4.5 V

This wide voltage range (4.5 V to 5.5 V) allows for flexibility in power supply selection, ensuring reliable operation under different conditions.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C indicates the product can function in moderate environments, suitable for various applications.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0 °C allows for use in a variety of ambient conditions, increasing the versatility of the product.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent corrosion resistance and ensures reliable long-term performance in electrical connections.

Terminal Position: DUAL

Dual terminal position aids in flexible PCB design and facilitates easier routing and connectivity.

Maximum Seated Height: 1.75 mm

With a maximum seated height of just 1.75 mm, this component is suited for low-profile applications.

Width: 3.9 mm

A compact width of 3.9 mm allows for tight spacing in electronic designs, enhancing layout efficiency.

Maximum Output Low Current: 4 Amp

The ability to output a low current of 4 Amps makes this product suitable for driving multiple communication lines simultaneously.

Differential Output: YES

Differential output helps to minimize noise and signal degradation over longer distances, ensuring reliable data transmission.

Length: 4.9 mm

With a length of 4.9 mm, it is suited for compact applications needing small form factors.

Minimum Out Swing: 1.5 V

A minimum output swing of 1.5 V provides adequate signal levels for effective communication across different devices.

Temperature Grade: COMMERCIAL

Commercial temperature grade classification ensures it can operate in standard environmental conditions, making it suitable for industrial applications.

Maximum Receive Delay: 30 ns

With a maximum receive delay of 30 ns, it ensures quick response times, essential for real-time data communication.

Terminal Form: GULL WING

Gull wing terminals provide reliable soldering and make assembly easier, enhancing manufacturing efficiency.

Interface Standard: EIA-422; EIA-485

Compliance with EIA-422 and EIA-485 standards ensures compatibility with a wide range of devices used in industrial and commercial settings.

Maximum Supply Current: 5 mA

A low maximum supply current of 5 mA makes this product energy-efficient, leading to reduced overall power consumption in applications.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

The differential Schmitt trigger input characteristics provide improved noise immunity and better signal integrity, critical for reliable operation.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V aligns with standard electronic components, simplifying design and integration.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm simplifies PCB layout and design while providing sufficient spacing for soldering.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, this product is specifically designed for reliable data transmission over long distances, making it ideal for communication applications.

Technical Specifications

Line Drivers & Receivers ST485ACDR attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422; EIA-485

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

1.5 V

Maximum Output Low Current:

4 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

30 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

5 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

30 ns

Width:

3.9 mm

Trade Compliance

ST485ACDR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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