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ST485ACD

STMicroelectronics

ST485ACD by STMicroelectronics

ST485ACD by STMicroelectronics is a dual line transceiver designed for EIA-422/EIA-485 applications. It operates b/w 4.5V and 5.5V, with a max transmit/receive delay of 30 ns and supports up to 4A output current. Ideal for reliable data communication in commercial environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,983 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,983

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-

-

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Digiode

USA . 2,399 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,399

-

-

-

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Anansix

USA . 218 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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218

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,080 parts In-Stock

1+ parts

$2.159

100+ parts

-

1k+ parts

$1.943

10k+ parts

-

1,080

$2.159

-

$1.943

-

MKK Technologies

India . 1,396 parts In-Stock

1+ parts

$4.060

100+ parts

-

1k+ parts

-

10k+ parts

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1,396

$4.060

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-

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DigiPath Technology Company

USA . 1,396 parts In-Stock

1+ parts

$4.060

100+ parts

-

1k+ parts

-

10k+ parts

-

1,396

$4.060

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-

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Corphita

USA . 1,457 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,457

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-

-

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Parana Technologies

USA . 1,346 parts In-Stock

1+ parts

-

100+ parts

$2.582

1k+ parts

-

10k+ parts

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1,346

-

$2.582

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-

Overview

Elevate your projects with the ST485ACD from STMicroelectronics, a reliable line driver and receiver designed for seamless data communication. With its compact form and robust performance, this device ensures efficient signal transmission in various applications, from industrial automation to telecommunications. Trust in STMicroelectronics' renowned quality and innovation to deliver unmatched reliability, empowering you to achieve superior results while optimizing your design's efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental stress, making the product reliable in various applications.

Surface Mount: YES

Surface mount technology allows for a compact design, enabling easier integration into modern circuit boards with limited space.

Maximum Supply Voltage: 5.5 V

The flexibility of a maximum supply voltage of 5.5V ensures compatibility with various existing electronic systems without risk of damage.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization on circuit boards, facilitating efficient placement and improved layout options.

Maximum Transmit Delay: 30 ns

A maximum transmit delay of only 30 ns ensures high-speed data communication, making it suitable for fast-paced applications.

Power Supplies (V): 5

Operating on a standard 5V power supply simplifies the design and reduces the complexity of power management in your systems.

No. of Terminals: 8

With 8 terminals, the product offers versatile connectivity options, accommodating a variety of circuit configurations.

Package Style (Meter): SMALL OUTLINE

A small outline package style allows for a more compact board layout, freeing up space for other components.

Minimum Supply Voltage: 4.5 V

The 4.5V minimum supply voltage provides flexibility for integration into systems that operate with varying voltage levels.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliable performance in a wide range of environments, ideal for industrial applications.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, this product can function effectively in mildly cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and resistance to corrosion, enhancing long-term reliability and performance.

Terminal Position: DUAL

Dual terminal positions facilitate flexibility in circuit design, allowing for easier integration in various layouts.

Maximum Seated Height: 1.75 mm

A maximum seated height of 1.75 mm allows for low-profile designs, crucial for compact and space-critical applications.

Width: 3.9 mm

The compact width of 3.9 mm makes this device suitable for densely populated electronic assemblies.

Maximum Output Low Current: 4 Amp

The ability to output a maximum low current of 4 Amp allows the device to drive loads effectively, making it powerful for various applications.

Differential Output: YES

Differential output enhances noise immunity and improves signal integrity over long distances, which is critical for reliable data transmission.

Length: 4.9 mm

At just 4.9 mm in length, the device maintains a small footprint, perfect for space-constrained environments.

Minimum Out Swing: 1.5 V

A minimum output swing of 1.5V is vital for ensuring clear signal levels in data communications, enhancing reliability.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates suitability for general-purpose applications, ensuring it meets everyday use requirements.

Maximum Receive Delay: 30 ns

With a maximum receive delay of 30 ns, the device ensures efficient data handling, critical for high-speed applications.

Terminal Form: GULL WING

Gull wing terminal form provides excellent soldering characteristics, ensuring strong connections and ease of handling during assembly.

Interface Standard: EIA-422; EIA-485

Compliance with EIA-422 and EIA-485 standards ensures compatibility with industry-standard protocols, allowing easy integration into existing systems.

Maximum Supply Current: 5 mA

With a maximum supply current of only 5 mA, this device is energy-efficient, which is ideal for low-power applications.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

The differential Schmitt trigger input characteristics provide effective noise filtering and clean signal transitions, enhancing performance in noisy environments.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V aligns with common electronic systems, simplifying design and compatibility.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for more precise mounting, enhancing the reliability of the connections in compact designs.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, this IC is specifically designed for efficient data transmission over long distances, making it suitable for communication applications.

Technical Specifications

Line Drivers & Receivers ST485ACD attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422; EIA-485

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

1.5 V

Maximum Output Low Current:

4 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

30 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

5 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

30 ns

Width:

3.9 mm

Trade Compliance

ST485ACD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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