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ST485EBN

STMicroelectronics

ST485EBN by STMicroelectronics

ST485EBN by STMicroelectronics is a Line Driver & Receiver with 5V supply, 45ns max transmit delay, and EIA-422/EIA-485 interface. It operates in industrial temperature range (-40 to 85 °C) and has differential output for various applications requiring reliable communication.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,406 parts In-Stock

1+ parts

-

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-

1k+ parts

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7,406

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Digiode

USA . 3,684 parts In-Stock

1+ parts

-

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-

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3,684

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Anansix

USA . 1,038 parts In-Stock

1+ parts

-

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-

1k+ parts

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-

1,038

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-

-

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ECAB

Sweden . 300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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300

-

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 703 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

10k+ parts

-

703

$1.500

$1.462

$1.455

-

Microchip USA

USA . 155 parts In-Stock

1+ parts

$2.853

100+ parts

-

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-

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155

$2.853

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AZTECH Wire

Italy . 588 parts In-Stock

1+ parts

$7.191

100+ parts

-

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588

$7.191

-

-

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IDEA Electronic Components Group

UK . 210 parts In-Stock

1+ parts

$10.154

100+ parts

-

1k+ parts

$9.139

10k+ parts

-

210

$10.154

-

$9.139

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Ampacity Inc.

Singapore . 1,159 parts In-Stock

1+ parts

$16.500

100+ parts

-

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1,159

$16.500

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MKK Technologies

India . 458 parts In-Stock

1+ parts

$19.094

100+ parts

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458

$19.094

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DigiPath Technology Company

USA . 458 parts In-Stock

1+ parts

$19.094

100+ parts

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458

$19.094

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Corphita

USA . 3,373 parts In-Stock

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3,373

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Argo Parts USA

USA . 3,261 parts In-Stock

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3,261

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

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2,500

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Vigor

Singapore . 1,381 parts In-Stock

1+ parts

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1,381

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Continental Prestige Electronics

USA . 570 parts In-Stock

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570

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Parana Technologies

USA . 465 parts In-Stock

1+ parts

-

100+ parts

$12.141

1k+ parts

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465

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$12.141

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Bastille Electronics

Australia . 74 parts In-Stock

1+ parts

-

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74

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Overview

Experience unparalleled quality and reliability with the ST485EBN Line Drivers & Receivers by STMicroelectronics. This innovative product offers customers a versatile solution for their communication needs, with a wide range of applications in industrial settings. With its durable plastic/epoxy construction and precise engineering, this device ensures optimal performance even in challenging environments. Trust in STMicroelectronics to deliver cutting-edge technology that brings value and efficiency to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability for the product, making it a good choice for long-term use.

Maximum Supply Voltage: 5.25 V

With a maximum supply voltage of 5.25 V, this product can handle higher voltage levels, increasing its versatility and compatibility with various systems.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy installation and integration into existing setups, making it a convenient choice for users.

Maximum Transmit Delay: 45 ns

A low maximum transmit delay of 45 ns ensures fast and efficient data transmission, making this product suitable for high-speed applications.

Power Supplies (V): 5

The 5 V power supply is a common standard in many systems, ensuring compatibility and ease of use with a wide range of devices.

Terminal Finish: MATTE TIN

MATTE TIN terminal finish provides corrosion resistance and conductivity, improving the overall performance and longevity of the product.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this product can operate effectively in harsh environments, making it a reliable choice for industrial applications.

Interface Standard: EIA-422; EIA-485

Support for EIA-422 and EIA-485 interface standards ensures compatibility with a wide range of communication protocols, making this product versatile and suitable for different systems.

Technical Specifications

Line Drivers & Receivers ST485EBN attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422; EIA-485

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

1.5 V

Maximum Output Low Current:

4 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

130 ns

Receiver No. of Bits:

1

Maximum Seated Height:

4.8 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

.9 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

45 ns

Width:

7.62 mm

Trade Compliance

ST485EBN Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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