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ST485CD

STMicroelectronics

ST485CD by STMicroelectronics

ST485CD by STMicroelectronics is a Line Driver & Receiver IC with 8 terminals, operating at 5V. It features EIA-422 and EIA-485 interface standards, with a max transmit delay of 70ns. Ideal for applications requiring differential outputs and Schmitt trigger input characteristics.

Median Price

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Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Goldney Electronics S.L.

Spain . 2,272 parts In-Stock

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Vyrian

USA . 1,070 parts In-Stock

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1,070

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Nova Conductors

Japan . 650 parts In-Stock

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650

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Anansix

USA . 171 parts In-Stock

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171

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Huijzer Components

Netherlands . 100 parts In-Stock

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100

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Pegasus Components GmbH

Germany . 90 parts In-Stock

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90

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ComSIT Distribution GmbH

Germany . 87 parts In-Stock

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87

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ComSIT USA

USA . 87 parts In-Stock

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87

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Tectiva GmbH

Germany . 60 parts In-Stock

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60

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Digiode

USA . 56 parts In-Stock

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56

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Bristol Electronics

USA . 35 parts In-Stock

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35

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Flex Direct, LLC

USA . 35 parts In-Stock

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35

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Distributors (Availability)

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Corohmni

South Africa . 95 parts In-Stock

1+ parts

$4.194

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95

$4.194

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IDEA Electronic Components Group

UK . 2,093 parts In-Stock

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$9.137

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$8.223

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2,093

$9.137

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$8.223

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AZTECH Wire

Italy . 407 parts In-Stock

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$10.450

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407

$10.450

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Aztec Data Supply Inc.

USA . 2,380 parts In-Stock

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$11.629

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$11.629

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MKK Technologies

India . 1,962 parts In-Stock

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$17.181

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$17.181

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DigiPath Technology Company

USA . 1,962 parts In-Stock

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$17.181

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$17.181

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Ampacity Inc.

Singapore . 1,572 parts In-Stock

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$42.500

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$42.500

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Continental Prestige Electronics

USA . 6,009 parts In-Stock

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Lixinc

USA . 3,398 parts In-Stock

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Argo Parts USA

USA . 3,061 parts In-Stock

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Parana Technologies

USA . 1,193 parts In-Stock

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$10.924

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$10.924

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Aranea Global

USA . 1,000 parts In-Stock

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Corphita

USA . 210 parts In-Stock

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Assy Fe

Spain . 190 parts In-Stock

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Overview

Experience unmatched reliability and performance with the ST485CD from STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics ensures top-notch quality in every product they offer. The ST485CD is a versatile line driver and receiver suitable for various applications. With a compact design and high efficiency, this product guarantees seamless communication and data transmission. Trust STMicroelectronics to deliver innovative solutions that elevate your projects to new heights. Unlock the potential of your systems with the ST485CD today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, suitable for electronic components.

Surface Mount: YES

Easy to mount and fits well in compact spaces.

Maximum Supply Voltage: 5.25 V

Allows for a wide range of voltage input, making it versatile for different applications.

Maximum Transmit Delay: 70 ns

Fast transmission delay ensures efficient data transfer.

Power Supplies (V): 5

Standard power supply voltage, commonly available and easy to integrate.

No. of Terminals: 8

Sufficient terminals for connectivity and interfacing with other components.

Minimum Supply Voltage: 4.75 V

Allows for a stable operation even at lower voltage levels.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures, suitable for industrial environments.

Minimum Operating Temperature: 0 °C

Operational at low temperatures, suitable for a wide range of environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Corrosion-resistant finish for long-term reliability.

Terminal Position: DUAL

Provides redundancy and improves signal integrity.

Maximum Seated Height: 1.75 mm

Low-profile design for space-constrained installations.

Width: 3.9 mm

Compact size, fits well in tight spaces.

Maximum Output Low Current: 4 Amp

High output current capability for driving various loads.

Differential Output: YES

Delivers reliable signal transmission over long distances.

Length: 4.9 mm

Compact size, suitable for small form factor applications.

Minimum Out Swing: 1.5 V

Low voltage swing for efficient power consumption.

Temperature Grade: COMMERCIAL

Suitable for commercial-grade applications.

Maximum Receive Delay: 230 ns

Quick receiving delay ensures timely data reception.

Terminal Form: GULL WING

Allows for easy soldering and mounting on PCBs.

Interface Standard: EIA-422; EIA-485

Compliance with industry standards for seamless integration.

Maximum Supply Current: 0.9 mA

Low power consumption for energy-efficient operation.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

Provides noise immunity and reliable signal processing.

Nominal Supply Voltage: 5 V

Standard voltage for easy integration with existing systems.

Terminal Pitch: 1.27 mm

Optimal pitch for easy soldering and connectivity.

Interface IC Type: LINE TRANSCEIVER

Specifically designed for data transmission and reception tasks.

Technical Specifications

Line Drivers & Receivers ST485CD attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422; EIA-485

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

1.5 V

Maximum Output Low Current:

4 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

230 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

.9 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

70 ns

Width:

3.9 mm

Trade Compliance

ST485CD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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