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ST485ERXDR

STMicroelectronics

ST485ERXDR by STMicroelectronics

ST485ERXDR by STMicroelectronics is a robust line transceiver with a max supply voltage of 5.25V, operating temp range from -55 °C to 150 °C, and a max transmit delay of 60ns. Ideal for EIA-422/EIA-485 applications, it ensures reliable data communication in harsh environments. Its compact SO package and low power consumption make it suitable for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,775 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,775

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-

-

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Digiode

USA . 1,843 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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1,843

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-

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Anansix

USA . 302 parts In-Stock

1+ parts

-

100+ parts

-

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302

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,145 parts In-Stock

1+ parts

$4.240

100+ parts

-

1k+ parts

-

10k+ parts

-

2,145

$4.240

-

-

-

IDEA Electronic Components Group

UK . 1,637 parts In-Stock

1+ parts

$5.472

100+ parts

-

1k+ parts

$4.925

10k+ parts

-

1,637

$5.472

-

$4.925

-

Microchip USA

USA . 272 parts In-Stock

1+ parts

$8.088

100+ parts

-

1k+ parts

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10k+ parts

-

272

$8.088

-

-

-

MKK Technologies

India . 1,555 parts In-Stock

1+ parts

$10.290

100+ parts

-

1k+ parts

-

10k+ parts

-

1,555

$10.290

-

-

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DigiPath Technology Company

USA . 1,555 parts In-Stock

1+ parts

$10.290

100+ parts

-

1k+ parts

-

10k+ parts

-

1,555

$10.290

-

-

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AZTECH Wire

Italy . 875 parts In-Stock

1+ parts

$17.540

100+ parts

-

1k+ parts

-

10k+ parts

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875

$17.540

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-

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A-Z Elektronik GmbH

Germany . 5,565 parts In-Stock

1+ parts

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100+ parts

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5,565

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Corphita

USA . 3,738 parts In-Stock

1+ parts

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3,738

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Parana Technologies

USA . 1,999 parts In-Stock

1+ parts

-

100+ parts

$6.543

1k+ parts

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10k+ parts

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1,999

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$6.543

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Perfect Parts

USA . 1,023 parts In-Stock

1+ parts

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1,023

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Overview

Elevate your designs with the ST485ERXDR from STMicroelectronics, a top-tier line driver and receiver that combines unparalleled reliability with exceptional performance. Crafted for versatility, it seamlessly integrates into various applications, from industrial automation to telecommunications. With STMicroelectronics' commitment to quality, enjoy peace of mind knowing you’re backed by a leader in innovation. Experience superior communication efficiency and unleash your project’s potential today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and protection against environmental factors, making this product suitable for various applications.

Surface Mount: YES

Being surface mount allows for compact design and easier integration into printed circuit boards, contributing to space-saving solutions.

Maximum Supply Voltage: 5.25 V

A higher maximum supply voltage provides flexibility in various applications while ensuring stable operation.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on the PCB, facilitating better layouts.

Maximum Transmit Delay: 60 ns

A low transmit delay results in faster signal transmission, enhancing overall system performance.

Power Supplies (V): 5

Operating at a standard 5V supply voltage makes this product compatible with a wide range of electronic systems.

Number of Terminals: 8

With 8 terminals, this line driver/receiver offers multiple connections for better functionality and versatility in circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style reduces space requirements and facilitates high-density applications.

Maximum High Level Input Current: 0.000002 Amp

A very low maximum input current ensures minimal power consumption, making this product energy-efficient.

Minimum Supply Voltage: 4.75 V

A low minimum supply voltage allows for operation in various input voltage scenarios, providing more flexibility.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature rating makes this product suitable for extreme environments and demanding applications.

Minimum Operating Temperature: -55 °C

Ability to operate at low temperatures ensures reliability in harsh conditions, essential for military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent corrosion resistance and enhances reliability in connections.

Terminal Position: DUAL

Dual terminal positioning facilitates better routing options on the PCB, allowing for more flexible designs.

Maximum Seated Height: 1.75 mm

A low seated height allows for more flexible fitting in tight spaces, making it ideal for compact devices.

Width: 3.9 mm

A narrow width allows for space-efficient designs, ideal for applications where PCB real estate is limited.

Maximum Output Low Current: 4 Amp

Capability to handle a maximum output low current of 4A supports robust performance during low output scenarios.

Differential Output: YES

Differential output architecture enhances noise immunity, ensuring reliable data transmission over long distances.

Length: 4.9 mm

Short length contributes to smaller overall footprint on a PCB, optimizing space use in circuit designs.

Minimum Out Swing: 1.5 V

A minimum out swing of 1.5V ensures compatibility with various signaling standards, enhancing operational versatility.

Temperature Grade: MILITARY

Rated for military use, this product guarantees robust performance and reliability in critical applications.

Maximum Receive Delay: 210 ns

A maximum receive delay of 210 ns supports fast communications, making it suitable for time-sensitive applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve reliability in PCB assembly compared to other terminal forms.

Interface Standard: EIA-422; EIA-485

Supports industry standards EIA-422 and EIA-485, simplifying integration in various communication systems.

Maximum Supply Current: 0.9 mA

Low supply current ensures energy efficiency, making it suited for battery-powered devices and applications.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

The differential Schmitt trigger input provides high noise immunity and fast response times for reliable signal processing.

Nominal Supply Voltage: 5 V

Operates on a standard nominal supply voltage of 5V, ensuring compatibility with a wide variety of electronic devices.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for denser component placement on PCBs, optimizing design layout.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, this IC is optimized for data communication, making it ideal for applications requiring reliable line drivers and receivers.

Technical Specifications

Line Drivers & Receivers ST485ERXDR attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.000002 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422; EIA-485

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Minimum Out Swing:

1.5 V

Maximum Output Low Current:

4 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

210 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

.9 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

60 ns

Width:

3.9 mm

Trade Compliance

ST485ERXDR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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