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ST2041BDR

STMicroelectronics

ST2041BDR by STMicroelectronics

ST2041BDR by STMicroelectronics is a versatile power management IC designed for applications requiring 2.7-5.5V supply voltage. It features an 8-terminal gull-wing package and operates within -40 °C to 85 °C, making it ideal for compact electronic devices. Its small outline design ensures efficient space utilization in various power supply support circuits.

Median Price

$0.950

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 418 parts In-Stock

1+ parts

$0.950

100+ parts

-

1k+ parts

-

10k+ parts

-

418

$0.950

-

-

-

DF Sales Co.

USA . 418 parts In-Stock

1+ parts

$0.950

100+ parts

-

1k+ parts

-

10k+ parts

-

418

$0.950

-

-

-

Vyrian

USA . 6,748 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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6,748

-

-

-

-

Anansix

USA . 2,828 parts In-Stock

1+ parts

-

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-

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2,828

-

-

-

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Digiode

USA . 1,229 parts In-Stock

1+ parts

-

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-

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-

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1,229

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,173 parts In-Stock

1+ parts

$7.821

100+ parts

-

1k+ parts

$7.039

10k+ parts

-

2,173

$7.821

-

$7.039

-

AZTECH Wire

Italy . 422 parts In-Stock

1+ parts

$10.590

100+ parts

-

1k+ parts

-

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-

422

$10.590

-

-

-

Microchip USA

USA . 233 parts In-Stock

1+ parts

$13.886

100+ parts

-

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-

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233

$13.886

-

-

-

MKK Technologies

India . 1,393 parts In-Stock

1+ parts

$14.707

100+ parts

-

1k+ parts

-

10k+ parts

-

1,393

$14.707

-

-

-

DigiPath Technology Company

USA . 1,393 parts In-Stock

1+ parts

$14.707

100+ parts

-

1k+ parts

-

10k+ parts

-

1,393

$14.707

-

-

-

Advanced Electronics

New Zealand . 15 parts In-Stock

1+ parts

$27.932

100+ parts

$25.418

1k+ parts

$22.904

10k+ parts

-

15

$27.932

$25.418

$22.904

-

A-Z Elektronik GmbH

Germany . 5,243 parts In-Stock

1+ parts

-

100+ parts

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5,243

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-

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Vigor

Singapore . 2,914 parts In-Stock

1+ parts

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2,914

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-

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Parana Technologies

USA . 2,038 parts In-Stock

1+ parts

-

100+ parts

$9.351

1k+ parts

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10k+ parts

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2,038

-

$9.351

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Corphita

USA . 688 parts In-Stock

1+ parts

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688

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Kepictronics

USA . 100 parts In-Stock

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100

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Overview

Unlock the full potential of your electronic designs with the ST2041BDR from STMicroelectronics, a leader in power management solutions. Engineered for reliability and efficiency, this compact IC excels in applications ranging from consumer electronics to industrial systems. With its robust thermal performance and superior build quality, you can trust it to deliver consistent power support while optimizing space in your designs. Experience enhanced performance and peace of mind with STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials provides durability and reliability, ensuring the IC can withstand various environmental conditions.

Surface Mount: YES

Surface mount capability allows for efficient space-saving designs and is compatible with modern automated assembly techniques.

Package Shape: RECTANGULAR

The rectangular shape optimizes board layout and contributes to ease of integration into designs.

Nominal Supply Voltage (Vsup): 5 V

A nominal supply voltage of 5 V is widely used in consumer electronics, making this IC suitable for a variety of applications.

No. of Terminals: 8

8 terminals provide ample configurability and connectivity options for different circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes board space usage while still allowing for effective thermal management.

Maximum Operating Temperature: 85 °C

Operating at a maximum temperature of 85 °C ensures reliable performance in moderately warm environments without risk of damage.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature means this IC can be utilized in colder environments, widening its application range.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances solderability, ensuring reliable electrical connections and longevity.

Terminal Position: DUAL

Dual terminal positioning enhances the versatility in PCB layouts and simplifies routing.

Maximum Seated Height: 1.75 mm

A maximum seated height of 1.75 mm promotes a low-profile design, facilitating compact device integration.

Width: 3.9 mm

A width of 3.9 mm is ideal for tightly packed circuit boards, contributing to more efficient designs.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, it is crucial for applications requiring stable voltage regulation, enhancing overall system reliability.

Minimum Supply Voltage (Vsup): 2.7 V

The ability to operate down to a minimum supply voltage of 2.7 V allows for flexibility in power source options.

Length: 4.9 mm

At a length of 4.9 mm, this IC is compact, providing additional design options for space-constrained applications.

Terminal Form: GULL WING

Gull wing terminal form promotes easy soldering and ensures strong physical connections on the PCB.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch strikes a balance between compactness and ease of manual soldering, making assembly easier.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5 V, the IC can handle slight voltage fluctuations without risking failure.

Technical Specifications

Power Management ICs ST2041BDR attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

ST2041BDR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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