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ST2044BDR

STMicroelectronics

ST2044BDR by STMicroelectronics

ST2044BDR from STMicroelectronics is a dual-channel power management IC designed for industrial applications. It operates b/w 2.7V and 5.5V, with a max temp of 85 °C and features a compact SO package (3.9mm x 9.9mm). Ideal for efficient power supply support in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,914 parts In-Stock

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8,914

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Digiode

USA . 3,110 parts In-Stock

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3,110

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Anansix

USA . 1,525 parts In-Stock

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1,525

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Distributors (Availability)

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Microchip USA

USA . 474 parts In-Stock

1+ parts

$0.751

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-

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474

$0.751

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IDEA Electronic Components Group

UK . 396 parts In-Stock

1+ parts

$1.258

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-

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$1.132

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396

$1.258

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$1.132

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MKK Technologies

India . 620 parts In-Stock

1+ parts

$2.365

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620

$2.365

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DigiPath Technology Company

USA . 620 parts In-Stock

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$2.365

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620

$2.365

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AZTECH Wire

Italy . 651 parts In-Stock

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$9.540

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651

$9.540

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A-Z Elektronik GmbH

Germany . 7,365 parts In-Stock

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7,365

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Corphita

USA . 3,613 parts In-Stock

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3,613

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Vigor

Singapore . 2,905 parts In-Stock

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2,905

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Parana Technologies

USA . 289 parts In-Stock

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$1.504

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289

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$1.504

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Overview

Unlock the power of efficiency with the ST2044BDR from STMicroelectronics, a leading innovator in power management solutions. This robust IC delivers exceptional reliability across diverse applications, from industrial automation to consumer electronics. Its compact design ensures seamless integration into your projects, while its wide operating temperature range guarantees performance in challenging environments. Experience unparalleled quality and elevate your designs with this trusted component, crafted to enhance your product's value and longevity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental stress, making this IC suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of PCB space as well as automated assembly processes.

Package Shape: RECTANGULAR

A rectangular shape optimizes the layout on the circuit board, facilitating easier placement and soldering.

Nominal Supply Voltage (Vsup): 5.5 V

A nominal supply voltage of 5.5V provides a stable operating range that is compatible with many common power supply designs.

No. of Terminals: 16

With 16 terminals, this IC offers multiple connection options for circuits, enhancing versatility and integration possibilities.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for lower profile configurations, beneficial in space-constrained applications.

Maximum Operating Temperature: 85 °C

An operating temperature of 85 °C ensures reliable performance in industrial environments where heat dissipation might be a concern.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this IC suitable for applications in harsh environments, such as automotive and outdoor installations.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish improves solderability and ensures reliable electrical connections, enhancing the product's longevity.

Terminal Position: DUAL

Dual terminal position provides increased flexibility in PCB layout and can help in better routing of traces.

Maximum Seated Height: 1.75 mm

A low profile of 1.75 mm aids in compact designs, making it suitable for slim devices.

Width: 3.9 mm

A narrow width of 3.9 mm is optimal for densely populated boards, allowing for greater component density.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, this IC is essential for optimizing power management in various electronic designs.

Minimum Supply Voltage (Vsup): 2.7 V

A minimum supply voltage of 2.7 V enables operation in low-power applications, making it energy-efficient.

Maximum Time At Peak Reflow Temperature: 30 s

A peak reflow time of 30 seconds minimizes thermal stress during assembly, ensuring device reliability post-manufacturing.

Peak Reflow Temperature: 260 °C

A high peak reflow temperature capability allows compatibility with lead-free soldering processes, aligning with industry standards.

Length: 9.9 mm

The length of 9.9 mm strikes a balance between space savings and functional integration on the PCB.

Temperature Grade: INDUSTRIAL

An industrial temperature grade indicates that this IC is designed to withstand challenging conditions, suitable for critical applications.

No. of Channels: 2

Having 2 channels allows for versatile control of multiple power outputs, enhancing flexibility in power management.

Terminal Form: GULL WING

Gull wing terminals promote reliable solder joints and ease of visual inspection, improving assembly quality.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm fits well with standard PCB designs, allowing for efficient spacing and placement of components.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate moisture sensitivity, ensuring proper handling during assembly to maintain reliability.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V offers flexibility for application in different circuits without exceeding voltage limits.

Technical Specifications

Power Management ICs ST2044BDR attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

5.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

ST2044BDR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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