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ST2054BD

STMicroelectronics

ST2054BD by STMicroelectronics

ST2054BD by STMicroelectronics is a dual-channel power management IC designed for industrial applications. It operates within a supply voltage range of 2.7V to 5.5V and supports temperatures from -40 °C to 85 °C. Its compact SO package (3.9mm x 9.9mm) ensures efficient surface mounting in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,434 parts In-Stock

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6,434

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Anansix

USA . 752 parts In-Stock

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752

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Digiode

USA . 215 parts In-Stock

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215

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,473 parts In-Stock

1+ parts

$1.115

100+ parts

-

1k+ parts

$1.004

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1,473

$1.115

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$1.004

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MKK Technologies

India . 195 parts In-Stock

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$2.097

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195

$2.097

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DigiPath Technology Company

USA . 195 parts In-Stock

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$2.097

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195

$2.097

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AZTECH Wire

Italy . 726 parts In-Stock

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$8.260

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726

$8.260

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Component Stockers USA

USA . 579 parts In-Stock

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$99.990

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579

$99.990

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Microchip USA

USA . 4,883 parts In-Stock

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4,883

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Corphita

USA . 4,489 parts In-Stock

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4,489

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Vigor

Singapore . 2,471 parts In-Stock

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2,471

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Kepictronics

USA . 1,000 parts In-Stock

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1,000

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Parana Technologies

USA . 877 parts In-Stock

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$1.333

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877

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$1.333

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Overview

Unlock unparalleled efficiency with the ST2054BD from STMicroelectronics, a leader in innovative power management solutions. Designed for industrial applications, this dual-channel IC ensures reliable performance across extreme temperatures, making it perfect for demanding environments. With its compact package and exceptional quality, the ST2054BD enhances your designs, providing stability and longevity that translates into cost savings and superior functionality for your projects. Elevate your product development with STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials enhances durability and provides good thermal and electrical insulation, making the product reliable in various applications.

Surface Mount: YES

Surface mount technology offers a compact design and ease of integration into modern circuit boards, saving space and improving manufacturing efficiency.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization on PCB while ensuring effective heatsink performance, leading to better thermal management.

Nominal Supply Voltage (Vsup): 3.3 V

A nominal supply voltage of 3.3 V is common in various digital devices, making it versatile for numerous applications, especially in low-power electronic systems.

No. of Terminals: 16

With 16 terminals, the IC can facilitate multiple connections, providing more functionalities and flexibility in design configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for a compact design, enabling integration into space-constrained applications without sacrificing performance.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in industrial environments, enhancing durability and longevity of the device.

Minimum Operating Temperature: -40 °C

The capability to operate at -40 °C makes it suitable for harsh environments, extending its application range in outdoor and industrial settings.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel-palladium-gold finish provides excellent corrosion resistance and improved solderability, ensuring reliable electrical connections over time.

Terminal Position: DUAL

Dual terminal positioning allows for easier routing on PCB layouts, which can improve design efficiency and simplify assembly processes.

Maximum Seated Height: 1.75 mm

A maximum seated height of 1.75 mm supports low-profile designs, enabling the IC to fit into compact devices without taking up excessive space.

Width: 3.9 mm

A width of 3.9 mm is optimal for space-saving designs while still allowing for adequate thermal dissipating capabilities.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, the IC aids in regulating power effectively, ensuring stable performance in power-sensitive applications.

Minimum Supply Voltage (Vsup): 2.7 V

The minimum supply voltage of 2.7 V allows it to operate effectively in low-voltage applications, increasing versatility across various electronic devices.

Length: 9.9 mm

A length of 9.9 mm complements the small footprint, allowing for efficient layout design in compact PCB configurations.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, the IC is built to withstand more demanding operational conditions, ensuring reliability in critical applications.

No. of Channels: 2

Having 2 channels provides flexibility for managing multiple power outputs, which is beneficial for complex circuit designs.

Terminal Form: GULL WING

Gull wing terminals improve the mechanical stability of the IC when soldered, reducing the risk of damage during handling or thermal cycling.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is standard for many applications, facilitating easier compatibility with common PCB layouts and assembly methods.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this IC is suitable for automated assembly processes while providing some protection against moisture-related failures.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V expands compatibility with various power sources, making the IC suitable for a range of applications from battery-powered to main-powered devices.

Technical Specifications

Power Management ICs ST2054BD attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

ST2054BD Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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