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ST2052BDR

STMicroelectronics

ST2052BDR by STMicroelectronics

ST2052BDR from STMicroelectronics is a versatile power management IC designed for industrial applications. It operates within a supply voltage range of 2.7V to 5.5V and withstands temperatures from -40 °C to 85 °C. Its compact 8-terminal, surface-mount design ensures efficient space utilization in electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,881 parts In-Stock

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6,881

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Inventory MP

USA . 2,500 parts In-Stock

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2,500

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Bristol Electronics

USA . 2,500 parts In-Stock

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2,500

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Digiode

USA . 1,492 parts In-Stock

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1,492

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Anansix

USA . 615 parts In-Stock

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615

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LWI Electronics Inc

India . 30 parts In-Stock

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30

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ACDS - Activité Composants Distribution Service

France . 11 parts In-Stock

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11

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 563 parts In-Stock

1+ parts

$1.776

100+ parts

-

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$1.598

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563

$1.776

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$1.598

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MKK Technologies

India . 2,084 parts In-Stock

1+ parts

$3.339

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2,084

$3.339

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DigiPath Technology Company

USA . 2,084 parts In-Stock

1+ parts

$3.339

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2,084

$3.339

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AZTECH Wire

Italy . 1,044 parts In-Stock

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$17.580

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1,044

$17.580

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Perfect Parts

USA . 50,400 parts In-Stock

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50,400

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Cyclops Electronics Ltd (Excess)

UK . 22,511 parts In-Stock

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Kepictronics

USA . 19,680 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 18,020 parts In-Stock

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Microchip USA

USA . 8,150 parts In-Stock

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Corphita

USA . 1,923 parts In-Stock

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1,923

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A-Z Elektronik GmbH

Germany . 1,715 parts In-Stock

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Vigor

Singapore . 1,076 parts In-Stock

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1,076

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Parana Technologies

USA . 285 parts In-Stock

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$2.123

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285

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$2.123

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Authorized Procurement Solutions

USA . 75 parts In-Stock

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75

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Overview

Elevate your power management solutions with the ST2052BDR from STMicroelectronics, a trusted name in innovation and reliability. Designed for industrial applications, this compact IC offers robust performance within a wide temperature range, ensuring your systems operate seamlessly under challenging conditions. With its superior quality and durability, the ST2052BDR enhances efficiency and provides exceptional value, empowering your designs to achieve optimal results. Unlock new possibilities today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it suitable for a range of applications.

Surface Mount: YES

Surface mount capability allows for compact designs and ease of integration into modern PCB layouts.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient space utilization on the circuit board, enhancing the product's versatility.

Nominal Supply Voltage (Vsup): 3.3 V

Operating at a standard voltage level of 3.3 V is ideal for most digital applications, ensuring compatibility and reliability.

No. of Terminals: 8

Eight terminals provide sufficient connectivity options while maintaining a compact footprint for flexibility in design.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to reduced board space requirements, crucial for modern electronic devices.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in diverse industrial environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this IC is suitable for applications in extreme conditions, ensuring reliability.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances solderability and oxidation resistance, ensuring long-term reliability and performance.

Terminal Position: DUAL

Dual terminal position optimizes layout flexibility, accommodating various PCB designs and improving overall adaptability.

Maximum Seated Height: 1.75 mm

The low seated height allows for a compact design while ensuring that the IC can fit in tight spaces.

Width: 3.9 mm

With a width of only 3.9 mm, this IC can easily be integrated into space-constrained applications.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being categorized as a power supply support circuit makes it ideal for enhancing power management in electronic systems.

Minimum Supply Voltage (Vsup): 2.7 V

A minimum supply voltage of 2.7 V allows for broader application versatility in various digital circuits.

Maximum Time At Peak Reflow Temperature (s): 40

Supporting a lengthy reflow time of up to 40 seconds allows for better soldering quality and reliability after assembly.

Peak Reflow Temperature (°C): 260

A peak reflow temperature of 260 °C ensures compatibility with modern soldering processes, enhancing production efficiency.

Length: 4.9 mm

The compact length of 4.9 mm promotes a space-efficient component layout on printed circuit boards.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures that the IC can withstand rigorous operating conditions, ideal for demanding applications.

Terminal Form: GULL WING

Gull wing terminals allow for easy soldering and efficient space utilization, providing a robust connection in various environments.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between ease of soldering and compact design, facilitating versatile PCB layouts.

Maximum Supply Voltage (Vsup): 5.5 V

The ability to accommodate a maximum supply voltage of 5.5 V makes this IC suitable for diverse power supply requirements.

Technical Specifications

Power Management ICs ST2052BDR attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3.9 mm

Trade Compliance

ST2052BDR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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