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ST2054BDR

STMicroelectronics

ST2054BDR by STMicroelectronics

ST2054BDR from STMicroelectronics is a dual-channel power management IC designed for industrial applications. It operates b/w 2.7V and 5.5V, with a max temp of 85 °C and features a compact SO package (3.9mm x 9.9mm). Ideal for efficient power supply support in various devices.

Median Price

$3.350

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,214 parts In-Stock

1+ parts

$3.350

100+ parts

$2.462

1k+ parts

$1.768

10k+ parts

$1.616

2,214

$3.350

$2.462

$1.768

$1.616

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 234 parts In-Stock

1+ parts

$3.182

100+ parts

-

1k+ parts

-

10k+ parts

-

234

$3.182

-

-

-

Vyrian

USA . 1,687 parts In-Stock

1+ parts

$3.350

100+ parts

-

1k+ parts

-

10k+ parts

-

1,687

$3.350

-

-

-

Anansix

USA . 2,229 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,229

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,518 parts In-Stock

1+ parts

$3.015

100+ parts

-

1k+ parts

-

10k+ parts

-

2,518

$3.015

-

-

-

Vigor

Singapore . 2,170 parts In-Stock

1+ parts

$3.310

100+ parts

-

1k+ parts

-

10k+ parts

-

2,170

$3.310

-

-

-

Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$9.893

100+ parts

$9.003

1k+ parts

$8.112

10k+ parts

-

40

$9.893

$9.003

$8.112

-

IDEA Electronic Components Group

UK . 333 parts In-Stock

1+ parts

$19.887

100+ parts

-

1k+ parts

$17.898

10k+ parts

-

333

$19.887

-

$17.898

-

MKK Technologies

India . 2,038 parts In-Stock

1+ parts

$37.396

100+ parts

-

1k+ parts

-

10k+ parts

-

2,038

$37.396

-

-

-

DigiPath Technology Company

USA . 2,038 parts In-Stock

1+ parts

$37.396

100+ parts

-

1k+ parts

-

10k+ parts

-

2,038

$37.396

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 19,517 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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19,517

-

-

-

-

A-Z Elektronik GmbH

Germany . 6,339 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,339

-

-

-

-

Microchip USA

USA . 3,961 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,961

-

-

-

-

Perfect Parts

USA . 2,564 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,564

-

-

-

-

Parana Technologies

USA . 1,285 parts In-Stock

1+ parts

-

100+ parts

$23.778

1k+ parts

-

10k+ parts

-

1,285

-

$23.778

-

-

Overview

Unlock the power of innovation with the ST2054BDR from STMicroelectronics, a trusted leader in cutting-edge technology. Designed for excellence, this versatile Power Management IC excels in demanding applications, offering reliable performance across a wide temperature range. Its compact design and superior quality ensure seamless integration into your projects, enhancing efficiency while reducing space. Experience the benefits of stability and efficiency—transform your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides an excellent balance of durability and cost-effectiveness, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for more compact designs, facilitating higher-density circuit layouts.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB, allowing for efficient integration in design.

Nominal Supply Voltage (Vsup): 3.3 V

This nominal supply voltage is standard for many digital circuits, making it compatible with a wide range of devices.

No. of Terminals: 16

Having 16 terminals enables multiple functionalities, allowing it to cater to complex power management needs.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes the footprint, ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, it is well-suited for demanding industrial environments.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C ensures reliability in extreme conditions, enhancing safety and longevity.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish provides excellent corrosion resistance and reliable electrical connections.

Terminal Position: DUAL

Dual terminal positioning allows for versatile mounting options and easier integration into different circuit layouts.

Maximum Seated Height: 1.75 mm

A low maximum seated height contributes to a slim profile, which is beneficial in compact electronic designs.

Width: 3.9 mm

The narrow width enhances the flexibility of PCB design and usage in smaller devices.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically for power supply applications, this IC ensures optimal voltage regulation and stability.

Minimum Supply Voltage (Vsup): 2.7 V

A minimum supply voltage of 2.7 V provides flexibility for lower-voltage applications, increasing its utility.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures compatibility with modern soldering processes, promoting efficient manufacturing.

Peak Reflow Temperature: 260 °C

The high peak reflow temperature means this IC can endure the manufacturing process without thermal damage.

Length: 9.9 mm

This length complements the overall compact design, facilitating seamless integration onto PCBs.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperatures signifies robustness and suitability for harsh environments.

No. of Channels: 2

Having two channels allows for efficient handling of multiple power management tasks simultaneously.

Terminal Form: GULL WING

Gull wing terminals promote easier soldering and robust connections on the PCB.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is standard, making it easy to find compatible PCBs and reduces layout complexity.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, allowing for reasonable handling and storage options.

Maximum Supply Voltage (Vsup): 5.5 V

The capability to handle up to 5.5 V enhances versatility, making it suitable for a broader range of applications.

Technical Specifications

Power Management ICs ST2054BDR attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

ST2054BDR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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