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ST2051BDR

STMicroelectronics

ST2051BDR by STMicroelectronics

ST2051BDR from STMicroelectronics is a compact power management IC designed for efficient voltage regulation. It operates b/w 2.7V and 5.5V, with a max temp of 85 °C, featuring an 8-terminal gull-wing package. Ideal for various electronic applications requiring reliable power supply support.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,444 parts In-Stock

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7,444

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Digiode

USA . 1,530 parts In-Stock

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1,530

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Anansix

USA . 416 parts In-Stock

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416

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Distributors (Availability)

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Ampacity Inc.

Singapore . 508 parts In-Stock

1+ parts

$4.500

100+ parts

-

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-

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-

508

$4.500

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IDEA Electronic Components Group

UK . 2,077 parts In-Stock

1+ parts

$4.652

100+ parts

-

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$4.186

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-

2,077

$4.652

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$4.186

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MKK Technologies

India . 4 parts In-Stock

1+ parts

$8.747

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4

$8.747

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DigiPath Technology Company

USA . 4 parts In-Stock

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$8.747

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4

$8.747

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AZTECH Wire

Italy . 50 parts In-Stock

1+ parts

$9.460

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50

$9.460

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Component Stockers USA

USA . 290 parts In-Stock

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$99.990

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290

$99.990

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Microchip USA

USA . 6,720 parts In-Stock

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6,720

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Kepictronics

USA . 4,060 parts In-Stock

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4,060

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Vigor

Singapore . 2,971 parts In-Stock

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2,971

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Parana Technologies

USA . 707 parts In-Stock

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$5.562

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707

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$5.562

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Corphita

USA . 159 parts In-Stock

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159

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Overview

Elevate your power management solutions with the ST2051BDR from STMicroelectronics—an epitome of reliability and innovation. Designed for efficiency, this compact IC ensures optimal performance across a range of applications, from consumer electronics to industrial systems. With STMicroelectronics' commitment to quality, you gain a trusted partner that enhances your designs while minimizing space and energy consumption. Unlock unparalleled benefits and pave the way for smarter technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy offers lightweight durability and excellent thermal properties, making the IC suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design and efficient assembly in automated processes, saving board space.

Package Shape: RECTANGULAR

The rectangular shape enables efficient layout options on PCBs, optimizing space utilization and ease of integration.

Nominal Supply Voltage (Vsup): 5 V

With a nominal supply voltage of 5 V, this IC is compatible with a wide range of devices, making it versatile for various applications.

No. of Terminals: 8

Having 8 terminals allows for multiple functionalities and connections, providing flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline package style benefits high-density applications where space is at a premium, ensuring easy integration.

Maximum Operating Temperature: 85 °C

Operating up to 85 °C ensures reliability and stability even in moderately harsh environments, making it suitable for consumer and industrial applications.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0 °C allows for use in standard room conditions as well as some lower temperature environments.

Terminal Position: DUAL

Dual terminal position facilitates easy mounting and improved electrical performance, ensuring reliable connections in circuit designs.

Maximum Seated Height: 1.75 mm

With a maximum seated height of 1.75 mm, this IC is ideal for applications where low-profile components are required.

Width: 3.9 mm

The compact width allows for more efficient space usage on PCB designs, making it easier to fit into dense layouts.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically for power supply support, this IC enhances power management in devices, improving overall performance.

Minimum Supply Voltage (Vsup): 2.7 V

A minimum supply voltage of 2.7 V expands application possibilities to devices operating on lower voltages.

Length: 4.9 mm

A length of 4.9 mm aids in compact PCB designs and contributes to better thermal management in dense configurations.

Terminal Form: GULL WING

The gull wing terminal form allows for easier soldering and reliable connectivity, optimizing assembly processes.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, this IC ensures compatibility with standard PCB designs while providing adequate spacing for connections.

Maximum Supply Voltage (Vsup): 5.5 V

Supporting a maximum supply voltage of 5.5 V grants flexibility for use in systems with slightly higher voltage requirements.

Technical Specifications

Power Management ICs ST2051BDR attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

ST2051BDR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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