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SPC564L54L3CBOQY

STMicroelectronics

SPC564L54L3CBOQY by STMicroelectronics

SPC564L54L3CBOQY by STMicroelectronics is a 32-bit microcontroller with 64-bit external data bus width, operating at up to 40 MHz. Ideal for automotive applications, it features 98304 bytes of RAM, flash ROM programmability, and supports ADC and DMA channels.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,875 parts In-Stock

1+ parts

-

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6,875

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Digiode

USA . 1,197 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,197

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Anansix

USA . 986 parts In-Stock

1+ parts

-

100+ parts

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986

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 590 parts In-Stock

1+ parts

$8.920

100+ parts

-

1k+ parts

-

10k+ parts

-

590

$8.920

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-

-

Microchip USA

USA . 1,929 parts In-Stock

1+ parts

$15.954

100+ parts

-

1k+ parts

-

10k+ parts

-

1,929

$15.954

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-

-

IDEA Electronic Components Group

UK . 383 parts In-Stock

1+ parts

$45.342

100+ parts

-

1k+ parts

$40.808

10k+ parts

-

383

$45.342

-

$40.808

-

MKK Technologies

India . 1,000 parts In-Stock

1+ parts

$85.263

100+ parts

-

1k+ parts

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10k+ parts

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1,000

$85.263

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-

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DigiPath Technology Company

USA . 1,000 parts In-Stock

1+ parts

$85.263

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$85.263

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-

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Vigor

Singapore . 2,466 parts In-Stock

1+ parts

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100+ parts

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2,466

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Corphita

USA . 1,321 parts In-Stock

1+ parts

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1,321

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Parana Technologies

USA . 414 parts In-Stock

1+ parts

-

100+ parts

$54.214

1k+ parts

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10k+ parts

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414

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$54.214

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Overview

Experience superior performance and reliability with the SPC564L54L3CBOQY microcontroller by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers cutting-edge technology for a wide range of applications. This versatile microcontroller offers customers unmatched value and benefits, from its high-quality construction to its seamless integration capabilities. Whether you're working on automotive systems, industrial control, or consumer electronics, the SPC564L54L3CBOQY provides the power and efficiency you need to bring your projects to life. Trust STMicroelectronics to elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to external elements, making the product suitable for a variety of environments.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.63 V

Supports a wide range of input voltages, providing flexibility in power supply options.

Address Bus Width: 32

Allows for efficient data transfer and processing, enhancing the performance of the microcontroller.

Package Shape: SQUARE

Enables compact and efficient design layouts, optimizing space utilization in electronic systems.

Bit Size: 32

Provides higher processing capabilities, allowing for complex calculations and operations.

Power Supplies (V): 3.3

Operates efficiently at a standard voltage, ensuring compatibility with common power sources.

No. of Terminals: 100

Offers a sufficient number of connection points for interfacing with external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Facilitates easy integration into compact electronic devices, enhancing overall system design flexibility.

Minimum Supply Voltage: 3 V

Maintains reliable operation even at lower voltage levels, ensuring stability in diverse operating conditions.

Maximum Operating Temperature: 125 °C

Allows for operation in high-temperature environments, making it suitable for automotive and industrial applications.

CPU Family: SPC56

Belongs to a well-established and reliable microcontroller family, ensuring compatibility and support for various applications.

Minimum Operating Temperature: -40 °C

Ensures reliable performance even in extremely cold conditions, expanding the range of use cases for the product.

ADC Channels: YES

Enables analog-to-digital conversion, essential for interfacing with sensors and capturing real-world data.

DMA Channels: YES

Supports direct memory access for efficient data transfer, reducing processor overhead and improving overall system performance.

Terminal Position: QUAD

Facilitates easy connection to external devices or components in a structured and organized manner.

ROM Words: 786432

Provides ample storage space for program instructions and data, allowing for complex algorithms and applications to be implemented.

Width: 14 mm

Compact form factor makes the product suitable for space-constrained applications and designs.

External Data Bus Width: 64

Provides high-speed data transfer capabilities, enhancing overall system performance and efficiency.

Maximum Clock Frequency: 40 MHz

Supports high-speed processing, enabling rapid data processing and real-time operation.

Length: 14 mm

Compact size allows for easy integration into various electronic devices and systems.

Temperature Grade: AUTOMOTIVE

Designed to withstand automotive environment requirements, ensuring reliable operation in challenging conditions.

Peripheral IC Type: MICROCONTROLLER

Incorporates various integrated peripherals, reducing the need for external components and simplifying system design.

RAM Bytes: 98304

Provides ample memory for storing data and variables, supporting multitasking and complex algorithms.

Technology: CMOS

Utilizes low power consumption CMOS technology, improving energy efficiency and prolonging battery life.

Terminal Form: GULL WING

Facilitates easy soldering and connection to printed circuit boards, ensuring robust and reliable connections.

Maximum Supply Current: 311.6 mA

Operates within a moderate current range, reducing power consumption and heat generation.

Nominal Supply Voltage: 3.3 V

Maintains stable operation at the nominal voltage level, ensuring consistent performance and reliability.

PWM Channels: YES

Supports pulse width modulation for precise control of analog signals and efficient power management.

ROM Programmability: FLASH

Allows for reprogramming of the ROM, enabling firmware updates and customization without replacing the hardware.

Terminal Pitch: 0.5 mm

Offers fine pitch for compact PCB layouts, optimizing space utilization and enabling high-density designs.

Speed: 120 rpm

Capable of processing commands and data at a high speed, ensuring responsive and real-time performance.

No. of I/O Lines: 16

Provides multiple input/output lines for interfacing with external devices and peripherals, enhancing versatility and flexibility.

Technical Specifications

Microcontrollers SPC564L54L3CBOQY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

CPU Family:

SPC56

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

64

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

16

No. of Terminals:

100

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

786432

ROM Programmability:

FLASH

Speed:

120 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

311.6 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC564L54L3CBOQY Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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