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SPC564L54L3BCOQY

STMicroelectronics

SPC564L54L3BCOQY by STMicroelectronics

SPC564L54L3BCOQY by STMicroelectronics is a 32-bit microcontroller with 64-bit external data bus width, operating at max 40 MHz. It features 98304 bytes of RAM, ADC and DMA channels for industrial applications requiring high-speed processing and control capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,662 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,662

-

-

-

-

Digiode

USA . 3,910 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,910

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-

-

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Anansix

USA . 2,793 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,793

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,802 parts In-Stock

1+ parts

$9.350

100+ parts

-

1k+ parts

-

10k+ parts

-

1,802

$9.350

-

-

-

AZTECH Wire

Italy . 368 parts In-Stock

1+ parts

$19.370

100+ parts

-

1k+ parts

-

10k+ parts

-

368

$19.370

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-

-

Microchip USA

USA . 2,249 parts In-Stock

1+ parts

$31.735

100+ parts

-

1k+ parts

-

10k+ parts

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2,249

$31.735

-

-

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IDEA Electronic Components Group

UK . 2,146 parts In-Stock

1+ parts

$32.134

100+ parts

-

1k+ parts

$28.920

10k+ parts

-

2,146

$32.134

-

$28.920

-

MKK Technologies

India . 2,107 parts In-Stock

1+ parts

$60.425

100+ parts

-

1k+ parts

-

10k+ parts

-

2,107

$60.425

-

-

-

DigiPath Technology Company

USA . 2,107 parts In-Stock

1+ parts

$60.425

100+ parts

-

1k+ parts

-

10k+ parts

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2,107

$60.425

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-

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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5,000

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Corphita

USA . 4,790 parts In-Stock

1+ parts

-

100+ parts

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4,790

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-

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Parana Technologies

USA . 803 parts In-Stock

1+ parts

-

100+ parts

$38.421

1k+ parts

-

10k+ parts

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803

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$38.421

-

-

Overview

STMicroelectronics presents the SPC564L54L3BCOQY microcontroller, a cutting-edge solution designed for a wide range of applications. With a reputation for excellence in manufacturing, STMicroelectronics delivers top-quality products that guarantee reliability and performance. This versatile microcontroller offers customers unparalleled value, benefits, and advantages, making it the ideal choice for your next project. Explore the endless possibilities with the SPC564L54L3BCOQY and experience the difference that STMicroelectronics can bring to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller package easy to handle and resistant to physical damage.

Maximum Supply Voltage: 3.63 V

The higher maximum supply voltage allows for flexibility in power supply options, ensuring compatibility with a wide range of systems.

Bit Size: 32

A 32-bit architecture provides enhanced processing power and performance, making the microcontroller suitable for complex applications.

ADC Channels: YES

The presence of Analog-to-Digital Converter (ADC) channels enables the microcontroller to accurately convert analog signals to digital data, expanding its functionality.

RAM Bytes: 98304

With a large RAM capacity, the microcontroller can efficiently store and access data during operation, enhancing overall speed and performance.

Speed: 80 rpm

The specified speed of 80 rpm indicates the microcontroller's capability to handle tasks at a fast rate, making it suitable for time-sensitive applications.

Technical Specifications

Microcontrollers SPC564L54L3BCOQY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

CPU Family:

SPC56

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

64

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

16

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

786432

ROM Programmability:

FLASH

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

279 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC564L54L3BCOQY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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