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MSC1000M

STMicroelectronics

MSC1000M by STMicroelectronics

STMicroelectronics' MSC1000M is a NPN BJT transistor with hFE of 15, IC of 0.3A, and VCE of 20V. Ideal for L Band applications, it's a single configuration amplifier in a plastic/epoxy package with flange mount style. Operating up to 200 °C, it has radial terminals and emitter case connection.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,149 parts In-Stock

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4,149

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Digiode

USA . 2,468 parts In-Stock

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2,468

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Anansix

USA . 948 parts In-Stock

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948

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 28 parts In-Stock

1+ parts

$0.964

100+ parts

-

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$0.868

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28

$0.964

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$0.868

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MKK Technologies

India . 573 parts In-Stock

1+ parts

$1.813

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573

$1.813

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DigiPath Technology Company

USA . 573 parts In-Stock

1+ parts

$1.813

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573

$1.813

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Corphita

USA . 1,802 parts In-Stock

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1,802

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Parana Technologies

USA . 887 parts In-Stock

1+ parts

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$1.153

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887

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$1.153

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Overview

Experience the superior performance and reliability of the MSC1000M RF Small Signal Bipolar Junction Transistor by STMicroelectronics. With a reputation for excellence in semiconductor technology, STMicroelectronics delivers a high-quality product that is perfect for amplifier applications in the L Band frequency range. Offering a single NPN configuration with a flat terminal form, this transistor provides customers with a cost-effective solution that meets their needs for efficient signal processing. Trust STMicroelectronics to provide you with the best-in-class products for your electronic design projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide good insulation and thermal properties, making the transistor reliable and durable.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification circuits and offer good performance characteristics.

Configuration: SINGLE

Single configuration simplifies circuit design and integration, making it easier to work with.

Transistor Application: AMPLIFIER

Designed specifically for amplification applications, ensuring optimal performance in such circuits.

Package Shape: ROUND

Round package shape allows for easy mounting and integration into different types of circuits.

Terminal Form: FLAT

Flat terminals provide a reliable connection and make it easy to solder or connect the transistor in a circuit.

Highest Frequency Band: L BAND

Designed for use in the L band frequency range, making it suitable for a variety of RF applications within this range.

No. of Terminals: 2

Having only 2 terminals simplifies the circuit layout and reduces the chances of errors in connection.

Package Style (Meter): FLANGE MOUNT

Flange mount package style allows for easy and secure mounting of the transistor in various configurations.

Minimum DC Current Gain (hFE): 15

With a minimum DC current gain of 15, this transistor ensures stable and consistent amplification performance.

Maximum Operating Temperature: 200 °C

Can safely operate in a wide temperature range up to 200 °C, suitable for various environments and applications.

Maximum Collector-Emitter Voltage: 20 V

With a maximum collector-emitter voltage of 20V, this transistor can handle moderate voltage levels in a circuit.

Transistor Element Material: SILICON

Silicon transistors offer good performance characteristics and are widely used in electronics for their reliability.

Maximum Collector Current (IC): 0.3 A

With a maximum collector current of 0.3A, this transistor can handle moderate current levels in an amplification circuit.

Terminal Position: RADIAL

Radial terminal position allows for easy connection and integration into various circuit layouts.

Case Connection: EMITTER

Emitter case connection simplifies the circuit design and ensures proper grounding for optimal performance.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) MSC1000M attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

EMITTER

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

20 V

Configuration:

Minimum DC Current Gain (hFE):

15

Highest Frequency Band:

L BAND

JESD-30 Code:

O-PRFM-F2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

200 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

NPN

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Form:

FLAT

Terminal Position:

RADIAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

MSC1000M Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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